Selective removal of parts of the layer

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CPC
H01L21/76865

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76865Selective removal of parts of the layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,131,949
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom-up formation of contact plugs
- Patent number 12,125,747
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beol tip-to-tip shorting and time dependent dielectric breakdown
- Patent number 12,087,624
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit features with obtuse angles and method of formin...
- Patent number 12,087,715
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,074,062
- Issue date Aug 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Taoyan Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having conductive pad structures with multi-b...
- Patent number 12,051,659
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,040,228
- Issue date Jul 16, 2024
- Kioxia Corporation
- Satoshi Wakatsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structures
- Patent number 12,027,415
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structure for semiconductor device
- Patent number 11,996,326
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 11,984,356
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peng-Soon Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultralow-K dielectric-gap wrapped contacts and method
- Patent number 11,978,661
- Issue date May 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Fuad H. Al-Amoody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structure for semiconductor device
- Patent number 11,929,283
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pin Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contact having barrier layers with different depths
- Patent number 11,929,328
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming fin field effect transistor (FinFET) device stru...
- Patent number 11,923,359
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shu Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure with core and peri...
- Patent number 11,864,373
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,862,513
- Issue date Jan 2, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Xifei Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure of a semiconductor device
- Patent number 11,854,875
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,848,188
- Issue date Dec 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device structure with manganes...
- Patent number 11,824,004
- Issue date Nov 21, 2023
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect structure with manganese barr...
- Patent number 11,804,405
- Issue date Oct 31, 2023
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device using a thermally de...
- Patent number 11,791,209
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seung-Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,764,070
- Issue date Sep 19, 2023
- Tokyo Electron Limited
- Satoshi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing through-silicon via with liner
- Patent number 11,742,242
- Issue date Aug 29, 2023
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,735,471
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ta Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 11,735,477
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Feng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of barrier and liner layers from a bottom of a via
- Patent number 11,735,475
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controllable metal and barrier-liner recess
- Patent number 11,705,366
- Issue date Jul 18, 2023
- Micromaterials LLC
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices having conductive pad...
- Patent number 11,688,703
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier-less prefilled via formation
- Patent number 11,621,189
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240387265
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pin-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
- Publication number 20240387381
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Cheng CHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240379557
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR AN INTERCONNECT STRUCTURE
- Publication number 20240379423
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM-UP FORMATION OF CONTACT PLUGS
- Publication number 20240371691
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITIO...
- Publication number 20240363407
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Jie ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...
- Publication number 20240363561
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Wei Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS
- Publication number 20240321795
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Olivier ORY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures In Semiconductor Devices
- Publication number 20240282627
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Peng-Soon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20240249976
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...
- Publication number 20240234205
- Publication date Jul 11, 2024
- ASM IP HOLDING B.V.
- YoungChol Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- Publication number 20240222268
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- TAKAYOSHI TASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS
- Publication number 20240213087
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRU...
- Publication number 20240178224
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONTACT PLUG
- Publication number 20240162154
- Publication date May 16, 2024
- Micron Technology, Inc.
- KEIICHI TSUCHIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240162084
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...
- Publication number 20240136224
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- YoungChol Byun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20240096697
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
- Publication number 20240079332
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Yang WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
- Publication number 20240071816
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Alyssa N. Scarbrough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
- Publication number 20240063055
- Publication date Feb 22, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
- Publication number 20240047266
- Publication date Feb 8, 2024
- UNITED MICROELECTRONICS CORP.
- Chia-Liang Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION IN FEATURES
- Publication number 20240047269
- Publication date Feb 8, 2024
- LAM RESEARCH CORPORATION
- Jeong-Seok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
- Publication number 20240006237
- Publication date Jan 4, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
- Publication number 20230420295
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Tsung-Han YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230411322
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Hiroaki ASHIDATE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230411296
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- MENG-HSIEN LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20230395429
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kan-Ju LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230386892
- Publication date Nov 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Peimeng WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
- Publication number 20230386914
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Chen KO
- H01 - BASIC ELECTRIC ELEMENTS

Selective removal of parts of the layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bottom-up formation of contact plugs

Bottom-up formation of contact plugs

Beol tip-to-tip shorting and time dependent dielectric breakdown

Integrated circuit features with obtuse angles and method of formin...

Method for manufacturing semiconductor structure

Semiconductor devices having conductive pad structures with multi-b...

Semiconductor device and manufacturing method thereof

Semiconductor device structures

Barrier structure for semiconductor device

Contact structures in semiconductor devices

Ultralow-K dielectric-gap wrapped contacts and method

Barrier structure for semiconductor device

Conductive contact having barrier layers with different depths

Method for forming fin field effect transistor (FinFET) device stru...

Semiconductor structure having air gaps and method for manufacturin...

Method for manufacturing semiconductor structure with core and peri...

Manufacturing method of semiconductor structure

Contact structure of a semiconductor device

Semiconductor device and method for manufacturing the same

Method for fabricating semiconductor device structure with manganes...

Method of forming copper interconnect structure with manganese barr...

Method of manufacturing a semiconductor device using a thermally de...

Etching method and etching apparatus

Method for manufacturing through-silicon via with liner

Semiconductor structure and method for forming the same

Method of semiconductor integrated circuit fabrication

Removal of barrier and liner layers from a bottom of a via

Methods for controllable metal and barrier-liner recess

Methods of fabricating semiconductor devices having conductive pad...

Barrier-less prefilled via formation

Patents Applicationslast 30 patents

CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICES AND METHODS OF FORMATION

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

BARRIER LAYER FOR AN INTERCONNECT STRUCTURE

BOTTOM-UP FORMATION OF CONTACT PLUGS

LOW-ENERGY UNDERLAYER FOR ROOM TEMPERATURE PHYSICAL VAPOR DEPOSITIO...

INTEGRATED CIRCUIT FEATURES WITH OBTUSE ANGLES AND METHOD OF FORMIN...

METHOD FOR MANUFACTURING A PLURALITY OF ELECTRONIC COMPONENTS

Contact Structures In Semiconductor Devices

SEMICONDUCTOR DEVICE STRUCTURES

METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...

SEMICONDUCTOR DEVICE HAVING CONTACT PLUG

ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS

METHOD FOR FORMING FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRU...

SEMICONDUCTOR DEVICE HAVING CONTACT PLUG

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS

STAIRCASE FORMATION IN A MEMORY ARRAY

MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE

METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS

MOLYBDENUM DEPOSITION IN FEATURES

METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...

TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES