TREA

Rotational mechanism

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  • CPC
  • H01L2224/77802
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/77802Rotational mechanism
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of using processing oven
    • Patent number 12,330,228
    • Issue date Jun 17, 2025
    • YIELD ENGINEERING SYSTEMS, INC.
    • Lei Jing
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents