Rhodium [Rh] as principal constituent

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H01L2224/05173

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05173Rhodium [Rh] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 10,707,089
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,600,757
- Issue date Mar 24, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,269,765
- Issue date Apr 23, 2019
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of filling probe indentations in contact pads
- Patent number 10,186,463
- Issue date Jan 22, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 9,607,954
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor package and manufacturing method thereof
- Patent number 9,349,611
- Issue date May 24, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pad with indentation
- Patent number 9,275,962
- Issue date Mar 1, 2016
- STMicroelectronics S.R.L.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL under bump for elect...
- Patent number 9,142,522
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a stacking element
- Patent number 8,405,213
- Issue date Mar 26, 2013
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,063,489
- Issue date Nov 22, 2011
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,004,092
- Issue date Aug 23, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,759,177
- Issue date Jul 20, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 7,468,545
- Issue date Dec 23, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 7,397,121
- Issue date Jul 8, 2008
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240234354
- Publication date Jul 11, 2024
- nD-HI Technologies Lab, Inc.
- Ho-Ming TONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20200303202
- Publication date Sep 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package
- Publication number 20200212007
- Publication date Jul 2, 2020
- Iou Ming Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...
- Publication number 20190304796
- Publication date Oct 3, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sebastian Meier
- G01 - MEASURING TESTING
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190131510
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COMPONENT BUMP METALLIZATION
- Publication number 20190103542
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20170040267
- Publication date Feb 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Akira YAJlMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130171774
- Publication date Jul 4, 2013
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Under Bump for Elect...
- Publication number 20130134580
- Publication date May 30, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING PROCESS OF INTEGRATED ELECTRONIC CIRCUITS AND CIRCUIT...
- Publication number 20110278568
- Publication date Nov 17, 2011
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110227220
- Publication date Sep 22, 2011
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100133688
- Publication date Jun 3, 2010
- RENESAS TECHNOLOGY CORP.
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...
- Publication number 20090057895
- Publication date Mar 5, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20080265413
- Publication date Oct 30, 2008
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION
- Publication number 20080067072
- Publication date Mar 20, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and system for depositing alloy composition
- Publication number 20080041727
- Publication date Feb 21, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor chip with post-passivation scheme formed over passiva...
- Publication number 20070096313
- Publication date May 3, 2007
- MEGIC Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070037337
- Publication date Feb 15, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post passivation structure for a semiconductor device and packaging...
- Publication number 20060291029
- Publication date Dec 28, 2006
- MEGIC Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Rhodium [Rh] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Dry etch process landing on metal oxide etch stop layer over metal...

Semiconductor integrated circuit device

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Dry etch process landing on metal oxide etch stop layer over metal...

Two-component bump metallization

Two-component bump metallization

Semiconductor package

Semiconductor chip mounted on a packaging substrate

Semiconductor package

Method of filling probe indentations in contact pads

Method of manufacturing semiconductor device and semiconductor device

Electrode connection structure and electrode connection method

Semiconductor integrated circuit device

Stackable semiconductor package and manufacturing method thereof

Probe pad with indentation

Semiconductor device and method of forming RDL under bump for elect...

Power semiconductor devices

Post passivation structure for a semiconductor device and packaging...

Semiconductor package including a stacking element

Semiconductor chip with post-passivation scheme formed over passiva...

Semiconductor integrated circuit device

Semiconductor chip with post-passivation scheme formed over passiva...

Manufacturing method of semiconductor device

Post passivation structure for a semiconductor device and packaging...

Semiconductor chip with post-passivation scheme formed over passiva...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

Semiconductor Package

DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL...

TWO-COMPONENT BUMP METALLIZATION

TWO-COMPONENT BUMP METALLIZATION

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR DEVICES

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method of Forming RDL Under Bump for Elect...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MANUFACTURING PROCESS OF INTEGRATED ELECTRONIC CIRCUITS AND CIRCUIT...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION

Method and system for depositing alloy composition

Semiconductor chip with post-passivation scheme formed over passiva...

Manufacturing method of semiconductor device

Post passivation structure for a semiconductor device and packaging...

Micromechanical device contact terminals free of particle generation