Selective modification

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CPC
H01L2224/0355

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0355Selective modification

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 12,132,016
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 12,107,057
- Issue date Oct 1, 2024
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of integrated circuit devices and method forming...
- Patent number 11,990,430
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for controlling trapped ions and method of manufacturing the...
- Patent number 11,984,416
- Issue date May 14, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure and manufacturing method thereof and driving s...
- Patent number 11,715,715
- Issue date Aug 1, 2023
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of semiconductor devices
- Patent number 11,444,045
- Issue date Sep 13, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and method of manufacturing the same
- Patent number 11,404,597
- Issue date Aug 2, 2022
- MATERIAL CONCEPT, INC.
- Junichi Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for permanent connection of two metal surfaces
- Patent number 11,282,801
- Issue date Mar 22, 2022
- EV Group E. Thallner GmbH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding corners of light emitting diode chip to substrate using laser
- Patent number 11,255,529
- Issue date Feb 22, 2022
- Facebook Technologies, LLC
- Jeb Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing memory having stacked integrated circuit chip
- Patent number 9,978,736
- Issue date May 22, 2018
- ATP ELECTRONICS TAIWAN INC.
- Tieh-Chin Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure for three-dimensional semiconductor device
- Patent number 9,698,080
- Issue date Jul 4, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate
- Patent number 9,269,677
- Issue date Feb 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Chia-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, packaging substrate and fabrication method t...
- Patent number 8,901,729
- Issue date Dec 2, 2014
- Siliconware Precision Industries Co., Ltd.
- Chia-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of SOI substrate and manufacturing method of s...
- Patent number 8,895,407
- Issue date Nov 25, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Miyairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 8,846,520
- Issue date Sep 30, 2014
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of SOI substrate and manufacturing method of s...
- Patent number 8,772,129
- Issue date Jul 8, 2014
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Miyairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device
- Patent number 8,134,235
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of SOI substrate and manufacturing method of s...
- Patent number 7,820,524
- Issue date Oct 26, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Miyairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,759,177
- Issue date Jul 20, 2010
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20240421109
- Publication date Dec 19, 2024
- EV GROUP E. THALLNER GMBH
- Viorel Dragio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20240371804
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS
- Publication number 20240213193
- Publication date Jun 27, 2024
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...
- Publication number 20230387051
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20230061418
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- YONGBUM KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Structures of Integrated Circuit Devices and Method Forming...
- Publication number 20220238466
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...
- Publication number 20220238471
- Publication date Jul 28, 2022
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...
- Publication number 20220102301
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Clemens Roessler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
- Publication number 20220052000
- Publication date Feb 17, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
- Publication number 20160322318
- Publication date Nov 3, 2016
- EV GROUP E. THALLNER GMBH
- Viorel Dragoi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device
- Publication number 20150380341
- Publication date Dec 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20150364448
- Publication date Dec 17, 2015
- IBIS INNOTECH INC.
- Chih-Kung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGING SUBSTRATE
- Publication number 20150050782
- Publication date Feb 19, 2015
- Siliconware Precision Industries Co., Ltd.
- Chia-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion between Post-Passivation Interconnect Structure and Polymer
- Publication number 20140264853
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE AND FABRICATION METHOD T...
- Publication number 20130161837
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Chia-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130075906
- Publication date Mar 28, 2013
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD
- Publication number 20120178189
- Publication date Jul 12, 2012
- Douglas M. Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Semiconductor Device
- Publication number 20120164789
- Publication date Jun 28, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SOI SUBSTRATE AND MANUFACTURING METHOD OF S...
- Publication number 20110076837
- Publication date Mar 31, 2011
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Hidekazu Miyairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of SOI substrate and manufacturing method of s...
- Publication number 20080286952
- Publication date Nov 20, 2008
- Semiconductor Energy Laboratory Co., Ltd.
- Hidekazu Miyairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional semiconductor device
- Publication number 20080258309
- Publication date Oct 23, 2008
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20070037337
- Publication date Feb 15, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Hidekazu Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Selective modification

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding structures of integrated circuit devices and method forming...

Method for permanent connection of two metal surfaces

Bonding structures of integrated circuit devices and method forming...

Device for controlling trapped ions and method of manufacturing the...

Metal bump structure and manufacturing method thereof and driving s...

Bonding structures of semiconductor devices

Solar cell and method of manufacturing the same

Method for permanent connection of two metal surfaces

Bonding corners of light emitting diode chip to substrate using laser

Contact structures with porous networks for solder connections, and...

Method for manufacturing memory having stacked integrated circuit chip

Conductor structure for three-dimensional semiconductor device

Fabrication method of packaging substrate

Semiconductor package, packaging substrate and fabrication method t...

Manufacturing method of SOI substrate and manufacturing method of s...

Semiconductor device and method for manufacturing semiconductor device

Manufacturing method of SOI substrate and manufacturing method of s...

Three-dimensional semiconductor device

Manufacturing method of SOI substrate and manufacturing method of s...

Manufacturing method of semiconductor device

Patents Applicationslast 30 patents

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

DEVICE FOR CONTROLLING TRAPPED IONS

BONDING STRUCTURES OF INTEGRATED CIRCUIT DEVICES AND METHOD FORMING...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Bonding Structures of Integrated Circuit Devices and Method Forming...

METAL BUMP STRUCTURE AND MANUFACTURING METHOD THEREOF AND DRIVING S...

DEVICE FOR CONTROLLING TRAPPED IONS AND METHOD OF MANUFACTURING THE...

BONDING STRUCTURES OF SEMICONDUCTOR DEVICES

METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES

Three-Dimensional Semiconductor Device

PACKAGE STRUCTURE

FABRICATION METHOD OF PACKAGING SUBSTRATE

Adhesion between Post-Passivation Interconnect Structure and Polymer

SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE AND FABRICATION METHOD T...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Three-Dimensional Semiconductor Device

MANUFACTURING METHOD OF SOI SUBSTRATE AND MANUFACTURING METHOD OF S...

Manufacturing method of SOI substrate and manufacturing method of s...

Three-dimensional semiconductor device

Manufacturing method of semiconductor device