Sacrificial or temporary thin dielectric films in openings in a dielectric

Industry

CPC
H01L2221/1063

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/1063Sacrificial or temporary thin dielectric films in openings in a dielectric

Industries

Patents Grantslast 30 patents

Information Patent Grant
Formation method of semiconductor structure
- Patent number 11,984,352
- Issue date May 14, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Jun Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,929,258
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a FinFET by implanting a dielectric with a...
- Patent number 11,901,455
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,894,269
- Issue date Feb 6, 2024
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 11,842,962
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,812,615
- Issue date Nov 7, 2023
- SK hynix Inc.
- Nam Jae Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for preparing semiconductor device including conductive cont...
- Patent number 11,791,264
- Issue date Oct 17, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device having an air spacer
- Patent number 11,769,770
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices
- Patent number 11,764,107
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Byoungdeog Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a conductive contact with a tapering pr...
- Patent number 11,715,690
- Issue date Aug 1, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with a polysilicon structure adjacent a sta...
- Patent number 11,710,710
- Issue date Jul 25, 2023
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanopore structures
- Patent number 11,674,947
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,631,684
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Local contacts of three-dimensional memory devices and methods for...
- Patent number 11,600,633
- Issue date Mar 7, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jianzhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap spacer for metal gates
- Patent number 11,557,589
- Issue date Jan 17, 2023
- Tessera, LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with air-gaps
- Patent number 11,495,539
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion structure for thin film transistor
- Patent number 11,482,622
- Issue date Oct 25, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a contact plug with an air gap spacer
- Patent number 11,456,383
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and manufacturing method of the semicon...
- Patent number 11,411,022
- Issue date Aug 9, 2022
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 11,282,781
- Issue date Mar 22, 2022
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,264,275
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio via etch using atomic layer deposition protection...
- Patent number 11,121,027
- Issue date Sep 14, 2021
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via connection to a partially filled trench
- Patent number 11,087,994
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with polysilicon fill material between oppo...
- Patent number 11,088,088
- Issue date Aug 10, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a protective layer to prevent formation of leakage paths
- Patent number 11,081,397
- Issue date Aug 3, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Leo Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacturing thereof
- Patent number 11,049,767
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure of metal cut
- Patent number 11,011,417
- Issue date May 18, 2021
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing target object
- Patent number 10,998,223
- Issue date May 4, 2021
- Tokyo Electron Limited
- Seiji Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 10,998,326
- Issue date May 4, 2021
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method of forming the same
- Patent number 10,985,054
- Issue date Apr 20, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387125
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lien HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...
- Publication number 20230361053
- Publication date Nov 9, 2023
- Lodestar Licensing Group, LLC
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP SPACER FOR METAL GATES
- Publication number 20230352480
- Publication date Nov 2, 2023
- TESSERA LLC
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanopore Structures
- Publication number 20230258622
- Publication date Aug 17, 2023
- International Business Machines Corporation
- Kangguo Cheng
- B82 - NANO-TECHNOLOGY
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230209822
- Publication date Jun 29, 2023
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION
- Publication number 20230197508
- Publication date Jun 22, 2023
- Applied Materials, Inc.
- Xiangjin Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...
- Publication number 20230171961
- Publication date Jun 1, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jianzhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF SPIN ON ORGANIC MATERIAL TO IMPROVE WET RESISTANCE
- Publication number 20230099053
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Yang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE FILM FORMATION USING A SELF-ASSEMBLED MONOLAYER
- Publication number 20230009688
- Publication date Jan 12, 2023
- TOKYO ELECTRON LIMITED
- Dina H. Triyoso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH AIR-GAPS
- Publication number 20220367357
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD
- Publication number 20220359755
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Su-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...
- Publication number 20220352202
- Publication date Nov 3, 2022
- SK HYNIX INC.
- Nam Jae LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220310509
- Publication date Sep 29, 2022
- KIOXIA Corporation
- Ryota SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND ITS MANUFACTURING METHOD
- Publication number 20220223468
- Publication date Jul 14, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yong LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING APPARATUS
- Publication number 20220181162
- Publication date Jun 9, 2022
- TOKYO ELECTRON LIMITED
- Akihiro TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220139779
- Publication date May 5, 2022
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20220130720
- Publication date Apr 28, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- JUN XIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Via Connection to a Partially Filled Trench
- Publication number 20210366726
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210358805
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- John D. Hopkins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming a Protective Layer to Prevent Formation of Leakage Paths
- Publication number 20210358813
- Publication date Nov 18, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Leo Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ADJACENT A STA...
- Publication number 20210358868
- Publication date Nov 18, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF
- Publication number 20210327748
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsai-Ming HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...
- Publication number 20210272982
- Publication date Sep 2, 2021
- Yangtze Memory Technologies Co., Ltd.
- Jianzhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...
- Publication number 20210225863
- Publication date Jul 22, 2021
- YANGTZE MEMORY TECHNOLOGIES CO., LTD.
- Jianzhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210159113
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Byoungdeog Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE WITH AIR-GAPS
- Publication number 20210159175
- Publication date May 27, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tai-I Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES WITH POLYSILICON FILL MATERIAL BETWEEN OPPO...
- Publication number 20210134736
- Publication date May 6, 2021
- Micron Technology, Inc.
- Jivaan Kishore Jhothiraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF METAL CUT
- Publication number 20200381296
- Publication date Dec 3, 2020
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structure and Method of Forming the Same
- Publication number 20200343128
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jeng-Shiou Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED INTERCONNET LINE HAVING A LOW-OXYGEN CAP FOR FACILITATING...
- Publication number 20200343131
- Publication date Oct 29, 2020
- International Business Machines Corporation
- Samuel Sung, Shik Choi
- H01 - BASIC ELECTRIC ELEMENTS

Sacrificial or temporary thin dielectric films in openings in a dielectric

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Formation method of semiconductor structure

Via connection to a partially filled trench

Method of manufacturing a FinFET by implanting a dielectric with a...

Integrated assemblies and methods of forming integrated assemblies

Interconnect structure with air-gaps

Semiconductor memory device and manufacturing method of the semicon...

Method for preparing semiconductor device including conductive cont...

Methods of forming a semiconductor device having an air spacer

Methods of manufacturing semiconductor devices

Semiconductor device having a conductive contact with a tapering pr...

Microelectronic devices with a polysilicon structure adjacent a sta...

Nanopore structures

Integrated assemblies and methods of forming integrated assemblies

Local contacts of three-dimensional memory devices and methods for...

Air gap spacer for metal gates

Interconnect structure with air-gaps

Adhesion structure for thin film transistor

Semiconductor device having a contact plug with an air gap spacer

Semiconductor memory device and manufacturing method of the semicon...

Semiconductor device and method for fabricating the same

Integrated assemblies and methods of forming integrated assemblies

High aspect ratio via etch using atomic layer deposition protection...

Via connection to a partially filled trench

Microelectronic devices with polysilicon fill material between oppo...

Forming a protective layer to prevent formation of leakage paths

Semiconductor device and methods of manufacturing thereof

Method and structure of metal cut

Method for processing target object

Integrated assemblies and methods of forming integrated assemblies

Interconnect structure and method of forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ABOVE A STAIRC...

AIR GAP SPACER FOR METAL GATES

Nanopore Structures

Integrated Assemblies and Methods of Forming Integrated Assemblies

SELF-ASSEMBLED MONOLAYER FOR SELECTIVE DEPOSITION

LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...

TREATMENT OF SPIN ON ORGANIC MATERIAL TO IMPROVE WET RESISTANCE

SELECTIVE FILM FORMATION USING A SELF-ASSEMBLED MONOLAYER

INTERCONNECT STRUCTURE WITH AIR-GAPS

FINFET DEVICE AND METHOD

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD OF THE SEMICON...

SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND ITS MANUFACTURING METHOD

ETCHING APPARATUS

Integrated Assemblies and Methods of Forming Integrated Assemblies

FORMATION METHOD OF SEMICONDUCTOR STRUCTURE

Via Connection to a Partially Filled Trench

Integrated Assemblies and Methods of Forming Integrated Assemblies

Forming a Protective Layer to Prevent Formation of Leakage Paths

MICROELECTRONIC DEVICES WITH A POLYSILICON STRUCTURE ADJACENT A STA...

SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF

LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...

LOCAL CONTACTS OF THREE-DIMENSIONAL MEMORY DEVICES AND METHODS FOR...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

INTERCONNECT STRUCTURE WITH AIR-GAPS

MICROELECTRONIC DEVICES WITH POLYSILICON FILL MATERIAL BETWEEN OPPO...

METHOD AND STRUCTURE OF METAL CUT

Interconnect Structure and Method of Forming the Same

RECESSED INTERCONNET LINE HAVING A LOW-OXYGEN CAP FOR FACILITATING...