Ruthenium [Ru] as principal constituent

Industry

CPC
H01L2224/13676

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13676Ruthenium [Ru] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,013
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced through substrate via metallization in three dimensional s...
- Patent number 10,396,012
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure for semiconductor package and method of manufactu...
- Patent number 9,984,993
- Issue date May 29, 2018
- Advanced Semiconductor Engineering, Inc.
- Min-Fong Shu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal-to-metal direct bonding
- Patent number 9,640,509
- Issue date May 2, 2017
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,546,956
- Issue date Oct 1, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) integrated circuit with enhanced copper-to-c...
- Patent number 8,431,436
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,168,527
- Issue date May 1, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 7,582,966
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURE OF COATED COPPER PILLARS
- Publication number 20150279797
- Publication date Oct 1, 2015
- ATOTECH DEUTSCHLAND GMBH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130200520
- Publication date Aug 8, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...
- Publication number 20130113106
- Publication date May 9, 2013
- International Business Machines Corporation
- Son V. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20080054457
- Publication date Mar 6, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Ruthenium [Ru] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Advanced through substrate via metallization in three dimensional s...

Advanced through substrate via metallization in three dimensional s...

Bonding structure for semiconductor package and method of manufactu...

Advanced metal-to-metal direct bonding

Manufacture of coated copper pillars

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Three-dimensional (3D) integrated circuit with enhanced copper-to-c...

Semiconductor chip and method for fabricating the same

Semiconductor chip and method for fabricating the same

Method of forming dual height solder interconnections

Solder mass having conductive encapsulating arrangement

Patents Applicationslast 30 patents

MANUFACTURE OF COATED COPPER PILLARS

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-C...

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME