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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76865
Selective removal of parts of the layer
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last 30 patents
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Barrier structure for semiconductor device
Patent number
11,929,283
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Pin Chi Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Conductive contact having barrier layers with different depths
Patent number
11,929,328
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Yang Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for forming fin field effect transistor (FinFET) device stru...
Patent number
11,923,359
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Shu Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
Patent number
11,923,243
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsin-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Manufacturing method of semiconductor structure
Patent number
11,862,513
Issue date
Jan 2, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Xifei Bao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing semiconductor structure with core and peri...
Patent number
11,864,373
Issue date
Jan 2, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Mengmeng Yang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contact structure of a semiconductor device
Patent number
11,854,875
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Joanna Chaw Yane Yin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
11,848,188
Issue date
Dec 19, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC.
Wei Gao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for fabricating semiconductor device structure with manganes...
Patent number
11,824,004
Issue date
Nov 21, 2023
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of forming copper interconnect structure with manganese barr...
Patent number
11,804,405
Issue date
Oct 31, 2023
TESSERA LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing a semiconductor device using a thermally de...
Patent number
11,791,209
Issue date
Oct 17, 2023
Samsung Electronics Co., Ltd.
Seung-Heon Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Etching method and etching apparatus
Patent number
11,764,070
Issue date
Sep 19, 2023
Tokyo Electron Limited
Satoshi Toda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method for manufacturing through-silicon via with liner
Patent number
11,742,242
Issue date
Aug 29, 2023
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor structure and method for forming the same
Patent number
11,735,471
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chia-Ta Yu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of semiconductor integrated circuit fabrication
Patent number
11,735,477
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Feng Shieh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Removal of barrier and liner layers from a bottom of a via
Patent number
11,735,475
Issue date
Aug 22, 2023
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods for controllable metal and barrier-liner recess
Patent number
11,705,366
Issue date
Jul 18, 2023
Micromaterials LLC
He Ren
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Methods of fabricating semiconductor devices having conductive pad...
Patent number
11,688,703
Issue date
Jun 27, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Hsun Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Barrier-less prefilled via formation
Patent number
11,621,189
Issue date
Apr 4, 2023
International Business Machines Corporation
Nicholas Anthony Lanzillo
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of fabricating a semiconductor device having a liner layer w...
Patent number
11,545,390
Issue date
Jan 3, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Joanna Chaw Yane Yin
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Conductive interconnects and methods of forming conductive intercon...
Patent number
11,545,391
Issue date
Jan 3, 2023
Micron Technology, Inc.
Raju Ahmed
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Dynamic random access memory and method of manufacturing the same
Patent number
11,538,811
Issue date
Dec 27, 2022
Winbond Electronics Corp.
Yi-Sheng Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Contacts and interconnect structures in field-effect transistors
Patent number
11,532,510
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Chung-Liang Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fin field effect transistor (FinFET) device structure with intercon...
Patent number
11,532,512
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Che-Cheng Chang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device, semiconductor memory device, and semiconducto...
Patent number
11,527,478
Issue date
Dec 13, 2022
Kioxia Corporation
Mitsuo Ikeda
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device with self-aligned vias
Patent number
11,502,001
Issue date
Nov 15, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chien-Han Chen
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Integrated circuit features with obtuse angles and method of formin...
Patent number
11,495,558
Issue date
Nov 8, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Shu-Wei Chung
G06 - COMPUTING CALCULATING COUNTING
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Patent Grant
Semiconductor device structure with manganese-containing conductive...
Patent number
11,488,905
Issue date
Nov 1, 2022
NANYA TECHNOLOGY CORPORATION
Teng-Yen Huang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of manufacturing a semiconductor device using a thermally de...
Patent number
11,482,453
Issue date
Oct 25, 2022
Samsung Electronics Co., Ltd.
Seung-Heon Lee
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device structures
Patent number
11,476,156
Issue date
Oct 18, 2022
Taiwan Semiconductor Manufacturing Co., Ltd
Hsin-Che Chiang
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHODS FOR FILLING A RECESSED FEATURE ON A SUBSTRATE AND RELATED S...
Publication number
20240136224
Publication date
Apr 25, 2024
ASM IP HOLDING B.V.
YoungChol Byun
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
Publication number
20240096697
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Joanna Chaw Yane YIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE CONTACT HAVING BARRIER LAYERS WITH DIFFERENT DEPTHS
Publication number
20240079332
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., LTD
Chia-Yang WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STAIRCASE FORMATION IN A MEMORY ARRAY
Publication number
20240071816
Publication date
Feb 29, 2024
Micron Technology, Inc.
Alyssa N. Scarbrough
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MANUFACTURING METHOD FOR DEVICE EMBEDDED PACKAGING STRUCTURE
Publication number
20240063055
Publication date
Feb 22, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING PROTECTIVE LAYER UTILIZED IN SILICON REMOVE PROCESS
Publication number
20240047266
Publication date
Feb 8, 2024
UNITED MICROELECTRONICS CORP.
Chia-Liang Liao
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
MOLYBDENUM DEPOSITION IN FEATURES
Publication number
20240047269
Publication date
Feb 8, 2024
LAM RESEARCH CORPORATION
Jeong-Seok NA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING COPPER INTERCONNECT STRUCTURE WITH MANGANESE BARR...
Publication number
20240006237
Publication date
Jan 4, 2024
Adeia Semiconductor Solutions LLC
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TREATMENT OF TUNGSTEN SURFACE FOR TUNGSTEN GAP-FILL
Publication number
20230420295
Publication date
Dec 28, 2023
Applied Materials, Inc.
Tsung-Han YANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230411322
Publication date
Dec 21, 2023
KIOXIA Corporation
Hiroaki ASHIDATE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230411296
Publication date
Dec 21, 2023
Taiwan Semiconductor Manufacturing company Ltd.
MENG-HSIEN LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE STRUCTURES AND METHODS OF FORMING THE SAME
Publication number
20230395429
Publication date
Dec 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Kan-Ju LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
Publication number
20230386892
Publication date
Nov 30, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Peimeng WANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURES
Publication number
20230386914
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Chen KO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bottom-up Formation of Contact Plugs
Publication number
20230386917
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Yen-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20230369102
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Ta YU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
METHOD OF FABRICATING CONTACT STRUCTURE
Publication number
20230360969
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Ting Chung
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WET RECESS FOR RU SUBTRACTIVE PROCESS
Publication number
20230361032
Publication date
Nov 9, 2023
Samsung Electronics Co., Ltd.
Wonhyuk HONG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
FILM SCHEME TO REDUCE PLASMA-INDUCED DAMAGE
Publication number
20230343642
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Wen Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GRADIENT OXIDATION AND ETCH OF PVD MOLYBDENUM FOR BOTTOM UP GAP FILL
Publication number
20230343645
Publication date
Oct 26, 2023
Applied Materials, Inc.
Meng-Shan WU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
GRADIENT OXIDATION AND ETCH FOR PVD METAL AS BOTTOM LINER IN BOTTOM...
Publication number
20230343643
Publication date
Oct 26, 2023
Applied Materials, Inc.
Chih-Hsun HSU
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FORMATION
Publication number
20230299002
Publication date
Sep 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Shu-Cheng CHIN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
ADDITIVE INTERCONNECT FORMATION
Publication number
20230290682
Publication date
Sep 14, 2023
International Business Machines Corporation
Ashim Dutta
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230282512
Publication date
Sep 7, 2023
Samsung Electronics Co., Ltd.
Kyung Wook KIM
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-B...
Publication number
20230275049
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsun HUANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
CONTACT FEATURES OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
Publication number
20230223302
Publication date
Jul 13, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Pin-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR ETCH BARRIER DEPOSITION AND DEVICES MADE ACCORDING TO T...
Publication number
20230215762
Publication date
Jul 6, 2023
Georgia Tech Research Corporation
Pratik Nimbalkar
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER
Publication number
20230197511
Publication date
Jun 22, 2023
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20230154791
Publication date
May 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chin-Lung Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fin Field Effect Transistor (FinFET) Device Structure with Intercon...
Publication number
20230116545
Publication date
Apr 13, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Che-Cheng CHANG
H01 - BASIC ELECTRIC ELEMENTS