TREA

Rotational movements

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  • CPC
  • H01L2224/8515
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8515Rotational movements
Industries

Patents Grantslast 30 patents

  • Information Patent Grant

    Methods and apparatus for improved bonding
    • Patent number 10,050,009
    • Issue date Aug 14, 2018
    • Semiconductor Components Industries, LLC
    • Nobuhisa Onai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    METHODS AND APPARATUS FOR IMPROVED BONDING
    • Publication number 20170077061
    • Publication date Mar 16, 2017
    • Semiconductor Components Industries, LLC
    • Nobuhisa ONAI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR