TREA

Ruthenium (Ru) as principal constituent

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  • CPC
  • H01L2224/45676
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45676Ruthenium (Ru) as principal constituent
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    COATED WIRE FOR BONDING APPLICATIONS
    • Publication number 20150360316
    • Publication date Dec 17, 2015
    • Heraeus Deutschland GmbH & Co. KG
    • Eugen MILKE
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    BONDING STRUCTURE OF BONDING WIRE
    • Publication number 20110104510
    • Publication date May 5, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20110011619
    • Publication date Jan 20, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20100294532
    • Publication date Nov 25, 2010
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20100282495
    • Publication date Nov 11, 2010
    • NIPPON STEEL MATERIALS CO., LTD
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding Wire and Integrated Circuit Device Using the Same
    • Publication number 20070235887
    • Publication date Oct 11, 2007
    • Shingo Kaimori
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding wire and an integrated circuit device using the same
    • Publication number 20050151253
    • Publication date Jul 14, 2005
    • Sumitomo Electric Wintec, Incorporated
    • Tsuyoshi Nonaka
    • H01 - BASIC ELECTRIC ELEMENTS