Self-alignment during soldering Terminals, pads or shape of solder adapted therefor

Industry

CPC
H05K2203/048

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/048Self-alignment during soldering Terminals, pads or shape of solder adapted therefor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Right angle sidewall and button interconnects for molded SiPs
- Patent number 11,765,838
- Issue date Sep 19, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection arrangement, component carrier and method of forming a c...
- Patent number 11,658,142
- Issue date May 23, 2023
- AT&SAustria Technologie & Systemtechnik AG
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for precision placement of components
- Patent number 11,510,351
- Issue date Nov 22, 2022
- Engent, Inc.
- Giorgos Hatzilias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light device, headlight and method
- Patent number 11,499,688
- Issue date Nov 15, 2022
- Osram GmbH
- Markus Stange
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Signal transmission apparatus and display apparatus
- Patent number 11,474,572
- Issue date Oct 18, 2022
- HKC CORPORATION LIMITED
- Huailiang He
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Land for surface mounted component
- Patent number 11,399,431
- Issue date Jul 26, 2022
- Sony Corporation
- Norikimi Moriuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder printing inspection device, solder printing inspection metho...
- Patent number 11,184,984
- Issue date Nov 23, 2021
- CKD Corporation
- Manabu Okuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spoked solder pad to improve solderability and self-alignment of in...
- Patent number 10,957,663
- Issue date Mar 23, 2021
- Myron Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,679,931
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accurate positioning and alignment of a component during processes...
- Patent number 10,667,387
- Issue date May 26, 2020
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic filter with window coupling
- Patent number 10,587,025
- Issue date Mar 10, 2020
- Alan Scott Brannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductor and printed circuit board
- Patent number 10,475,569
- Issue date Nov 12, 2019
- Taiyo Yuden Co., Ltd.
- Masuo Yatabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mount structure, electronic component, and met...
- Patent number 10,475,584
- Issue date Nov 12, 2019
- Murata Manufacturing Co., Ltd.
- Akio Masunari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure mounted with electronic component
- Patent number 10,342,130
- Issue date Jul 2, 2019
- Murata Manufacturing Co., Ltd.
- Kiyoyuki Nakagawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Ball grid array and land grid array assemblies fabricated using tem...
- Patent number 10,249,559
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed module
- Patent number 10,251,277
- Issue date Apr 2, 2019
- Murata Manufacturing Co., Ltd.
- Shota Ishihara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component mount structure, electronic component, and met...
- Patent number 10,236,124
- Issue date Mar 19, 2019
- Murata Manufacturing Co., Ltd.
- Akio Masunari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spoked solder pad to improve solderability and self-alignment of in...
- Patent number 10,134,696
- Issue date Nov 20, 2018
- Myron Walker
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device mounting structure, backlight device, and moun...
- Patent number 10,129,977
- Issue date Nov 13, 2018
- Nichia Corporation
- Takuya Nakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit device
- Patent number 10,070,529
- Issue date Sep 4, 2018
- Mitsubishi Electric Corporation
- Eitaro Fukuzumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual solder layer for fluidic self assembly and electrical componen...
- Patent number 10,039,194
- Issue date Jul 31, 2018
- OSRAM SYLVANIA Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Planar lighting device and mounting substrate including conduction...
- Patent number 10,028,382
- Issue date Jul 17, 2018
- Minebea Co., Ltd.
- Tomotaka Horikawa
- G02 - OPTICS
Information Patent Grant
Light emitting device and wiring board thereof
- Patent number 10,008,651
- Issue date Jun 26, 2018
- Nichia Corporation
- Masato Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable conductive polymer thick film composition
- Patent number 9,986,650
- Issue date May 29, 2018
- Heracus Precious Metals North America Conshohocken LLC
- Samson Shahbazi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lamp using ultra-small LED electrode assembly
- Patent number 9,978,725
- Issue date May 22, 2018
- PSI CO., LTD.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed circuit board with embedded electro...
- Patent number 9,974,186
- Issue date May 15, 2018
- Unitech Printed Circuit Board Corp.
- Ming Yi Yeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, mounted electronic component, and method for...
- Patent number 9,967,980
- Issue date May 8, 2018
- Murata Manufacturing Co., Ltd.
- Akio Masunari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pads, methods, and systems for circuitry components
- Patent number 9,961,770
- Issue date May 1, 2018
- Cree, Inc.
- Andrew K. Dummer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and vehicle brake hydraulic pressure control unit
- Patent number 9,821,787
- Issue date Nov 21, 2017
- AUTOLIV NISSIN BRAKE SYSTEMS JAPAN CO., LTD.
- Sakae Miyasaka
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240227089
- Publication date Jul 11, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...
- Publication number 20240206072
- Publication date Jun 20, 2024
- Lumileds LLC
- Say Chun OOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...
- Publication number 20240131633
- Publication date Apr 25, 2024
- Sekisui Chemical Co., Ltd.
- Hidefumi YASUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Right Angle Sidewall and Button Interconnects for Molded SiPs
- Publication number 20230055647
- Publication date Feb 23, 2023
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection Arrangement, Component Carrier and Method of Forming a C...
- Publication number 20210074662
- Publication date Mar 11, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Heinz Moitzi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PRECISION PLACEMENT OF COMPONENTS
- Publication number 20200221615
- Publication date Jul 9, 2020
- Engent, Inc.
- Giorgos Hatzilias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PRINTING INSPECTION DEVICE, SOLDER PRINTING INSPECTION METHO...
- Publication number 20190357361
- Publication date Nov 21, 2019
- CKD CORPORATION
- Manabu Okuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...
- Publication number 20190229045
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNT STRUCTURE, ELECTRONIC COMPONENT, AND MET...
- Publication number 20190157007
- Publication date May 23, 2019
- Murata Manufacturing Co., Ltd.
- Akio MASUNARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...
- Publication number 20190088605
- Publication date Mar 21, 2019
- Myron WALKER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE
- Publication number 20180359864
- Publication date Dec 13, 2018
- PITYU CONTROLS INC.
- Stevan DOBI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...
- Publication number 20180235080
- Publication date Aug 16, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PASTE AND ELECTRONIC PART
- Publication number 20160066421
- Publication date Mar 3, 2016
- FUJITSU LIMITED
- Kazuhiro Kitamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...
- Publication number 20150319863
- Publication date Nov 5, 2015
- Dhananjaya Turpuseema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERABLE CONDUCTIVE POLYMER THICK FILM COMPOSITION
- Publication number 20150257279
- Publication date Sep 10, 2015
- Heraeus Precious Metals North America Conshohocken LLC
- Samson Shahbazi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...
- Publication number 20150223346
- Publication date Aug 6, 2015
- Osram Sylvania Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...
- Publication number 20140318850
- Publication date Oct 30, 2014
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT...
- Publication number 20140218881
- Publication date Aug 7, 2014
- RICOH COMPANY, LTD.
- Yuichi Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELEC...
- Publication number 20130199831
- Publication date Aug 8, 2013
- Christopher Morris
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLANAR LIGHTING DEVICE
- Publication number 20130188394
- Publication date Jul 25, 2013
- MINEBEA CO., LTD.
- Tomotaka HORIKAWA
- G02 - OPTICS
Information Patent Application
CIRCUIT ARRANGEMENT FOR ELECTRONIC AND/OR ELECTRICAL COMPONENTS
- Publication number 20130128480
- Publication date May 23, 2013
- ROBERT BOSCH GmbH
- Alexander Bareiss
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball Loading Mask, Apparatus And Associated Methodology
- Publication number 20120080504
- Publication date Apr 5, 2012
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Ball Loading Mask, Apparatus and Associated Methodology
- Publication number 20120080505
- Publication date Apr 5, 2012
- IBIDEN, CO., LTD.
- Shigeki Sawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUT-EDGE POSITIONING TYPE SOLDERING STRUCTURE AND METHOD FOR PREVEN...
- Publication number 20110310578
- Publication date Dec 22, 2011
- ASKEY COMPUTER CORP.
- Hsiang-Chih Ni
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BONDING PAD STRUCTURE
- Publication number 20110292625
- Publication date Dec 1, 2011
- Wintek Corporation
- HAN-CHUNG CHEN
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ENHANCED MAGNETIC SELF-ASSEMBLY USING INTEGRATED MICROMAGNETS
- Publication number 20110179640
- Publication date Jul 28, 2011
- University of Florida Research Foundation, Inc.
- David Patrick Arnold
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES
- Publication number 20110151627
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Richard S. Graf
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN, AND METHOD OF MANUFACT...
- Publication number 20110103029
- Publication date May 5, 2011
- Shinko Electric Industries Co., Ltd.
- Masakuni KITAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS
- Publication number 20110023292
- Publication date Feb 3, 2011
- Shinko Electric Industries Co., Ltd.
- Hideaki Sakaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Self-alignment during soldering Terminals, pads or shape of solder adapted therefor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and electronic apparatus

Right angle sidewall and button interconnects for molded SiPs

Connection arrangement, component carrier and method of forming a c...

Systems and methods for precision placement of components

Light device, headlight and method

Signal transmission apparatus and display apparatus

Land for surface mounted component

Solder printing inspection device, solder printing inspection metho...

Spoked solder pad to improve solderability and self-alignment of in...

Ball grid array and land grid array assemblies fabricated using tem...

Accurate positioning and alignment of a component during processes...

Ceramic filter with window coupling

Inductor and printed circuit board

Electronic component mount structure, electronic component, and met...

Structure mounted with electronic component

Ball grid array and land grid array assemblies fabricated using tem...

Resin-sealed module

Electronic component mount structure, electronic component, and met...

Spoked solder pad to improve solderability and self-alignment of in...

Semiconductor device mounting structure, backlight device, and moun...

Electronic circuit device

Dual solder layer for fluidic self assembly and electrical componen...

Planar lighting device and mounting substrate including conduction...

Light emitting device and wiring board thereof

Solderable conductive polymer thick film composition

LED lamp using ultra-small LED electrode assembly

Method of manufacturing printed circuit board with embedded electro...

Electronic component, mounted electronic component, and method for...

Solder pads, methods, and systems for circuitry components

Circuit board and vehicle brake hydraulic pressure control unit

Patents Applicationslast 30 patents

BONDING SHEET AND METHOD FOR PRODUCING SAME

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...

NON-ELECTROCONDUCTIVE FLUX, CONNECTED STRUCTURE, AND METHOD FOR PRO...

Right Angle Sidewall and Button Interconnects for Molded SiPs

Connection Arrangement, Component Carrier and Method of Forming a C...

SYSTEMS AND METHODS FOR PRECISION PLACEMENT OF COMPONENTS

SOLDER PRINTING INSPECTION DEVICE, SOLDER PRINTING INSPECTION METHO...

BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEM...

ELECTRONIC COMPONENT MOUNT STRUCTURE, ELECTRONIC COMPONENT, AND MET...

SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...

METAL ELECTRODE LEADLESS FACE (MELF) DEVICE CRADLE

ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...

SOLDER PASTE AND ELECTRONIC PART

STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT...

SOLDERABLE CONDUCTIVE POLYMER THICK FILM COMPOSITION

DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...

MOUNTING METHOD OF ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MOUNT...

ELECTROMAGNETIC FIELD ASSISTED SELF-ASSEMBLY WITH FORMATION OF ELEC...

PLANAR LIGHTING DEVICE

CIRCUIT ARRANGEMENT FOR ELECTRONIC AND/OR ELECTRICAL COMPONENTS

Solder Ball Loading Mask, Apparatus And Associated Methodology

Solder Ball Loading Mask, Apparatus and Associated Methodology

CUT-EDGE POSITIONING TYPE SOLDERING STRUCTURE AND METHOD FOR PREVEN...

BONDING PAD STRUCTURE

ENHANCED MAGNETIC SELF-ASSEMBLY USING INTEGRATED MICROMAGNETS

OVERCOMING LAMINATE WARPAGE AND MISALIGNMENT IN FLIP-CHIP PACKAGES

LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN, AND METHOD OF MANUFACT...

CONDUCTIVE BALL MOUNTING METHOD AND APPARATUS