Sealing arrangements between parts

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CPC
H01L23/3142

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3142Sealing arrangements between parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ablation-based surface property modification and contaminatio...
- Patent number 12,362,340
- Issue date Jul 15, 2025
- Intel Corporation
- Denis Myasishchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,933
- Issue date Jul 8, 2025
- Kabushiki Kaisha Toshiba
- Toru Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring patterns
- Patent number 12,349,440
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen Lian Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,334,408
- Issue date Jun 17, 2025
- Mitsubishi Electric Corporation
- Naoki Yoshimatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method therefor
- Patent number 12,322,719
- Issue date Jun 3, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a substrate-to-substrate interconnection s...
- Patent number 12,315,845
- Issue date May 27, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Joon Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having heat dissipation structure
- Patent number 12,315,774
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, and powe...
- Patent number 12,308,304
- Issue date May 20, 2025
- Mitsubishi Electric Corporation
- Kei Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded product for semiconductor strip and method of manufacturing...
- Patent number 12,308,253
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package, article comprising the same and manufacturing metho...
- Patent number 12,288,736
- Issue date Apr 29, 2025
- Prevayl Innovations Limited
- Michael John Lynch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices with improved overcoat adhesion and/or...
- Patent number 12,283,534
- Issue date Apr 22, 2025
- Wolfspeed, Inc.
- In Hwan Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,283,566
- Issue date Apr 22, 2025
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with heat sink and manufacturing method...
- Patent number 12,278,155
- Issue date Apr 15, 2025
- STMicroelectronics (Grenoble 2) SAS
- Younes Boutaleb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with injection-molded or laminated coole...
- Patent number 12,278,163
- Issue date Apr 15, 2025
- HITACHI ENERGY LTD
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 12,261,157
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus and method of manufacturing s...
- Patent number 12,255,080
- Issue date Mar 18, 2025
- Mitsubishi Electric Corporation
- Takamasa Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,255,120
- Issue date Mar 18, 2025
- Denso Corporation
- Yoshitaka Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon spacers with improved adhesion and semiconductor device ass...
- Patent number 12,255,128
- Issue date Mar 18, 2025
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,256,573
- Issue date Mar 18, 2025
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device arrangement with compressible adhesive
- Patent number 12,249,561
- Issue date Mar 11, 2025
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device
- Patent number 12,230,558
- Issue date Feb 18, 2025
- Innolux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and power conversion apparatus
- Patent number 12,224,220
- Issue date Feb 11, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with grooved die pad
- Patent number 12,224,229
- Issue date Feb 11, 2025
- Kabushiki Kaisha Toshiba
- Kyo Tanabiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,218,020
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench structure for reduced wafer cracking
- Patent number 12,211,805
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically anchored mold compounds in semiconductor packages
- Patent number 12,180,595
- Issue date Dec 31, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250233116
- Publication date Jul 17, 2025
- DIODES INCORPORATED
- Shu-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...
- Publication number 20250218884
- Publication date Jul 3, 2025
- STMicroelectronics (Grenoble 2) SAS
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250219019
- Publication date Jul 3, 2025
- ROHM CO., LTD.
- Akihiro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE WITH DETACHABLE FUNCTION
- Publication number 20250210421
- Publication date Jun 26, 2025
- Industrial Technology Research Institute
- Yu-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250210551
- Publication date Jun 26, 2025
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20250201784
- Publication date Jun 19, 2025
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192094
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wonil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250183115
- Publication date Jun 5, 2025
- Siliconware Precision Industries Co., Ltd.
- Shih-Hao TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183107
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Kwangyong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250176107
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Chunghee LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...
- Publication number 20250174541
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE DEVICE
- Publication number 20250157904
- Publication date May 15, 2025
- InnoLux Corporation
- Hsueh-Hsuan Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157908
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Hyuekjae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...
- Publication number 20250157956
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20250125209
- Publication date Apr 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Yung-Shun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125208
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250125214
- Publication date Apr 17, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR REDUCED WAFER CRACKING
- Publication number 20250118684
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118621
- Publication date Apr 10, 2025
- DENSO CORPORATION
- MOTOMI MUROZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118623
- Publication date Apr 10, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20250105165
- Publication date Mar 27, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND POWER CONVERSION APPARATUS
- Publication number 20250079387
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Hui LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250062174
- Publication date Feb 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsu-Nan FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-mode Sensor Based on Wafer-level Packaging and its Manufactur...
- Publication number 20250054851
- Publication date Feb 13, 2025
- TSINGHUA UNIVERSITY
- Chen Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250046687
- Publication date Feb 6, 2025
- Rohm Co., Ltd.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHUNT RESISTANCE, METHOD OF MANUFACTURING SHUNT RESISTANCE, AND SEM...
- Publication number 20250031392
- Publication date Jan 23, 2025
- Rohm Co., Ltd.
- Kosaku Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

Sealing arrangements between parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor die package with ring structure

Laser ablation-based surface property modification and contaminatio...

Semiconductor device

Seal ring patterns

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with discrete blocks

Semiconductor device structure and method therefor

Electronic device having a substrate-to-substrate interconnection s...

Semiconductor structure having heat dissipation structure

Semiconductor device and method of manufacturing the same, and powe...

Molded product for semiconductor strip and method of manufacturing...

Semiconductor module and method for manufacturing semiconductor module

Sensor package, article comprising the same and manufacturing metho...

Power semiconductor devices with improved overcoat adhesion and/or...

Semiconductor device and method for manufacturing the same

Integrated circuit package with heat sink and manufacturing method...

Power semiconductor module with injection-molded or laminated coole...

Hermetic package for high CTE mismatch

Semiconductor device having package on package structure and method...

Semiconductor manufacturing apparatus and method of manufacturing s...

Semiconductor device and method of manufacturing the same

Silicon spacers with improved adhesion and semiconductor device ass...

Sensor package structure

Semiconductor device arrangement with compressible adhesive

Package device

Semiconductor module and power conversion apparatus

Semiconductor device with grooved die pad

Semiconductor packages

Trench structure for reduced wafer cracking

Chemically anchored mold compounds in semiconductor packages

Patents Applicationslast 30 patents

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

Electronic Device and Manufacturing Method Thereof

INTEGRATED CIRCUIT PACKAGE WITH HEAT SINK AND MANUFACTURING METHOD...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

POWER MODULE WITH DETACHABLE FUNCTION

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

3D STACK PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING CONDUCTIVE POST AND METHOD OF MANUF...

MANUFACTURING METHOD OF PACKAGE DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS FORMED UTILIZING DU...

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

TRENCH STRUCTURE FOR REDUCED WAFER CRACKING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS

POWER MODULE AND POWER CONVERSION APPARATUS

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Multi-mode Sensor Based on Wafer-level Packaging and its Manufactur...

PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SHUNT RESISTANCE, METHOD OF MANUFACTURING SHUNT RESISTANCE, AND SEM...