Rhodium (Rh) as principal constituent

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CPC
H01L2224/48873

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48873Rhodium (Rh) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electrode connection structure and electrode connection method
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- Waseda University
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Information Patent Grant
Wire bonding method for preventing polymer cracking
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Information Patent Grant
Semiconductor chip and method for fabricating the same
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- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
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- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
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Information Patent Grant
Chip structure with redistribution traces
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- Issue date Sep 16, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
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- Issue date Dec 12, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
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Information Patent Grant
Aluminum leadframes for semiconductor devices and method of fabrica...
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- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum leadframes with two nickel layers
- Patent number 6,747,343
- Issue date Jun 8, 2004
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20080054457
- Publication date Mar 6, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH REDISTRIBUTION TRACES
- Publication number 20080012132
- Publication date Jan 17, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING
- Publication number 20070212869
- Publication date Sep 13, 2007
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20040188810
- Publication date Sep 30, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold spot plated leadframes for semiconductor devices and method of...
- Publication number 20040113241
- Publication date Jun 17, 2004
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Micromechanical device contact terminals free of particle generation
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- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20030107112
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- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...
- Publication number 20030011048
- Publication date Jan 16, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Rhodium (Rh) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrode connection structure and electrode connection method

Wire bonding method for preventing polymer cracking

Semiconductor chip and method for fabricating the same

Semiconductor chip and method for fabricating the same

Chip structure with redistribution traces

Gold spot plated leadframes for semiconductor devices and method of...

Aluminum leadframes for semiconductor devices and method of fabrica...

Aluminum leadframes with two nickel layers

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

CHIP STRUCTURE WITH REDISTRIBUTION TRACES

WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING

Aluminum leadframes for semiconductor devices and method of fabrica...

Gold spot plated leadframes for semiconductor devices and method of...

Micromechanical device contact terminals free of particle generation

Aluminum leadframes for semiconductor devices and method of fabrica...

SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...