Scandium [Sc]

Industry

CPC
H01L2924/01021

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01021Scandium [Sc]

Industries

Patents Grantslast 30 patents

Information Patent Grant
LED lamp
- Patent number 11,629,826
- Issue date Apr 18, 2023
- Rohm Co., Ltd.
- Yusaku Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp
- Patent number 11,608,941
- Issue date Mar 21, 2023
- Rohm Co., Ltd.
- Yusaku Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a bond pad material based on aluminum
- Patent number 11,410,950
- Issue date Aug 9, 2022
- Infineon Technologies AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Power management module and method of manufacture
- Patent number 10,475,568
- Issue date Nov 12, 2019
- L. Pierre de Rochemont
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
White light devices using non-polar or semipolar gallium containing...
- Patent number RE47711
- Issue date Nov 5, 2019
- Soraa, Inc.
- James W. Raring
Information Patent Grant
Semiconductor device with first and second chips and connections th...
- Patent number 10,204,899
- Issue date Feb 12, 2019
- Renesas Electronics Corporation
- Masaki Shiraishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp
- Patent number 10,190,729
- Issue date Jan 29, 2019
- Rohm Co., Ltd.
- Yusaku Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connecting member and manufacturing method of same
- Patent number 10,177,079
- Issue date Jan 8, 2019
- Furukawa Electric Co., Ltd.
- Hideo Nishikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical components and method of manufacture
- Patent number 9,905,928
- Issue date Feb 27, 2018
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
LED lamp
- Patent number 9,797,554
- Issue date Oct 24, 2017
- Rohm Co., Ltd.
- Yusaku Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,793,265
- Issue date Oct 17, 2017
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for fabricating electronic device package
- Patent number 9,771,259
- Issue date Sep 26, 2017
- Xintec Inc.
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming 3-D circuits with integrated passive devices
- Patent number 9,698,131
- Issue date Jul 4, 2017
- Invensas Corporation
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including Schottky barrier diode and power MOS...
- Patent number 9,461,163
- Issue date Oct 4, 2016
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Pb-free solder bumps with improved mechanical properties
- Patent number 9,443,821
- Issue date Sep 13, 2016
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,362,220
- Issue date Jun 7, 2016
- Samsung Electronics Co., Ltd.
- Sang-Jong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming 3-D circuits with integrated passive devices
- Patent number 9,236,365
- Issue date Jan 12, 2016
- Invensas Corporation
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp
- Patent number 9,234,632
- Issue date Jan 12, 2016
- Rohm Co., Ltd.
- Yusaku Kawabata
- F21 - LIGHTING
Information Patent Grant
Light-radiating semiconductor component with a luminescence convers...
- Patent number 9,196,800
- Issue date Nov 24, 2015
- Osram GmbH
- Ulrike Reeh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,184,092
- Issue date Nov 10, 2015
- Xintec Inc.
- Yu-Lin Yen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 9,181,084
- Issue date Nov 10, 2015
- Chien-Hung Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including DC-DC converter
- Patent number 9,153,686
- Issue date Oct 6, 2015
- Renesas Electronics Corporation
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Light emitting device and display comprising a plurality of light e...
- Patent number 9,130,130
- Issue date Sep 8, 2015
- Nichia Corporation
- Yoshinori Shimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device fabrication method capable of scribing chips w...
- Patent number 9,105,706
- Issue date Aug 11, 2015
- Fujitsu Semiconductor Limited
- Satoshi Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device, semiconductor device...
- Patent number 9,099,534
- Issue date Aug 4, 2015
- Sony Corporation
- Kazuto Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,093,450
- Issue date Jul 28, 2015
- Xintec Inc.
- Baw-Ching Perng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromigration-resistant under-bump metallization of nickel-iron...
- Patent number 9,082,762
- Issue date Jul 14, 2015
- International Business Machines Corporation
- Sung K. Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AI BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240312946
- Publication date Sep 19, 2024
- Tetsuya OYAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSABLE ATTACHMENT SYSTEM
- Publication number 20240213212
- Publication date Jun 27, 2024
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AI WIRING MATERIAL
- Publication number 20240105668
- Publication date Mar 28, 2024
- NIPPON MICROMETAL CORPORATION
- Yuto KURIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REWORKABLE INTER-SUBSTRATE BOND STRUCTURE
- Publication number 20230378126
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al WIRING MATERIAL
- Publication number 20230299037
- Publication date Sep 21, 2023
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BONDING WIRE
- Publication number 20230146315
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20230015243
- Publication date Jan 19, 2023
- SAMSUNG DISPLAY CO., LTD.
- Chungi You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate Having a Bond Pad Material Based on Aluminum
- Publication number 20210091025
- Publication date Mar 25, 2021
- INFINEON TECHNOLOGIES AG
- Gert Pfahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...
- Publication number 20200373272
- Publication date Nov 26, 2020
- SOUTH CHINA UNIVERSITY OF TECHNOLOGY
- Bin Yuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED LAMP
- Publication number 20180003347
- Publication date Jan 4, 2018
- ROHM CO., LTD.
- Yasaku KAWABATA
- F21 - LIGHTING
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20170373055
- Publication date Dec 28, 2017
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150048510
- Publication date Feb 19, 2015
- Denso Corporation
- Manabu Tomisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20140332878
- Publication date Nov 13, 2014
- Masaki Shiraishi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES
- Publication number 20140332980
- Publication date Nov 13, 2014
- Invensas Corporation
- Paul W. Sanders
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...
- Publication number 20140329353
- Publication date Nov 6, 2014
- SONY CORPORATION
- Kazuto WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES
- Publication number 20140284376
- Publication date Sep 25, 2014
- AGERE SYSTEMS LLC
- Mark Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WHITE LIGHT DEVICES USING NON-POLAR OR SEMIPOLAR GALLIUM CONTAINING...
- Publication number 20140213001
- Publication date Jul 31, 2014
- Soraa, Inc.
- JAMES W. RARING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20140209924
- Publication date Jul 31, 2014
- KABUSHIKI KAISHA TOSHIBA
- Hisao Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR PRODUCING IC CHIP PACKAGE
- Publication number 20140202641
- Publication date Jul 24, 2014
- SINFONIA TECHNOLOGY CO., LTD.
- Taichi INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140199830
- Publication date Jul 17, 2014
- Xintec Inc.
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140199835
- Publication date Jul 17, 2014
- Xintec Inc.
- Yu-Lin YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTING DEVICE AND DISPLAY COMPRISING A PLURALITY OF LIGHT E...
- Publication number 20140084323
- Publication date Mar 27, 2014
- Nichia Corporation.
- Yoshinori Shimizu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140073089
- Publication date Mar 13, 2014
- Xintec Inc.
- Baw-Ching PERNG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
- Publication number 20140054692
- Publication date Feb 27, 2014
- RENESAS ELECTRONICS CORPORATION
- Masaki SHIRAISHI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20130313563
- Publication date Nov 28, 2013
- KABUSHIKI KAISHA TOSHIBA
- Hisao Kawasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD CAPABLE OF SCRIBING CHIPS WITH HIGH...
- Publication number 20130280889
- Publication date Oct 24, 2013
- FUJITSU SEMICONDUCTOR LIMITED
- Satoshi OTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130252368
- Publication date Sep 26, 2013
- Xintec Inc.
- Yu-Lung HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN
- Publication number 20130251447
- Publication date Sep 26, 2013
- ROBERT BOSCH GmbH
- Thomas Kalich
- B32 - LAYERED PRODUCTS
Information Patent Application
ILLUMINATING DEVICE
- Publication number 20130221866
- Publication date Aug 29, 2013
- Akeo Kasakura
- F21 - LIGHTING

Scandium [Sc]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

LED lamp

LED lamp

Semiconductor substrate having a bond pad material based on aluminum

Modulated inductance module

Power management module and method of manufacture

White light devices using non-polar or semipolar gallium containing...

Semiconductor device with first and second chips and connections th...

LED lamp

Conductive connecting member and manufacturing method of same

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Electrical components and method of manufacture

LED lamp

Semiconductor device including Schottky barrier diode and power MOS...

Method for fabricating electronic device package

Epoxy resin composition for encapsulating semiconductor device and...

Methods of forming 3-D circuits with integrated passive devices

Semiconductor device including Schottky barrier diode and power MOS...

Pb-free solder bumps with improved mechanical properties

Semiconductor device

Methods of forming 3-D circuits with integrated passive devices

LED lamp

Light-radiating semiconductor component with a luminescence convers...

Chip package and method for forming the same

Electronic device package and fabrication method thereof

Semiconductor device including DC-DC converter

Light emitting device and display comprising a plurality of light e...

Semiconductor device fabrication method capable of scribing chips w...

Manufacturing method of semiconductor device, semiconductor device...

Chip package and manufacturing method thereof

Electromigration-resistant under-bump metallization of nickel-iron...

Patents Applicationslast 30 patents

AI BONDING WIRE FOR SEMICONDUCTOR DEVICES

REVERSABLE ATTACHMENT SYSTEM

AI WIRING MATERIAL

REWORKABLE INTER-SUBSTRATE BOND STRUCTURE

Al WIRING MATERIAL

AL BONDING WIRE

DISPLAY DEVICE

Semiconductor Substrate Having a Bond Pad Material Based on Aluminum

High-Reliability Copper Alloy Bonding Wire for Electronic Packaging...

LED LAMP

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

METHODS OF FORMING 3-D CIRCUITS WITH INTEGRATED PASSIVE DEVICES

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE...

PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES

WHITE LIGHT DEVICES USING NON-POLAR OR SEMIPOLAR GALLIUM CONTAINING...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

APPARATUS FOR PRODUCING IC CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

LIGHT EMITTING DEVICE AND DISPLAY COMPRISING A PLURALITY OF LIGHT E...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE AND METHOD CAPABLE OF SCRIBING CHIPS WITH HIGH...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

STARTING MATERIAL AND PROCESS FOR PRODUCING A SINTERED JOIN

ILLUMINATING DEVICE