Rhenium (Re) as principal constituent

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CPC
H01L2224/48683

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48683Rhenium (Re) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
- Publication number 20070026631
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS