Rotational mechanism

Industry

CPC
H01L2224/75822

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75822Rotational mechanism

Industries

Patents Grantslast 30 patents

Information Patent Grant
Alignment mechanism, chuck device, and bonder
- Patent number 11,462,428
- Issue date Oct 4, 2022
- Tazmo Co., Ltd.
- Masaaki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component handling device for removing components from a structured...
- Patent number 11,232,961
- Issue date Jan 25, 2022
- Muehlbauer GmbH & Co. KG
- Henri Junker
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bonding device
- Patent number 11,049,840
- Issue date Jun 29, 2021
- Osaka University
- Katsuaki Suganuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component handling system
- Patent number 10,804,123
- Issue date Oct 13, 2020
- Muehlbauer GmbH & Co. KG
- Henri Junker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch bonding apparatus and bonding method
- Patent number 10,763,235
- Issue date Sep 1, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding apparatus and bonding method
- Patent number 10,658,327
- Issue date May 19, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Tianming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically die-stacked bonder and method using the same
- Patent number 10,643,968
- Issue date May 5, 2020
- GALLANT MICRO. MACHNING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 10,568,245
- Issue date Feb 18, 2020
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Receiving system for components
- Patent number 10,529,601
- Issue date Jan 7, 2020
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component handling unit
- Patent number 10,497,590
- Issue date Dec 3, 2019
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically die-stacked bonder and method using the same
- Patent number 10,438,917
- Issue date Oct 8, 2019
- GALLANT MICRO. MACHINING CO., LTD.
- Tun-Chih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press fitting head and semiconductor manufacturing apparatus using...
- Patent number 10,388,625
- Issue date Aug 20, 2019
- J-DEVICES CORPORATION
- Minoru Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for self-adjustment of a component-handling devic...
- Patent number 10,347,514
- Issue date Jul 9, 2019
- Muehlbauer GmbH & Co. KG
- Konstantin Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic-component mounting apparatus
- Patent number 9,968,020
- Issue date May 8, 2018
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die mounting system and die mounting method
- Patent number 9,887,111
- Issue date Feb 6, 2018
- Fuji Machine Mfg. Co., Ltd.
- Yukinori Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for removing chip
- Patent number 9,881,893
- Issue date Jan 30, 2018
- BOE Technology Group Co., Ltd.
- Guangyuan Cai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, storage medium, bonding apparatus and bonding system
- Patent number 9,741,595
- Issue date Aug 22, 2017
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment systems and wafer bonding systems and methods
- Patent number 9,646,860
- Issue date May 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Xin-Hua Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting semiconductor chips
- Patent number 9,603,294
- Issue date Mar 21, 2017
- Esec AG
- Guido Suter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and bonding method
- Patent number 9,530,751
- Issue date Dec 27, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Kazuo Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for inspecting a semiconductor chip prior to b...
- Patent number 9,515,045
- Issue date Dec 6, 2016
- Kulicke and Soffa Die Bonding GmbH
- Andreas Marte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure transmitting device for bonding chips onto a substrate
- Patent number 9,305,813
- Issue date Apr 5, 2016
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed RFID circuit placement method and device
- Patent number 8,531,297
- Issue date Sep 10, 2013
- Avery Dennison Corporation
- Scott Wayne Ferguson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,091,764
- Issue date Jan 10, 2012
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a contact arrangement between a microelectr...
- Patent number 8,087,163
- Issue date Jan 3, 2012
- PAC Tech-Packaging Technologies GmbH
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD
- Publication number 20230011327
- Publication date Jan 12, 2023
- SATO HOLDINGS KABUSHIKI KAISHA
- Yoshimitsu MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND BONDING METHOD
- Publication number 20200144218
- Publication date May 7, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Tianming WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT HANDLING DEVICE FOR REMOVING COMPONENTS FROM A STRUCTURED...
- Publication number 20200035521
- Publication date Jan 30, 2020
- Muehlbauer GmbH & Co. KG
- Henri Junker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BATCH BONDING APPARATUS AND BONDING METHOD
- Publication number 20190385972
- Publication date Dec 19, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20190189587
- Publication date Jun 20, 2019
- OSAKA UNIVERSITY
- Katsuaki SUGANUMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT HANDLING UNIT
- Publication number 20190006211
- Publication date Jan 3, 2019
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...
- Publication number 20170347504
- Publication date Nov 30, 2017
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE MOUNTING SYSTEM AND DIE MOUNTING METHOD
- Publication number 20170140960
- Publication date May 18, 2017
- FUJI MACHINE MFG CO., LTD.
- Yukinori NAKAYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR REMOVING CHIP
- Publication number 20170110433
- Publication date Apr 20, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Guangyuan Cai
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING
- Publication number 20140154037
- Publication date Jun 5, 2014
- ORION SYSTEMS INTEGRATION PTE LTD
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20130340943
- Publication date Dec 26, 2013
- Tadashi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...
- Publication number 20130149817
- Publication date Jun 13, 2013
- Samsung Electronics Co., Ltd.
- Chang-Seong JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus For Mounting Semiconductor Chips
- Publication number 20130133188
- Publication date May 30, 2013
- ESEC AG
- Guido Suter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR CHIP PRIOR TO B...
- Publication number 20130025791
- Publication date Jan 31, 2013
- KULICKE & SOFFA DIE BONDING GMBH
- Andreas Marte
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR PICKING UP AND MOUNTING BARE DIES
- Publication number 20120210554
- Publication date Aug 23, 2012
- SAMSUNG TECHWIN CO., LTD.
- Jung-Il HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20100252615
- Publication date Oct 7, 2010
- Bondtech, Inc
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE
- Publication number 20100043203
- Publication date Feb 25, 2010
- Avery Dennison Corporation
- Scott Wayne FERGUSON
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ROTARY CHIP ATTACH
- Publication number 20090269882
- Publication date Oct 29, 2009
- Checkpoint Systems, Inc.
- Andre Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRO...
- Publication number 20090217515
- Publication date Sep 3, 2009
- HALLYS CORPORATION
- Hiroshi Aoyama
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic Component Mounting Method and Electronic Component Mount...
- Publication number 20090049687
- Publication date Feb 26, 2009
- Tsukasa Shiraishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT BETWEEN A MICROELECT...
- Publication number 20090032296
- Publication date Feb 5, 2009
- Ghassem Azdasht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining Method and Device Produced by this Method and Joining Unit
- Publication number 20080245843
- Publication date Oct 9, 2008
- BONDTECH INC.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Roll-to-roll fabricated light sheet and encapsulated semiconductor...
- Publication number 20080191220
- Publication date Aug 14, 2008
- Articulated Technologies, LLC
- John J. Daniels
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ROTARY CHIP ATTACH
- Publication number 20070114659
- Publication date May 24, 2007
- Checkpoint Systems, Inc.
- Andre Cote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC chip mounting method
- Publication number 20070020801
- Publication date Jan 25, 2007
- FUJITSU LIMITED
- Naoki Ishikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High-speed RFID circuit placement method and device
- Publication number 20060238345
- Publication date Oct 26, 2006
- Scott Wayne Ferguson
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Roll-to-roll fabricated light sheet and encapsulated semiconductor...
- Publication number 20050214963
- Publication date Sep 29, 2005
- John James Daniels
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Rotational mechanism

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alignment mechanism, chuck device, and bonder

Component handling device for removing components from a structured...

Bonding device

Component handling system

Mounting Method of a semiconductor device using a colored auxiliary...

Batch bonding apparatus and bonding method

Chip bonding apparatus and bonding method

Vertically die-stacked bonder and method using the same

Electronic-component mounting apparatus

Receiving system for components

Electronic component handling unit

Vertically die-stacked bonder and method using the same

Press fitting head and semiconductor manufacturing apparatus using...

Device and method for self-adjustment of a component-handling devic...

Apparatus and method for manufacturing semiconductor device

Electronic-component mounting apparatus

Die mounting system and die mounting method

Apparatus for removing chip

Bonding method, storage medium, bonding apparatus and bonding system

Substrate composite, method and device for bonding of substrates

Alignment systems and wafer bonding systems and methods

Apparatus for mounting semiconductor chips

Die bonder and bonding method

Method and apparatus for inspecting a semiconductor chip prior to b...

Pressure transmitting device for bonding chips onto a substrate

Method for device packaging

Joining method and device produced by this method and joining unit

High-speed RFID circuit placement method and device

Joining method and device produced by this method and joining unit

Method of manufacturing a contact arrangement between a microelectr...

Patents Applicationslast 30 patents

IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHOD

CHIP BONDING APPARATUS AND BONDING METHOD

COMPONENT HANDLING DEVICE FOR REMOVING COMPONENTS FROM A STRUCTURED...

BATCH BONDING APPARATUS AND BONDING METHOD

BONDING DEVICE

ELECTRONIC COMPONENT HANDLING UNIT

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

ELECTRONIC-COMPONENT MOUNTING APPARATUS AND ELECTRONIC-COMPONENT MO...

DIE MOUNTING SYSTEM AND DIE MOUNTING METHOD

APPARATUS FOR REMOVING CHIP

METHOD AND SYSTEMS FOR SEMICONDUCTOR CHIP PICK & TRANSFER AND BONDING

BONDING APPARATUS

FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...

Apparatus For Mounting Semiconductor Chips

METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR CHIP PRIOR TO B...

APPARATUS AND METHOD FOR PICKING UP AND MOUNTING BARE DIES

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

HIGH-SPEED RFID CIRCUIT PLACEMENT METHOD AND DEVICE

ROTARY CHIP ATTACH

ELECTRONIC COMPONENT PRODUCTION METHOD AND ELECTRONIC COMPONENT PRO...

Electronic Component Mounting Method and Electronic Component Mount...

METHOD FOR MANUFACTURING A CONTACT ARRANGEMENT BETWEEN A MICROELECT...

Joining Method and Device Produced by this Method and Joining Unit

Roll-to-roll fabricated light sheet and encapsulated semiconductor...

ROTARY CHIP ATTACH

IC chip mounting method

High-speed RFID circuit placement method and device

Roll-to-roll fabricated light sheet and encapsulated semiconductor...