Rigid circuit boards or rigid supports of circuit boards locally made bendable

Industry

CPC
H05K1/0278

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0278Rigid circuit boards or rigid supports of circuit boards locally made bendable

Industries

Patents Grantslast 30 patents

Information Patent Grant
Aerosol provision device
- Patent number 12,127,595
- Issue date Oct 29, 2024
- NICOVENTURES TRADING LIMITED
- Thomas Paul Blandino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 12,120,815
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device includin...
- Patent number 12,101,874
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible package architecture concept in fanout
- Patent number 12,074,077
- Issue date Aug 27, 2024
- Apple Inc.
- Karthik Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor unit for vehicles
- Patent number 12,070,988
- Issue date Aug 27, 2024
- Valeo Schalter und Sensoren GmbH
- Bohuslav Coufal
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semi-flex component carrier with dielectric material having high el...
- Patent number 12,058,810
- Issue date Aug 6, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and optical device including same
- Patent number 12,028,594
- Issue date Jul 2, 2024
- LG Innotek Co., Ltd
- Jong Ha Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of manufacturing a three-dimensional electronic module havin...
- Patent number 11,974,399
- Issue date Apr 30, 2024
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting device having solid state light source on bendable pcb
- Patent number 11,913,610
- Issue date Feb 27, 2024
- SIGNIFY HOLDING B.V.
- Martinus Arnoldus Cornelis Heijmans
- F21 - LIGHTING
Information Patent Grant
Electronic device with near-field antenna operating through display
- Patent number 11,894,600
- Issue date Feb 6, 2024
- Apple Inc.
- Miroslav Samardzija
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board
- Patent number 11,770,894
- Issue date Sep 26, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hiroki Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems for shielding bent signal lines
- Patent number 11,696,390
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Jeahyeong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical assembly
- Patent number 11,683,569
- Issue date Jun 20, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sung Han Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Component carrier with improved bending performance
- Patent number 11,672,079
- Issue date Jun 6, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 11,665,822
- Issue date May 30, 2023
- Japan Display Inc.
- Youhei Iwai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module and optical device including same
- Patent number 11,665,414
- Issue date May 30, 2023
- LG Innotek Co., Ltd
- Jong Ha Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit carrier for a battery system and battery system
- Patent number 11,596,059
- Issue date Feb 28, 2023
- Samsung SDI Co., Ltd.
- Peter Kurcik
- G01 - MEASURING TESTING
Information Patent Grant
Sensor component, pre-assembly arrangement for a sensor component,...
- Patent number 11,536,594
- Issue date Dec 27, 2022
- Vitesco Technologies Germany GmbH
- Jürgen Rietsch
- G01 - MEASURING TESTING
Information Patent Grant
Electronic circuit and circuit board
- Patent number 11,497,113
- Issue date Nov 8, 2022
- FUJIFILM Business Innovation Corp.
- Daisuke Horikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor bridge and electronic device
- Patent number 11,497,114
- Issue date Nov 8, 2022
- Murata Manufacturing Co., Ltd.
- Takuya Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and antenna module comprising the same
- Patent number 11,432,396
- Issue date Aug 30, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pop-up laminate structures with integrated electronics
- Patent number 11,419,693
- Issue date Aug 23, 2022
- President and Fellows of Harvard College
- Joshua B. Gafford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic circuit board and electronic circuit device
- Patent number 11,419,208
- Issue date Aug 16, 2022
- Hitachi Astemo, Ltd.
- Kumiko Yoshinaga
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Resin multilayer substrate and electronic device
- Patent number 11,406,013
- Issue date Aug 2, 2022
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Watch incorporating car key
- Patent number 11,394,418
- Issue date Jul 19, 2022
- Armour Surveillance Security Equipment and Technology Ltd.
- Richard Dinan
- B60 - VEHICLES IN GENERAL
Information Patent Grant
High connector count mating compliance
- Patent number 11,381,017
- Issue date Jul 5, 2022
- Hewlett Packard Enterprise Development LP
- John Franz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line cable including an unbendable superimposed layer...
- Patent number 11,374,299
- Issue date Jun 28, 2022
- AAC Technologies Pte. Ltd.
- Yue Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAMERA MODULE AND OPTICAL DEVICE INCLUDING SAME
- Publication number 20240314412
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Jong Ha Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Easily Curved LED Display Module
- Publication number 20240304117
- Publication date Sep 12, 2024
- DESIGNLED TECHNOLOGY CORP.
- Ligang ZHAO
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
IMAGE SENSOR ASSEMBLY
- Publication number 20240250099
- Publication date Jul 25, 2024
- ZF Friedrichshafen AG
- Thomas E. Blake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CARRIER ARRANGEMENT
- Publication number 20240224417
- Publication date Jul 4, 2024
- Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240206053
- Publication date Jun 20, 2024
- Nitto Denko Corporation
- Takahiro IKEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY APPARATUS AND LAMP ASSEMBLY INCLUDING THE SAME
- Publication number 20240172365
- Publication date May 23, 2024
- HYUNDAI MOBIS CO., LTD.
- Sae Jun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROBOT DEVICE, SURGICAL MANIPULATOR, AND SYSTEM
- Publication number 20240152597
- Publication date May 9, 2024
- SONY GROUP CORPORATION
- HIROYUKI SUZUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Device With Near-Field Antenna Operating Through Display
- Publication number 20240097309
- Publication date Mar 21, 2024
- Apple Inc.
- Miroslav Samardzija
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD
- Publication number 20240049396
- Publication date Feb 8, 2024
- TRIPOD (WUXI) ELECTRONIC CO., LTD.
- Cheng Ming LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT STRUCTURE FOR HOT-PRESS BONDING
- Publication number 20230422405
- Publication date Dec 28, 2023
- SuperC-Touch Corporation
- Hsiang-Yu LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-SLOT PCIE CARD WITH EXPANDED MEMORY
- Publication number 20230411882
- Publication date Dec 21, 2023
- SMART Modular Technologies, Inc.
- JINYING SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING FOR AN ELECTRONIC CIRCUIT WHICH IS ARRANGED ON A PRINTED CI...
- Publication number 20230363095
- Publication date Nov 9, 2023
- Continental Automotive Technologies GmbH
- Adrian Homutescu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING ELECTRONIC DEVICE
- Publication number 20230300995
- Publication date Sep 21, 2023
- EPEC OY
- Tuomo YLI-TAIPALUS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D PRINTED ATTACHMENT DEVICES FOR ELECTRONICS
- Publication number 20230262886
- Publication date Aug 17, 2023
- Accenture Global Solutions Limited
- Mark Benjamin Greenspan
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CAMERA MODULE AND OPTICAL DEVICE INCLUDING SAME
- Publication number 20230254557
- Publication date Aug 10, 2023
- LG Innotek Co., Ltd.
- Jong Ha Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HOB DEVICE
- Publication number 20230225019
- Publication date Jul 13, 2023
- BSH HAUSGERÄTE GMBH
- Jorge Felices Betran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC PACKAGE USING THE SAME
- Publication number 20230189435
- Publication date Jun 15, 2023
- First Hi-tec Enterprise Co.,Ltd.
- Min-Lin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier
- Publication number 20230180383
- Publication date Jun 8, 2023
- AT&S (China) Co. Ltd.
- Nick Xin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVIN...
- Publication number 20230143909
- Publication date May 11, 2023
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR WINDOW MODULE AND METHOD OF MANUFACTURING WINDOW MODULE...
- Publication number 20230124699
- Publication date Apr 20, 2023
- SAMSUNG DISPLAY CO., LTD.
- SUNGHOON KIM
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MODULE AND POWER MODULE FOR TRANSFORMER
- Publication number 20230040151
- Publication date Feb 9, 2023
- LG Innotek Co., Ltd.
- Soo San KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20230035851
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Eunseok HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BENDABLE PCB WITH HEATSINK FUNCTION
- Publication number 20220390076
- Publication date Dec 8, 2022
- SIGNIFY HOLDING B.V.
- MARTINUS ARNOLDUS CORNELIS HEIJMANS
- F21 - LIGHTING
Information Patent Application
Pop-Up Laminate Structures with Integrated Electronics
- Publication number 20220361974
- Publication date Nov 17, 2022
- President and Fellows of Harvard College
- Joshua B. Gafford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC CIRCUIT AND CIRCUIT BOARD
- Publication number 20220312582
- Publication date Sep 29, 2022
- FUJIFILM Business Innovation Corp.
- Daisuke HORIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL UNIT
- Publication number 20220248529
- Publication date Aug 4, 2022
- JATCO Ltd
- Yusuke SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY COMPRISING A CIRCUIT CARRIER AND A HEAT SINK
- Publication number 20220210908
- Publication date Jun 30, 2022
- HELLA GmbH & Co. KGaA
- Christopher Peron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SENSOR UNIT FOR VEHICLES
- Publication number 20220194172
- Publication date Jun 23, 2022
- VALEO Schalter und Sensoren GmbH
- Bohuslav Coufal
- B60 - VEHICLES IN GENERAL
Information Patent Application
AEROSOL PROVISION DEVICE
- Publication number 20220183369
- Publication date Jun 16, 2022
- Nicoventures Trading Limited
- Thomas Paul BLANDINO
- A24 - TOBACCO CIGARS CIGARETTES SMOKERS' REQUISITES

Rigid circuit boards or rigid supports of circuit boards locally made bendable

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Aerosol provision device

Multilayer substrate

Bent laminated printed circuit board

Rigid flexible printed circuit board and electronic device includin...

Flexible package architecture concept in fanout

Sensor unit for vehicles

Semi-flex component carrier with dielectric material having high el...

Laminated component carrier with a thermoplastic structure

Camera module and optical device including same

Method of manufacturing a three-dimensional electronic module havin...

Lighting device having solid state light source on bendable pcb

Electronic device with near-field antenna operating through display

Printed circuit board

Systems for shielding bent signal lines

Optical assembly

Component carrier with improved bending performance

Electronic device

Camera module and optical device including same

Circuit carrier for a battery system and battery system

Sensor component, pre-assembly arrangement for a sensor component,...

Electronic circuit and circuit board

Inductor bridge and electronic device

Laminated component carrier with a thermoplastic structure

Printed circuit board and antenna module comprising the same

Pop-up laminate structures with integrated electronics

Electronic circuit board and electronic circuit device

Resin multilayer substrate and electronic device

Watch incorporating car key

High connector count mating compliance

Transmission line cable including an unbendable superimposed layer...

Patents Applicationslast 30 patents

CAMERA MODULE AND OPTICAL DEVICE INCLUDING SAME

Easily Curved LED Display Module

IMAGE SENSOR ASSEMBLY

METHOD FOR PRODUCING A CARRIER ARRANGEMENT

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

POWER SUPPLY APPARATUS AND LAMP ASSEMBLY INCLUDING THE SAME

ROBOT DEVICE, SURGICAL MANIPULATOR, AND SYSTEM

Electronic Device With Near-Field Antenna Operating Through Display

METHOD FOR MANUFACTURING SEMI-FLEX PRINTED CIRCUIT BOARD

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

SINGLE-SLOT PCIE CARD WITH EXPANDED MEMORY

HOUSING FOR AN ELECTRONIC CIRCUIT WHICH IS ARRANGED ON A PRINTED CI...

ELECTRONIC DEVICE AND METHOD FOR FORMING ELECTRONIC DEVICE

3D PRINTED ATTACHMENT DEVICES FOR ELECTRONICS

CAMERA MODULE AND OPTICAL DEVICE INCLUDING SAME

HOB DEVICE

CIRCUIT BOARD AND ELECTRONIC PACKAGE USING THE SAME

Component Carrier

METHOD OF MANUFACTURING A THREE-DIMENSIONAL ELECTRONIC MODULE HAVIN...

MEMBER FOR WINDOW MODULE AND METHOD OF MANUFACTURING WINDOW MODULE...

Laminated Component Carrier With a Thermoplastic Structure

SUBSTRATE MODULE AND POWER MODULE FOR TRANSFORMER

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

BENDABLE PCB WITH HEATSINK FUNCTION

Pop-Up Laminate Structures with Integrated Electronics

ELECTRONIC CIRCUIT AND CIRCUIT BOARD

CONTROL UNIT

ASSEMBLY COMPRISING A CIRCUIT CARRIER AND A HEAT SINK

SENSOR UNIT FOR VEHICLES

AEROSOL PROVISION DEVICE