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H01L2924/01037

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/01037Rubidium [Rb]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,424,176
- Issue date Aug 23, 2022
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 10,872,844
- Issue date Dec 22, 2020
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
White light devices using non-polar or semipolar gallium containing...
- Patent number RE47711
- Issue date Nov 5, 2019
- Soraa, Inc.
- James W. Raring
Information Patent Grant
Method for applying a bonding layer
- Patent number 10,438,925
- Issue date Oct 8, 2019
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 10,366,942
- Issue date Jul 30, 2019
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead, wiring member, package part, metal part provided with resin a...
- Patent number 9,960,325
- Issue date May 1, 2018
- Panasonic Corporation
- Takahiro Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vertical ballast technology for power HBT device
- Patent number 9,911,836
- Issue date Mar 6, 2018
- Qorvo US, Inc.
- Julio Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a bonding layer
- Patent number 9,627,349
- Issue date Apr 18, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Alkali silicate glass based coating and method for applying
- Patent number 9,565,758
- Issue date Feb 7, 2017
- Rockwell Collins, Inc.
- Nathan P. Lower
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 9,312,209
- Issue date Apr 12, 2016
- PS4 Luxco S.A.R.L.
- Kayoko Shibata
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and radio communication device
- Patent number 9,263,559
- Issue date Feb 16, 2016
- Murata Manufacturing Co., Ltd.
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device, method of adjusting the same and infor...
- Patent number 9,087,571
- Issue date Jul 21, 2015
- PS4 Luxco S.A.R.L.
- Hideyuki Yoko
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 9,032,350
- Issue date May 12, 2015
- PS4 Luxco S.A.R.L.
- Kayoko Shibata
- G11 - INFORMATION STORAGE
Information Patent Grant
Package systems having an opening in a substrate thereof and manufa...
- Patent number 9,000,578
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Pao Shu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and test method thereof
- Patent number 8,981,808
- Issue date Mar 17, 2015
- PS4 Luxco S.A.R.L.
- Naohisa Nishioka
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 8,970,019
- Issue date Mar 3, 2015
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
White light devices using non-polar or semipolar gallium containing...
- Patent number 8,956,894
- Issue date Feb 17, 2015
- Soraa, Inc.
- James W. Raring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead, wiring member, package part, metal part provided with resin a...
- Patent number 8,946,746
- Issue date Feb 3, 2015
- Panasonic Corporation
- Takahiro Fukunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing solution for CMP, and method for polishing substrate usin...
- Patent number 8,900,473
- Issue date Dec 2, 2014
- Hitachi Chemical Company, Ltd.
- Hisataka Minami
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and radio communication device
- Patent number 8,860,093
- Issue date Oct 14, 2014
- Murata Manufacturing Co., Ltd.
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making the same
- Patent number 8,853,836
- Issue date Oct 7, 2014
- Amkor Technology, Inc.
- Thomas P. Glenn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Isolated epitaxial modulation device
- Patent number 8,847,317
- Issue date Sep 30, 2014
- TriQuint Semiconductor, Inc.
- Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for the backside of flip-chip type semiconductor, dicing tape-...
- Patent number 8,841,757
- Issue date Sep 23, 2014
- Nitto Denko Corporation
- Daisuke Uenda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,839,161
- Issue date Sep 16, 2014
- PS4 Luxco S.A.R.L.
- Kayoko Shibata
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure and method for making same
- Patent number 8,786,085
- Issue date Jul 22, 2014
- Infineon Technologies AG
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220044987
- Publication date Feb 10, 2022
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20210074609
- Publication date Mar 11, 2021
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20190295928
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A BONDING LAYER
- Publication number 20160190092
- Publication date Jun 30, 2016
- EV GROUP E. THALLNER GMBH
- Markus WIMPLINGER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20140361406
- Publication date Dec 11, 2014
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140320203
- Publication date Oct 30, 2014
- Kayoko Shibata
- G11 - INFORMATION STORAGE
Information Patent Application
WHITE LIGHT DEVICES USING NON-POLAR OR SEMIPOLAR GALLIUM CONTAINING...
- Publication number 20140213001
- Publication date Jul 31, 2014
- Soraa, Inc.
- JAMES W. RARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING
- Publication number 20140102776
- Publication date Apr 17, 2014
- Rockwell Collins, Inc.
- Nathan P. Lower
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...
- Publication number 20140073127
- Publication date Mar 13, 2014
- Elpida Memory, Inc.
- Satoshi Itaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE, METHOD OF ADJUSTING THE SAME AND INFOR...
- Publication number 20140056086
- Publication date Feb 27, 2014
- Elpida Memory, Inc.
- Hideyuki Yoko
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130328188
- Publication date Dec 12, 2013
- Elpida Memory, Inc.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130309864
- Publication date Nov 21, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130273696
- Publication date Oct 17, 2013
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130251447
- Publication date Sep 26, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130234342
- Publication date Sep 12, 2013
- Elpida Memory, Inc.
- Kayoko Shibata
- G11 - INFORMATION STORAGE
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130216848
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...
- Publication number 20130175682
- Publication date Jul 11, 2013
- Elpida Memory, Inc.
- Satoshi Itaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Management Module and Method of Manufacture
- Publication number 20130175664
- Publication date Jul 11, 2013
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Application
ISOLATED EPITAXIAL MODULATION DEVICE
- Publication number 20130154008
- Publication date Jun 20, 2013
- Intersil Americas Inc.
- Yu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20130062770
- Publication date Mar 14, 2013
- Infineon Technologies AG
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE
- Publication number 20130026632
- Publication date Jan 31, 2013
- NEC Corporation
- Katsumi Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE
- Publication number 20120261799
- Publication date Oct 18, 2012
- Satoshi Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL BALLAST TECHNOLOGY FOR POWER HBT DEVICE
- Publication number 20120218047
- Publication date Aug 30, 2012
- RF Micro Devices, Inc.
- Julio Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
White Light Devices Using Non-polar or Semipolar Gallium Containing...
- Publication number 20120187371
- Publication date Jul 26, 2012
- Soraa, Inc.
- James W. Raring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120175762
- Publication date Jul 12, 2012
- RENESAS ELECTRONICS CORPORATION
- Toshiyuki HATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, DICING TAPE-...
- Publication number 20120126380
- Publication date May 24, 2012
- Daisuke UENDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
- Publication number 20120126381
- Publication date May 24, 2012
- Daisuke UENDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Rubidium [Rb]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with sealed semiconductor chip

Semiconductor device with sealed semiconductor chip

Modulated inductance module

Semiconductor device with sealed semiconductor chip

Power management module and method of manufacture

White light devices using non-polar or semipolar gallium containing...

Method for applying a bonding layer

Semiconductor device with sealed semiconductor chip

Lead, wiring member, package part, metal part provided with resin a...

Vertical ballast technology for power HBT device

Electrical components and method of manufacture

Epoxy resin composition for encapsulating semiconductor device and...

Method for applying a bonding layer

Alkali silicate glass based coating and method for applying

Semiconductor device

Semiconductor device and radio communication device

Semiconductor memory device, method of adjusting the same and infor...

Semiconductor device

Package systems having an opening in a substrate thereof and manufa...

Semiconductor device and test method thereof

Semiconductor device with sealed semiconductor chip

White light devices using non-polar or semipolar gallium containing...

Lead, wiring member, package part, metal part provided with resin a...

Polishing solution for CMP, and method for polishing substrate usin...

Semiconductor device and radio communication device

Integrated circuit package and method of making the same

Isolated epitaxial modulation device

Film for the backside of flip-chip type semiconductor, dicing tape-...

Semiconductor device

Semiconductor structure and method for making same

Patents Applicationslast 30 patents

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

METHOD FOR APPLYING A BONDING LAYER

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

SEMICONDUCTOR DEVICE

WHITE LIGHT DEVICES USING NON-POLAR OR SEMIPOLAR GALLIUM CONTAINING...

ALKALI SILICATE GLASS BASED COATING AND METHOD FOR APPLYING

SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...

SEMICONDUCTOR MEMORY DEVICE, METHOD OF ADJUSTING THE SAME AND INFOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

SEMICONDUCTOR DEVICE

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING SYSTEM INCLUDING TH...

Power Management Module and Method of Manufacture

ISOLATED EPITAXIAL MODULATION DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE

VERTICAL BALLAST TECHNOLOGY FOR POWER HBT DEVICE

White Light Devices Using Non-polar or Semipolar Gallium Containing...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FILM FOR THE BACKSIDE OF FLIP-CHIP TYPE SEMICONDUCTOR, DICING TAPE-...

ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE