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H01L2224/8117

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8117Rotational movements

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Patents Grantslast 30 patents

Information Patent Grant
Batch bonding apparatus and bonding method
- Patent number 10,763,235
- Issue date Sep 1, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for manufacturing semiconductor device
- Patent number 10,090,273
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Naoyuki Komuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for device packaging
- Patent number 9,120,169
- Issue date Sep 1, 2015
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for aligning a bonding tool of a die bonder
- Patent number 8,387,851
- Issue date Mar 5, 2013
- ASM Technology Singapore Pte. Ltd.
- Chung Sheung Yung
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING
- Publication number 20240178182
- Publication date May 30, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH BONDING APPARATUS AND BONDING METHOD
- Publication number 20190385972
- Publication date Dec 19, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Xiaoyu JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR POSITIONING USING NEAR FIELD TRANSDUCERS, PAR...
- Publication number 20170365497
- Publication date Dec 21, 2017
- Alan S. Edelstein
- G01 - MEASURING TESTING
Information Patent Application
FABRICATING METHODS OF SEMICONDUCTOR DEVICES AND PICK-UP APPARATUSE...
- Publication number 20130149817
- Publication date Jun 13, 2013
- Samsung Electronics Co., Ltd.
- Chang-Seong JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU MELT AND REFLOW PROCESS FOR FORMING FLIP-CHIP INTERCONNECTI...
- Publication number 20110287560
- Publication date Nov 24, 2011
- ORION SYSTEMS INTEGRATION PTE LTD
- Hwee Seng Chew
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR