Second resist used as pattern over first resist

Industry

CPC
H05K2203/0588

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0588Second resist used as pattern over first resist

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 12,022,621
- Issue date Jun 25, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Mi Jeong Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,744,022
- Issue date Aug 29, 2023
- KYOCERA AVX Components (San Diego), Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and processes for forming electrical circuitries on three-d...
- Patent number 11,304,303
- Issue date Apr 12, 2022
- DUJUD LLC
- Reza Abbaspour
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 11,191,165
- Issue date Nov 30, 2021
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interposer, semiconductor package, and method of fabricating interp...
- Patent number 11,018,026
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 10,912,202
- Issue date Feb 2, 2021
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing conductive line
- Patent number 10,615,054
- Issue date Apr 7, 2020
- Unimicron Technology Corp.
- Shih-Liang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an interposer
- Patent number 10,535,534
- Issue date Jan 14, 2020
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a circuit having a lamination layer using...
- Patent number 10,448,518
- Issue date Oct 15, 2019
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board
- Patent number 10,405,431
- Issue date Sep 3, 2019
- Avary Holding (Shenzhen) Co., Limited.
- Lei Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, power storage device, battery pack, and electronic d...
- Patent number 10,231,339
- Issue date Mar 12, 2019
- Murata Manufacturing Co., Ltd.
- Takashi Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of an electronic module and electronic module
- Patent number 9,999,136
- Issue date Jun 12, 2018
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 9,832,871
- Issue date Nov 28, 2017
- Murata Manufacturing Co, Ltd.
- Nobuaki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,820,378
- Issue date Nov 14, 2017
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,760,002
- Issue date Sep 12, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Circuit board formation using organic substrates
- Patent number 9,684,237
- Issue date Jun 20, 2017
- International Business Machines Corporation
- Hiroyuki Mori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Solder-mounted board, production method therefor, and semiconductor...
- Patent number 9,565,754
- Issue date Feb 7, 2017
- San-ei Kagaku Co., Ltd.
- Kazunori Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board
- Patent number 9,560,739
- Issue date Jan 31, 2017
- NGK Spark Plug Co., Ltd.
- Tomohiro Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 9,549,466
- Issue date Jan 17, 2017
- Wistron Corporation
- Jui-Yun Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for solder bump formation, solder bump formation...
- Patent number 9,415,469
- Issue date Aug 16, 2016
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of metal structure of flexible multi-layer sub...
- Patent number 9,398,704
- Issue date Jul 19, 2016
- PRINCO MIDDLE EAST FZE
- Chih-Kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 9,282,642
- Issue date Mar 8, 2016
- KYOCERA Circuit Solutions, Inc.
- Keizou Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 9,271,404
- Issue date Feb 23, 2016
- Wistron Corporation
- Jui-Yun Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit apparatus having a rounded trace
- Patent number 9,229,318
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Inc.
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabricating method of circuit board and circuit board
- Patent number 9,066,458
- Issue date Jun 23, 2015
- Via Technologies, Inc.
- Chen-Yueh Kung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 8,927,870
- Issue date Jan 6, 2015
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Grant
Suspension board with circuit and producing method thereof
- Patent number 8,872,036
- Issue date Oct 28, 2014
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 8,785,789
- Issue date Jul 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hueng Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate, and method of manufacturing the same
- Patent number 8,772,643
- Issue date Jul 8, 2014
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...
- Publication number 20230147650
- Publication date May 11, 2023
- TSE CO., LTD.
- Byeong Yong LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220369469
- Publication date Nov 17, 2022
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE
- Publication number 20220087034
- Publication date Mar 17, 2022
- AZOTEK CO., LTD.
- Hung-Jung LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20220087029
- Publication date Mar 17, 2022
- Ethertronics, Inc.
- Seung Hyuk Choi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for Manufacturing a Circuit Having a Lamination Layer Using...
- Publication number 20200045827
- Publication date Feb 6, 2020
- Ethertronics, Inc.
- Seung Hyuk Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE LINE
- Publication number 20190109017
- Publication date Apr 11, 2019
- Unimicron Technology Corp.
- Shih-Liang Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT SUBSTRATE AND MASK STRUCTURE AND MA...
- Publication number 20180070452
- Publication date Mar 8, 2018
- Unimicron Technology Corp.
- Pu-Ju Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140215782
- Publication date Aug 7, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140174805
- Publication date Jun 26, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Takayuki Haze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20140166354
- Publication date Jun 19, 2014
- Wistron Corporation
- Jui-Yun Fan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140092569
- Publication date Apr 3, 2014
- KYOCERA SLC TECHNOLOGIES CORPORATION
- Keizou SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140041902
- Publication date Feb 13, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER-MOUNTED BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR...
- Publication number 20130264105
- Publication date Oct 10, 2013
- SAN-EI KAGAKU CO., LTD.
- Kazunori KITAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD
- Publication number 20130213692
- Publication date Aug 22, 2013
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130161085
- Publication date Jun 27, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hueng Jae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF
- Publication number 20130157200
- Publication date Jun 20, 2013
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Application
MANUFACTURING METHOD OF METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUB...
- Publication number 20120270158
- Publication date Oct 25, 2012
- Princo Corp.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-SUBSTRATE-MOUNTING PRINTED WIRING BOARD AND METHOD FOR MANU...
- Publication number 20120247823
- Publication date Oct 4, 2012
- IBIDEN CO., LTD.
- Toshiaki KASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY...
- Publication number 20120193324
- Publication date Aug 2, 2012
- Jürgen SCHULZ-HARDER
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF PROTECTING A PRINTED CIRCUIT BOARD AND RELATED APPARATUS
- Publication number 20120103665
- Publication date May 3, 2012
- Kum Cheong Adam CHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Apparatus Having a Rounded Trace
- Publication number 20120052417
- Publication date Mar 1, 2012
- International Business Machines Corporation
- Matthew S. Doyle
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of manufacturing printed circuit board having flow preventin...
- Publication number 20120000067
- Publication date Jan 5, 2012
- SAMSUNG ELLECTRO-MECHANICS CO., LTD.
- Jin Won Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD
- Publication number 20110240352
- Publication date Oct 6, 2011
- Fujitsu Limited
- Naoki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer Wiring Substrate, and Method of Manufacturing the Same
- Publication number 20110198114
- Publication date Aug 18, 2011
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING POST BUMP
- Publication number 20110111587
- Publication date May 12, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Dae Jo HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE
- Publication number 20110100696
- Publication date May 5, 2011
- Masayuki NAGAMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE AND MANUFACTURING...
- Publication number 20110088929
- Publication date Apr 21, 2011
- PRINCO CORP.
- Chih-kuang Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Suspension board with circuit and production method thereof
- Publication number 20100224391
- Publication date Sep 9, 2010
- Nitto Denko Corporation
- Yasushi Tamura
- G11 - INFORMATION STORAGE
Information Patent Application
Printed Circuit Board Having Flow Preventing Dam And Manufacturing...
- Publication number 20100116534
- Publication date May 13, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Jin Won Choi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Second resist used as pattern over first resist

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board and method for manufacturing the same

Printed circuit board and method of manufacturing the same

Method for manufacturing a circuit having a lamination layer using...

Methods and processes for forming electrical circuitries on three-d...

Method for manufacturing a circuit having a lamination layer using...

Interposer, semiconductor package, and method of fabricating interp...

Method of manufacturing printed circuit board

Method for manufacturing conductive line

Method of fabricating an interposer

Method for manufacturing a circuit having a lamination layer using...

Flexible printed circuit board

Circuit board, power storage device, battery pack, and electronic d...

Method for fabrication of an electronic module and electronic module

Module

Printed circuit board and method of manufacturing the same

Circuit board formation using organic substrates

Circuit board formation using organic substrates

Solder-mounted board, production method therefor, and semiconductor...

Wiring board

Circuit board and manufacturing method thereof

Resin composition for solder bump formation, solder bump formation...

Manufacturing method of metal structure of flexible multi-layer sub...

Wiring board

Circuit board and manufacturing method thereof

Circuit apparatus having a rounded trace

Fabricating method of circuit board and circuit board

Suspension board with circuit and producing method thereof

Suspension board with circuit and producing method thereof

Printed circuit board and method for manufacturing the same

Multilayer wiring substrate, and method of manufacturing the same

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD INCLUDING EXTREME...

METHOD OF MANUFACTURING PRINTED WIRING BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD STRUCTURE

Method for Manufacturing a Circuit Having a Lamination Layer Using...

Method for Manufacturing a Circuit Having a Lamination Layer Using...

METHOD FOR MANUFACTURING CONDUCTIVE LINE

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE AND MASK STRUCTURE AND MA...

MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

SOLDER-MOUNTED BOARD, PRODUCTION METHOD THEREFOR, AND SEMICONDUCTOR...

FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF

MANUFACTURING METHOD OF METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUB...

PACKAGE-SUBSTRATE-MOUNTING PRINTED WIRING BOARD AND METHOD FOR MANU...

METHOD FOR THE PRODUCTION OF A METAL-CERAMIC SUBSTRATE, PREFERABLY...

METHOD OF PROTECTING A PRINTED CIRCUIT BOARD AND RELATED APPARATUS

Circuit Apparatus Having a Rounded Trace

Method of manufacturing printed circuit board having flow preventin...

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING PRINTED CIRCUIT BOARD

Multilayer Wiring Substrate, and Method of Manufacturing the Same

METHOD FOR FORMING POST BUMP

DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE

METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE AND MANUFACTURING...

Suspension board with circuit and production method thereof

Printed Circuit Board Having Flow Preventing Dam And Manufacturing...