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H01L2224/8517

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8517Rotational movements

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inclusion of chip elements in a sheathed wire
- Patent number 8,814,054
- Issue date Aug 26, 2014
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
Flexible semiconductor package apparatus having a responsive bendab...
- Patent number 8,618,656
- Issue date Dec 31, 2013
- Hynix Semiconductor Inc.
- Tac Keun Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible semiconductor package apparatus having a responsive bendab...
- Patent number 8,049,332
- Issue date Nov 1, 2011
- Hynix Semiconductor Inc.
- Tac Keun Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with wire bond inductor and method
- Patent number 7,227,240
- Issue date Jun 5, 2007
- Semiconductor Components Industries, LLC
- James Knapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic wire bonding using friction welding process
- Patent number 5,715,989
- Issue date Feb 10, 1998
- Texas Instruments Incorporated
- David R. Kee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INCLUSION OF CHIP ELEMENTS IN A SHEATHED WIRE
- Publication number 20130092742
- Publication date Apr 18, 2013
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean Brun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
- Publication number 20120013016
- Publication date Jan 19, 2012
- Tac Keun OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
- Publication number 20100109140
- Publication date May 6, 2010
- Tac Keun OH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with wire bond inductor and method
- Publication number 20050285262
- Publication date Dec 29, 2005
- James Knapp
- H01 - BASIC ELECTRIC ELEMENTS

Rotational movements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for fabricating wire bonding structure

Inclusion of chip elements in a sheathed wire

Flexible semiconductor package apparatus having a responsive bendab...

Flexible semiconductor package apparatus having a responsive bendab...

Semiconductor device with wire bond inductor and method

Microelectronic wire bonding using friction welding process

Patents Applicationslast 30 patents

INCLUSION OF CHIP ELEMENTS IN A SHEATHED WIRE

FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...

FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...

Semiconductor device with wire bond inductor and method