Rhenium [Re] as principal constituent

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H01L2224/13483

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13483Rhenium [Re] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,812,549
- Issue date Nov 2, 2004
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and fabricating method thereof, semiconductor device a...
- Patent number 6,596,634
- Issue date Jul 22, 2003
- Seiko Epson Corporation
- Kazushige Umetsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20030060000
- Publication date Mar 27, 2003
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and fabricating method thereof, semiconductor device a...
- Publication number 20020127839
- Publication date Sep 12, 2002
- SEIKO EPSON CORPORATION
- Kazushige Umetsu
- H01 - BASIC ELECTRIC ELEMENTS