Rhodium [Rh] as principal constituent

Follow

Industry

CPC
H01L2224/83473

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/83473Rhodium [Rh] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Conductive paste for bonding
- Patent number 10,756,047
- Issue date Aug 25, 2020
- E I du Pont de Nemours and Company
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a method for manufacturing a chip package
- Patent number 8,841,768
- Issue date Sep 23, 2014
- Infineon Technologies AG
- Carsten Von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Conductive Paste For Bonding
- Publication number 20180102341
- Publication date Apr 12, 2018
- E I DU PONT DE NEMOURS AND COMPANY
- Takuya Konno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and Method for Producing an Electronic Device
- Publication number 20170271295
- Publication date Sep 21, 2017
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A METHOD FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20140021610
- Publication date Jan 23, 2014
- INFINEON TECHNOLOGIES AG
- Carsten VON KOBLINSKI
- H01 - BASIC ELECTRIC ELEMENTS