Rhodium (Rh) as principal constituent

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CPC
H01L2224/48673

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48673Rhodium (Rh) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for preventing polymer cracking
- Patent number 8,344,524
- Issue date Jan 1, 2013
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,168,527
- Issue date May 1, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 7,582,966
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold spot plated leadframes for semiconductor devices and method of...
- Patent number 7,148,085
- Issue date Dec 12, 2006
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum leadframes for semiconductor devices and method of fabrica...
- Patent number 6,933,177
- Issue date Aug 23, 2005
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum leadframes with two nickel layers
- Patent number 6,747,343
- Issue date Jun 8, 2004
- Texas Instruments Incorporated
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20080054457
- Publication date Mar 6, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING
- Publication number 20070212869
- Publication date Sep 13, 2007
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
- Publication number 20070026631
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20040188810
- Publication date Sep 30, 2004
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gold spot plated leadframes for semiconductor devices and method of...
- Publication number 20040113241
- Publication date Jun 17, 2004
- Donald C. Abbott
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Micromechanical device contact terminals free of particle generation
- Publication number 20030107137
- Publication date Jun 12, 2003
- Roger J. Stierman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Aluminum leadframes for semiconductor devices and method of fabrica...
- Publication number 20030107112
- Publication date Jun 12, 2003
- John P. Tellkamp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...
- Publication number 20030011048
- Publication date Jan 16, 2003
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Rhodium (Rh) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal pad or metal bump over pad exposed by passivation layer

Wire bonding method for preventing polymer cracking

Semiconductor chip and method for fabricating the same

Semiconductor chip and method for fabricating the same

Gold spot plated leadframes for semiconductor devices and method of...

Aluminum leadframes for semiconductor devices and method of fabrica...

Aluminum leadframes with two nickel layers

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

WIRE BONDING METHOD FOR PREVENTING POLYMER CRACKING

METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER

Aluminum leadframes for semiconductor devices and method of fabrica...

Gold spot plated leadframes for semiconductor devices and method of...

Micromechanical device contact terminals free of particle generation

Aluminum leadframes for semiconductor devices and method of fabrica...

SEMICONDUCTOR CIRCUIT ASSEMBLY HAVING A PLATED LEADFRAME INCLUDING...