Rotating or turning the PCB in a continuous manner

Industry

CPC
H05K2203/1554

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1554Rotating or turning the PCB in a continuous manner

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,963,306
- Issue date Apr 16, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing printed circuit boards
- Patent number 11,917,767
- Issue date Feb 27, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for connecting stacked circuit boards
- Patent number 11,483,938
- Issue date Oct 25, 2022
- Avary Holding (Shenzhen) Co., Limited.
- Rui-Wu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate side-deposition apparatus
- Patent number 10,964,509
- Issue date Mar 30, 2021
- TETOS Co., Ltd.
- Kun Ho Song
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component mounting apparatus and component mounting method
- Patent number 10,766,073
- Issue date Sep 8, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoichi Makino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating method
- Patent number 9,730,337
- Issue date Aug 8, 2017
- C. Uyemura & Co., Ltd.
- Toshihisa Isono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 9,596,766
- Issue date Mar 14, 2017
- Intel Corporation
- David N. Shykind
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotary conveying equipment for exposing substrate
- Patent number 9,445,505
- Issue date Sep 13, 2016
- Wei-Lin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for adhering solder powder and method for adhering solder...
- Patent number 8,752,754
- Issue date Jun 17, 2014
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 8,673,391
- Issue date Mar 18, 2014
- Intel Corporation
- David Shykind
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 8,415,002
- Issue date Apr 9, 2013
- Intel Corporation
- James A. McCall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-tamper mesh
- Patent number 8,399,781
- Issue date Mar 19, 2013
- Teledyne Technologies Incorporated
- Cuong V. Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for applying electronic circuits to curved sur...
- Patent number 8,371,241
- Issue date Feb 12, 2013
- Max Levy Autograph, Inc.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotating device
- Patent number 8,360,228
- Issue date Jan 29, 2013
- Shenzhen Futaihong Precision Industry Co., Ltd.
- Cha-Biao You
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for manufacturing printed circuit board
- Patent number 8,268,537
- Issue date Sep 18, 2012
- Zhen Ding Technology Co., Ltd.
- Pai-Hung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming an anti-tamper mesh
- Patent number 8,240,038
- Issue date Aug 14, 2012
- Teledyne Technologies Incorporated
- Cuong V. Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying electronic circuits to curved surfaces
- Patent number 8,056,474
- Issue date Nov 15, 2011
- Max Levy Autograph, Inc.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anti-tamper mesh
- Patent number 7,947,911
- Issue date May 24, 2011
- Teledyne Technologies Incorporated
- Cuong V. Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip package and method for manufacturing the same
- Patent number 7,859,108
- Issue date Dec 28, 2010
- Hynix Semiconductor Inc.
- Woong Sun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Centrifugal method for filing high aspect ratio blind mirco vias po...
- Patent number 7,815,968
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for applying electronic circuits to curved surfaces
- Patent number 7,743,702
- Issue date Jun 29, 2010
- Max Levy Autograph, Inc.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a circuit board
- Patent number 7,676,917
- Issue date Mar 16, 2010
- Intel Corporation
- James A. McCall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming an anti-tamper pattern
- Patent number 7,640,658
- Issue date Jan 5, 2010
- Teledyne Technologies Incorporated
- Cuong V. Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board design
- Patent number 7,459,200
- Issue date Dec 2, 2008
- Intel Corporation
- James A. McCall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Patent number 7,452,568
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Rinsing processes and equipment
- Patent number 7,364,625
- Issue date Apr 29, 2008
- FSI International, Inc.
- Kurt K. Christenson
- B08 - CLEANING
Information Patent Grant
Manufacturing circuit boards dipped in molten solder
- Patent number 5,683,743
- Issue date Nov 4, 1997
- International Business Machines Corporation
- Peter Michael Banks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder application to a circuit board
- Patent number 5,637,833
- Issue date Jun 10, 1997
- International Business Machines Corporation
- Peter M. Banks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for application to a circuit board
- Patent number 5,637,149
- Issue date Jun 10, 1997
- International Business Machines Corporation
- Peter M. Banks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder application to a circuit board
- Patent number 5,520,967
- Issue date May 28, 1996
- International Business Machines Corporation
- Peter M. Banks
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PLATING APPARATUS
- Publication number 20240314936
- Publication date Sep 19, 2024
- EBARA CORPORATION
- Tsubasa ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20240155773
- Publication date May 9, 2024
- Gebr. Schmid GmbH
- Christian Schmid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...
- Publication number 20230269881
- Publication date Aug 24, 2023
- DEVICEENG CO., LTD
- Taek Youb LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARDS
- Publication number 20200221579
- Publication date Jul 9, 2020
- Gebr. Schmid GmbH
- Christian Schmid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE SIDE-DEPOSITION APPARATUS
- Publication number 20200043696
- Publication date Feb 6, 2020
- TETOS Co., Ltd.
- Kun Ho SONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD
- Publication number 20140150257
- Publication date Jun 5, 2014
- David Shykind
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING METHOD
- Publication number 20140120245
- Publication date May 1, 2014
- C. Uyemura & Co., Ltd.
- Toshihisa Isono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATIN...
- Publication number 20140099433
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Seung NAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Rotary Conveying Equipment for Exposing Substrate
- Publication number 20140015183
- Publication date Jan 16, 2014
- APONE TECHNOLOGY LTD.
- WEI-LIN LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INKJET PRINTER FOR PRINTING ON A THREE-DIMENSIONAL OBJECT AND RELAT...
- Publication number 20130342592
- Publication date Dec 26, 2013
- Apple Inc.
- Nicholas MERZ
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD
- Publication number 20130227838
- Publication date Sep 5, 2013
- David Shykind
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOTH SIDES EXPOSURE SYSTEM
- Publication number 20130183027
- Publication date Jul 18, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Young Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER...
- Publication number 20120292377
- Publication date Nov 22, 2012
- Showa Denko K.K.
- Takashi Shoji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD SUBSTRATE
- Publication number 20120211267
- Publication date Aug 23, 2012
- ZHEN DING TECHNOLOGY CO., LTD.
- PAI-HUNG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR ELECTRONIC CIRCUIT MANUFACTURE
- Publication number 20110056074
- Publication date Mar 10, 2011
- RENISHAW PLC
- Kevyn Barry Jonas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR FLUID DISPENSING
- Publication number 20100327014
- Publication date Dec 30, 2010
- RENISHAW PLC
- Kevyn Barry Jonas
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ROTATING DEVICE
- Publication number 20100278638
- Publication date Nov 4, 2010
- SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- CHA-BIAO YOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...
- Publication number 20100215843
- Publication date Aug 26, 2010
- MAX LEVY AUTOGRAPH, INC.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...
- Publication number 20100206188
- Publication date Aug 19, 2010
- MAX LEVY AUTOGRAPH, INC.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...
- Publication number 20100206227
- Publication date Aug 19, 2010
- MAX LEVY AUTOGRAPH, INC.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a circuit board
- Publication number 20100170087
- Publication date Jul 8, 2010
- James A. McCALL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FILLING THROUGH HOLE OR NON-THROUGH HOLE FORMED ON BOARD...
- Publication number 20100031501
- Publication date Feb 11, 2010
- Napra Co., Ltd.
- Shigenobu SEKINE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD SUBSTRATE AND METHOD FOR MANUFACTURING PRINTE...
- Publication number 20090260867
- Publication date Oct 22, 2009
- FOXCONN ADVANCED TECHNOLOGY INC.
- PAI-HUNG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING METAL LINE EMBEDDED IN SUBSTRATE AND METHO...
- Publication number 20090181226
- Publication date Jul 16, 2009
- SAMSUNG ELECTRONICS CO., LTD.
- Hong-Long Ning
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB strip, PCB strip assembly device using the PCB strip, a method...
- Publication number 20090166061
- Publication date Jul 2, 2009
- Cheol-Joon Yoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20090140426
- Publication date Jun 4, 2009
- Woong Sun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...
- Publication number 20090032962
- Publication date Feb 5, 2009
- International Business Machines Corporation (Yorktown)
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit including conductive bumps
- Publication number 20080197493
- Publication date Aug 21, 2008
- Stefan Geyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...
- Publication number 20080028956
- Publication date Feb 7, 2008
- MAX LEVY AUTOGRAPH, INC.
- Donald C. Sedberry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board design
- Publication number 20070169341
- Publication date Jul 26, 2007
- James A. McCall
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Rotating or turning the PCB in a continuous manner

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus for manufacturing printed circuit boards

Apparatus for manufacturing printed circuit boards

Method for connecting stacked circuit boards

Substrate side-deposition apparatus

Component mounting apparatus and component mounting method

Plating method

Method of manufacturing a circuit board

Rotary conveying equipment for exposing substrate

Apparatus for adhering solder powder and method for adhering solder...

Method of manufacturing a circuit board

Method of manufacturing a circuit board

Anti-tamper mesh

Method and apparatus for applying electronic circuits to curved sur...

Rotating device

Method for manufacturing printed circuit board

Method for forming an anti-tamper mesh

Apparatus for applying electronic circuits to curved surfaces

Anti-tamper mesh

Flip chip package and method for manufacturing the same

Centrifugal method for filing high aspect ratio blind mirco vias po...

Method for applying electronic circuits to curved surfaces

Method of manufacturing a circuit board

Methods for forming an anti-tamper pattern

Circuit board design

Centrifugal method for filing high aspect ratio blind micro vias wi...

Rinsing processes and equipment

Manufacturing circuit boards dipped in molten solder

Solder application to a circuit board

Apparatus for application to a circuit board

Solder application to a circuit board

Patents Applicationslast 30 patents

PLATING APPARATUS

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS

DEVICE FOR ETCHING THE PERIPHERY EDGE OF A SUBSTRATE AND METHOD FOR...

METHOD, DEVICE, AND SYSTEM FOR MANUFACTURING PRINTED CIRCUIT BOARDS

SUBSTRATE SIDE-DEPOSITION APPARATUS

METHOD OF MANUFACTURING A CIRCUIT BOARD

PLATING METHOD

BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATIN...

Rotary Conveying Equipment for Exposing Substrate

INKJET PRINTER FOR PRINTING ON A THREE-DIMENSIONAL OBJECT AND RELAT...

METHOD OF MANUFACTURING A CIRCUIT BOARD

BOTH SIDES EXPOSURE SYSTEM

APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER...

PRINTED CIRCUIT BOARD SUBSTRATE

APPARATUS AND METHOD FOR ELECTRONIC CIRCUIT MANUFACTURE

APPARATUS AND METHOD FOR FLUID DISPENSING

ROTATING DEVICE

METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...

METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...

METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...

Method of manufacturing a circuit board

METHOD FOR FILLING THROUGH HOLE OR NON-THROUGH HOLE FORMED ON BOARD...

PRINTED CIRCUIT BOARD SUBSTRATE AND METHOD FOR MANUFACTURING PRINTE...

METHOD FOR MANUFACTURING METAL LINE EMBEDDED IN SUBSTRATE AND METHO...

PCB strip, PCB strip assembly device using the PCB strip, a method...

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...

Integrated circuit including conductive bumps

METHOD AND APPARATUS FOR APPLYING ELECTRONIC CIRCUITS TO CURVED SUR...

Circuit board design