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Ruthenium [Ru] as principal constituent
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H01L2224/29176
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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/29176
Ruthenium [Ru] as principal constituent
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last 30 patents
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Patent Grant
Method for producing composite structure with metal/metal bonding
Patent number
9,905,531
Issue date
Feb 27, 2018
Soitec
Ionut Radu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nanomicrocrystallite paste for pressureless sintering
Patent number
9,875,983
Issue date
Jan 23, 2018
Indium Corporation
Sihai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrically conductive bonding material, method of bonding with th...
Patent number
8,840,811
Issue date
Sep 23, 2014
Hitachi Chemical Company, Ltd.
Yuusuke Yasuda
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Patents Applications
last 30 patents
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Patent Application
PASSIVATION LAYER FOR FORMING SEMICONDUCTOR BONDING STRUCTURE, SPUT...
Publication number
20240145421
Publication date
May 2, 2024
SOLAR APPLIED MATERIALS TECHNOLOGY CORP.
Kuan-Neng CHEN
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
Publication number
20170317046
Publication date
Nov 2, 2017
Indium Corporation
Sihai Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
Publication number
20150179603
Publication date
Jun 25, 2015
SOITEC
Ionut Radu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICALLY CONDUCTIVE BONDING MATERIAL, METHOD OF BONDING WITH TH...
Publication number
20100270515
Publication date
Oct 28, 2010
Yuusuke YASUDA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...