Selective modification

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H01L2224/1155

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1155Selective modification

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive member cavities
- Patent number 11,699,639
- Issue date Jul 11, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,551,973
- Issue date Jan 10, 2023
- Kioxia Corporation
- Takanobu Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip hybridization of microelectronic components by local heat...
- Patent number 9,111,924
- Issue date Aug 18, 2015
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Abdelkader Aliane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,896,133
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump and method for forming the same
- Patent number 8,802,557
- Issue date Aug 12, 2014
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive bump, method for producing the same, and electronic comp...
- Patent number 8,575,751
- Issue date Nov 5, 2013
- Panasonic Corporation
- Daisuke Sakurai
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,492,197
- Issue date Jul 23, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro bump and method for forming the same
- Patent number 8,426,964
- Issue date Apr 23, 2013
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 8,178,972
- Issue date May 15, 2012
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Yutani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component mounting structure and method for manufacturin...
- Patent number 8,120,188
- Issue date Feb 21, 2012
- Panasonic Corporation
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive structure on a semiconductor substrate form...
- Patent number 8,067,305
- Issue date Nov 29, 2011
- Ultratech, Inc.
- Arthur W. Zafiropoulo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,008,182
- Issue date Aug 30, 2011
- Seiko Epson Corporation
- Tatsuhiko Asakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element that includes multilayered bonding interface bet...
- Patent number 7,960,834
- Issue date Jun 14, 2011
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive bump, method for manufacturing the conductive bump, semi...
- Patent number 7,928,566
- Issue date Apr 19, 2011
- Panasonic Corporation
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method therefor
- Patent number 7,880,763
- Issue date Feb 1, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Yutani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of bonding
- Patent number 7,789,287
- Issue date Sep 7, 2010
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced, self-aligning conductive structures for semiconductor d...
- Patent number 7,557,452
- Issue date Jul 7, 2009
- Micron Technology, Inc.
- Vernon M. Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repairable three-dimensional semiconductor subsystem
- Patent number 7,427,809
- Issue date Sep 23, 2008
- Salmon Technologies, LLC
- Peter C. Salmon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,422,973
- Issue date Sep 9, 2008
- Freescale Semiconductor, Inc.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of providing solder bumps on a substrate using localized hea...
- Patent number 7,407,878
- Issue date Aug 5, 2008
- Intel Corporation
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming multi-layer bumps on a substrate
- Patent number 7,279,409
- Issue date Oct 9, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support ring for use with a contact pad and semiconductor device co...
- Patent number 7,170,171
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structures for stabilizing semiconductor devices relative to test s...
- Patent number 7,138,653
- Issue date Nov 21, 2006
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Methods for providing support for conductive structures protruding...
- Patent number 7,109,106
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming semiconductor devices so as to stabilize the sa...
- Patent number 7,041,513
- Issue date May 9, 2006
- Micron Technology, Inc.
- Salman Akram
- G01 - MEASURING TESTING
Information Patent Grant
Ring positionable about a periphery of a contact pad, semiconductor...
- Patent number 6,902,995
- Issue date Jun 7, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support ring for use with a contact pad and semiconductor device co...
- Patent number 6,882,049
- Issue date Apr 19, 2005
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ring positionable about a periphery of a contact pad, semiconductor...
- Patent number 6,548,897
- Issue date Apr 15, 2003
- Micron Technology, Inc.
- Ford B. Grigg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE MEMBER CAVITIES
- Publication number 20230307327
- Publication date Sep 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF ELECTRONIC CHIPS
- Publication number 20220375840
- Publication date Nov 24, 2022
- STMicroelectronics (Tours) SAS
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBER CAVITIES
- Publication number 20220319961
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20220059407
- Publication date Feb 24, 2022
- KIOXIA Corporation
- Takanobu ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...
- Publication number 20200093008
- Publication date Mar 19, 2020
- Invensas Corporation
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Manufacturing Method
- Publication number 20160233184
- Publication date Aug 11, 2016
- Nitto Denko Corporation
- Hiroyuki Hanazono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Substrate Having Conduct...
- Publication number 20150279815
- Publication date Oct 1, 2015
- STATS ChipPAC, Ltd.
- Byung Tai Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...
- Publication number 20140210076
- Publication date Jul 31, 2014
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Abdelkader ALIANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20130234324
- Publication date Sep 12, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Micro Bump And Method For Forming The Same
- Publication number 20130217224
- Publication date Aug 22, 2013
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Application
Micro Bump And Method For Forming The Same
- Publication number 20120273936
- Publication date Nov 1, 2012
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ruoh-Huey Uang
- B82 - NANO-TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20120043672
- Publication date Feb 23, 2012
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20110057311
- Publication date Mar 10, 2011
- Mitsubishi Denki Kabushiki Kaisha
- Naoki YUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20100201001
- Publication date Aug 12, 2010
- SEIKO EPSON CORPORATION
- Tatsuhiko ASAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrically conductive structure on a semiconductor substrate form...
- Publication number 20100055895
- Publication date Mar 4, 2010
- Arthur W. Zafiropoulo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20100052189
- Publication date Mar 4, 2010
- Daisuke Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...
- Publication number 20100029044
- Publication date Feb 4, 2010
- Yoshihiko Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...
- Publication number 20090315178
- Publication date Dec 24, 2009
- Daisuke Sakurai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...
- Publication number 20090301771
- Publication date Dec 10, 2009
- Shozo Ochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BONDING
- Publication number 20090230172
- Publication date Sep 17, 2009
- Toshinori Ogashiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Element, Electronic Element Device Using the Same, and M...
- Publication number 20090039507
- Publication date Feb 12, 2009
- Murata Manufacturing Co., Ltd.
- Tatsuya Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20090004761
- Publication date Jan 1, 2009
- Mitsubishi Denki Kabushiki Kaisha
- Naoki YUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of providing solder bumps on a substrate using localized hea...
- Publication number 20080085595
- Publication date Apr 10, 2008
- Yonggang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming multi-layer bumps on a substrate
- Publication number 20070178688
- Publication date Aug 2, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for fabricating reinforced, self-aligning conductive struct...
- Publication number 20070148817
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electrical connection methods employing corresponding, insulator-co...
- Publication number 20070148818
- Publication date Jun 28, 2007
- Vernon M. Williams
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for forming multi-layer bumps on a substrate
- Publication number 20070099413
- Publication date May 3, 2007
- Hei Ming Shiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for forming solder contacts on mounted substrates
- Publication number 20070090156
- Publication date Apr 26, 2007
- Lakshmi N. Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for fabricating semiconductor devices so as to stabilize th...
- Publication number 20060189005
- Publication date Aug 24, 2006
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060131745
- Publication date Jun 22, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Yutani
- H01 - BASIC ELECTRIC ELEMENTS

Selective modification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive member cavities

Semiconductor device manufacturing method and semiconductor device

Contact structures with porous networks for solder connections, and...

Method of manufacturing chip-on-chip structure comprising sinterted...

Flip-chip hybridization of microelectronic components by local heat...

Semiconductor device and method of forming vertically offset conduc...

Micro bump and method for forming the same

Conductive bump, method for producing the same, and electronic comp...

Semiconductor device and method of forming vertically offset conduc...

Micro bump and method for forming the same

Semiconductor device and manufacturing method therefor

Electronic component mounting structure and method for manufacturin...

Electrically conductive structure on a semiconductor substrate form...

Semiconductor device and method for manufacturing semiconductor device

Electronic element that includes multilayered bonding interface bet...

Conductive bump, method for manufacturing the conductive bump, semi...

Semiconductor device and manufacturing method therefor

Method of bonding

Reinforced, self-aligning conductive structures for semiconductor d...

Repairable three-dimensional semiconductor subsystem

Method for forming multi-layer bumps on a substrate

Method of providing solder bumps on a substrate using localized hea...

Method for forming multi-layer bumps on a substrate

Support ring for use with a contact pad and semiconductor device co...

Structures for stabilizing semiconductor devices relative to test s...

Methods for providing support for conductive structures protruding...

Methods for forming semiconductor devices so as to stabilize the sa...

Ring positionable about a periphery of a contact pad, semiconductor...

Support ring for use with a contact pad and semiconductor device co...

Ring positionable about a periphery of a contact pad, semiconductor...

Patents Applicationslast 30 patents

CONDUCTIVE MEMBER CAVITIES

MANUFACTURE OF ELECTRONIC CHIPS

CONDUCTIVE MEMBER CAVITIES

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND...

Semiconductor Device Manufacturing Method

Semiconductor Device and Method of Forming Substrate Having Conduct...

FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEAT...

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Micro Bump And Method For Forming The Same

Micro Bump And Method For Forming The Same

Semiconductor Device and Method of Forming Vertically Offset Conduc...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Electrically conductive structure on a semiconductor substrate form...

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD FOR MANUFACTURIN...

CONDUCTIVE BUMP, METHOD FOR MANUFACTURING THE CONDUCTIVE BUMP, SEMI...

CONDUCTIVE BUMP, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC COMP...

CONDUCTIVE BUMP, METHOD FOR FORMING THE SAME, AND ELECTRONIC COMPON...

METHOD OF BONDING

Electronic Element, Electronic Element Device Using the Same, and M...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Method of providing solder bumps on a substrate using localized hea...

Method for forming multi-layer bumps on a substrate

Methods for fabricating reinforced, self-aligning conductive struct...

Electrical connection methods employing corresponding, insulator-co...

Method for forming multi-layer bumps on a substrate

Method for forming solder contacts on mounted substrates

Methods for fabricating semiconductor devices so as to stabilize th...

Semiconductor device and manufacturing method therefor