Rhenium [Re] as principal constituent

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CPC
H01L2224/29183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/29183Rhenium [Re] as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Method of transferring and bonding an array of micro devices
- Patent number 9,773,750
- Issue date Sep 26, 2017
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microcircuit package having ductile layer
- Patent number 7,679,185
- Issue date Mar 16, 2010
- Interplex QLP, Inc.
- Michael A. Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF TRANSFERRING AND BONDING AN ARRAY OF MICRO DEVICES
- Publication number 20130210194
- Publication date Aug 15, 2013
- LUXVUE TECHNOLOGY CORPORATION
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microcircuit package having ductile layer
- Publication number 20080128908
- Publication date Jun 5, 2008
- QUANTUM LEAP PACKAGING, INC.
- Michael A. Zimmerman
- H01 - BASIC ELECTRIC ELEMENTS