semiconducting

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CPC
B23K2203/56

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BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K2203/00Materials to be soldered, welded or cut

Current Industry

B23K2203/56semiconducting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing single-crystal substrate
- Patent number 10,157,793
- Issue date Dec 18, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,157,877
- Issue date Dec 18, 2018
- Fuji Electric Co., Ltd.
- Kazumasa Kido
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Laser machining device and laser machining method
- Patent number 10,124,439
- Issue date Nov 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser machining device and laser machining method
- Patent number 10,124,440
- Issue date Nov 13, 2018
- Hamamatsu Photonics K.K.
- Daisuke Kawaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid feed slot for fluid ejection device
- Patent number 10,118,392
- Issue date Nov 6, 2018
- Hewlett-Packard Development Company, L.P.
- Ed Friesen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a virtual germanium substrate using a laser
- Patent number 10,115,854
- Issue date Oct 30, 2018
- Newsouth Innovations Pty Limited
- Xiaojing Hao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC wafer producing method
- Patent number 10,112,256
- Issue date Oct 30, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
SiC substrate separating method
- Patent number 10,105,792
- Issue date Oct 23, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modifying the surface chemistry of a material
- Patent number 10,106,880
- Issue date Oct 23, 2018
- The United States of America, as represented by the Secretary of the Navy
- Steven Seghi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Formation of heteroepitaxial layers with rapid thermal processing t...
- Patent number 10,090,153
- Issue date Oct 2, 2018
- Ultratech, Inc.
- Andrew M. Hawryluk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating substrates and semiconductor chip
- Patent number 10,090,198
- Issue date Oct 2, 2018
- Osram Opto Semiconductors GmbH
- Mathias Kaempf
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,081,076
- Issue date Sep 25, 2018
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Combined method for producing solids, involving laser treatment and...
- Patent number 10,079,171
- Issue date Sep 18, 2018
- Siltectra, GmbH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 10,076,804
- Issue date Sep 18, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus
- Patent number 10,071,442
- Issue date Sep 11, 2018
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing group III nitride substrate formed of a gr...
- Patent number 10,053,796
- Issue date Aug 21, 2018
- Sumitomo Chemical Company, Limited
- Takehiro Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for reducing pulsed laser beam profile non-unif...
- Patent number 10,016,843
- Issue date Jul 10, 2018
- Ultratech, Inc.
- Yun Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for performing laser curved filamentation with...
- Patent number 10,010,971
- Issue date Jul 3, 2018
- ROFIN-SINAR TECHNOLOGIES LLC
- S. Abbas Hosseini
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for forming apertures in microfeature workpieces
- Patent number 10,010,977
- Issue date Jul 3, 2018
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive sheet for laser dicing and method for manufacturing semico...
- Patent number 10,008,406
- Issue date Jun 26, 2018
- Denka Company Limited
- Gosuke Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,002,808
- Issue date Jun 19, 2018
- Renesas Electronics Corporation
- Yoshiyuki Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 9,981,339
- Issue date May 29, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing SiC wafer
- Patent number 9,975,202
- Issue date May 22, 2018
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of separating chips from a wafer
- Patent number 9,978,643
- Issue date May 22, 2018
- Frank Kriebel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid feed slot for fluid ejection device
- Patent number 9,962,938
- Issue date May 8, 2018
- Hewlett-Packard Development Company, L.P.
- Ed Friesen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dynamic optical valve for mitigating non-uniform heating in laser p...
- Patent number 9,958,709
- Issue date May 1, 2018
- Applied Materials, Inc.
- Bruce E. Adams
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing apparatus, nozzle, and dicing apparatus
- Patent number 9,947,571
- Issue date Apr 17, 2018
- Kabushiki Kaisha Toshiba
- Masamune Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin plate separating method
- Patent number 9,941,130
- Issue date Apr 10, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leakage laser beam detecting method
- Patent number 9,929,105
- Issue date Mar 27, 2018
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer producing method
- Patent number 9,925,619
- Issue date Mar 27, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EXCIMER LASER ANNEALING APPARATUS
- Publication number 20190198364
- Publication date Jun 27, 2019
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Weibin ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20180339365
- Publication date Nov 29, 2018
- Disco Corporation
- Takashi Sampei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CUTTING CONTROL AND INSPECTION
- Publication number 20180311762
- Publication date Nov 1, 2018
- ASM Technology Singapore Pte Ltd
- Karel Maykel Richard VAN DER STAM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES
- Publication number 20180304411
- Publication date Oct 25, 2018
- Micron Technology, Inc.
- Charles M. Watkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE
- Publication number 20180281116
- Publication date Oct 4, 2018
- Hamamatsu Photonics K.K.
- Takafumi OGIWARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FEMTOSECOND LASER-INDUCED FORMATION OF SINGLE CRYSTAL PATTERNED SEM...
- Publication number 20180277366
- Publication date Sep 27, 2018
- The Regents of the University of Michigan
- Michael J. ABERE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID EJECTION DEVICE
- Publication number 20180229502
- Publication date Aug 16, 2018
- Hewlett-Packard Development Company, L.P.
- Ed Friesen
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20180158758
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP WITH LARGE AND SMALL...
- Publication number 20180158792
- Publication date Jun 7, 2018
- SII Semiconductor Corporation
- Makoto TAKESAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLITTING OF A SOLID USING CONVERSION OF MATERIAL
- Publication number 20180133834
- Publication date May 17, 2018
- SILTECTRA GMBH
- Christian Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPLITTING OF A SOLID USING CONVERSION OF MATERIAL
- Publication number 20180126484
- Publication date May 10, 2018
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMIC...
- Publication number 20180117706
- Publication date May 3, 2018
- Osram Opto Semiconductors GmbH
- Mathias KAEMPF
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20180102288
- Publication date Apr 12, 2018
- Disco Corporation
- Taewoo Bae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiC WAFER PRODUCING METHOD
- Publication number 20180085851
- Publication date Mar 29, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser Irradiation Device, Laser Irradiation System, and Method for...
- Publication number 20180085858
- Publication date Mar 29, 2018
- TOYOKOH Co., Ltd.
- Hiroyasu TOYOSAWA
- B08 - CLEANING
Information Patent Application
METHOD OF PRODUCING SiC WAFER
- Publication number 20180056440
- Publication date Mar 1, 2018
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SiC WAFER PRODUCING METHOD
- Publication number 20180043468
- Publication date Feb 15, 2018
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUSES FOR LASER PROCESSING MATERIALS
- Publication number 20180029165
- Publication date Feb 1, 2018
- Corning Incorporated
- Richard Grundmueller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP AND METHOD OF MANUFACTURING CHIPS
- Publication number 20180015569
- Publication date Jan 18, 2018
- NANYA TECHNOLOGY CORPORATION
- Po-Chun LIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NONPLANAR WAFER AND METHOD FOR PRODUCING A NONPLANAR WAFER
- Publication number 20180001416
- Publication date Jan 4, 2018
- SILTECTRA GMBH
- Jan Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE SHEET FOR LASER DICING AND METHOD FOR MANUFACTURING SEMICO...
- Publication number 20170365500
- Publication date Dec 21, 2017
- Denka Company Limited
- Gosuke Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20170348796
- Publication date Dec 7, 2017
- Disco Corporation
- Yoko Nishino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAKAGE LASER BEAM DETECTING METHOD
- Publication number 20170352627
- Publication date Dec 7, 2017
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR SEPARATING A SUBSTRATE
- Publication number 20170341971
- Publication date Nov 30, 2017
- LPKF Laser & Electronics AG
- Robin Alexander Krueger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20170338118
- Publication date Nov 23, 2017
- Disco Corporation
- Yuta Yoshida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER DICING DEVICE
- Publication number 20170320165
- Publication date Nov 9, 2017
- TOKYO SEIMITSU CO., LTD.
- Kazushi HYAKUMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PRODUCING METHOD AND PROCESSING FEED DIRECTION DETECTING METHOD
- Publication number 20170291255
- Publication date Oct 12, 2017
- Disco Corporation
- Kazuya Hirata
- C30 - CRYSTAL GROWTH
Information Patent Application
WAFER PRODUCING METHOD
- Publication number 20170291254
- Publication date Oct 12, 2017
- Disco Corporation
- Kazuya Hirata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20170263473
- Publication date Sep 14, 2017
- Disco Corporation
- Tsutomu Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF HETEROEPITAXIAL LAYERS WITH RAPID THERMAL PROCESSING T...
- Publication number 20170256394
- Publication date Sep 7, 2017
- Ultratech, Inc.
- Andrew M. Hawryluk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

semiconducting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of processing single-crystal substrate

Semiconductor device and manufacturing method of semiconductor device

Laser machining device and laser machining method

Laser machining device and laser machining method

Fluid feed slot for fluid ejection device

Method for forming a virtual germanium substrate using a laser

SiC wafer producing method

SiC substrate separating method

Modifying the surface chemistry of a material

Formation of heteroepitaxial layers with rapid thermal processing t...

Method for separating substrates and semiconductor chip

Wafer producing method

Combined method for producing solids, involving laser treatment and...

Wafer producing method

Laser processing apparatus

Method for manufacturing group III nitride substrate formed of a gr...

Systems and methods for reducing pulsed laser beam profile non-unif...

Method and apparatus for performing laser curved filamentation with...

Systems and methods for forming apertures in microfeature workpieces

Adhesive sheet for laser dicing and method for manufacturing semico...

Semiconductor device manufacturing method and semiconductor device

Wafer producing method

Method of producing SiC wafer

Method of separating chips from a wafer

Fluid feed slot for fluid ejection device

Dynamic optical valve for mitigating non-uniform heating in laser p...

Processing apparatus, nozzle, and dicing apparatus

Thin plate separating method

Leakage laser beam detecting method

Wafer producing method

Patents Applicationslast 30 patents

EXCIMER LASER ANNEALING APPARATUS

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

SUBSTRATE CUTTING CONTROL AND INSPECTION

SYSTEMS AND METHODS FOR FORMING APERTURES IN MICROFEATURE WORKPIECES

LASER PROCESSING METHOD, AND LASER PROCESSING DEVICE

FEMTOSECOND LASER-INDUCED FORMATION OF SINGLE CRYSTAL PATTERNED SEM...

FLUID EJECTION DEVICE

Leadframe and method of manufacturing the same

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP WITH LARGE AND SMALL...

SPLITTING OF A SOLID USING CONVERSION OF MATERIAL

SPLITTING OF A SOLID USING CONVERSION OF MATERIAL

METHOD FOR DIVIDING A COMPOSITE INTO SEMICONDUCTOR CHIPS, AND SEMIC...

WAFER PROCESSING METHOD

SiC WAFER PRODUCING METHOD

Laser Irradiation Device, Laser Irradiation System, and Method for...

METHOD OF PRODUCING SiC WAFER

SiC WAFER PRODUCING METHOD

METHODS AND APPARATUSES FOR LASER PROCESSING MATERIALS

CHIP AND METHOD OF MANUFACTURING CHIPS

NONPLANAR WAFER AND METHOD FOR PRODUCING A NONPLANAR WAFER

ADHESIVE SHEET FOR LASER DICING AND METHOD FOR MANUFACTURING SEMICO...

WAFER PRODUCING METHOD

LEAKAGE LASER BEAM DETECTING METHOD

METHOD AND DEVICE FOR SEPARATING A SUBSTRATE

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

LASER DICING DEVICE

WAFER PRODUCING METHOD AND PROCESSING FEED DIRECTION DETECTING METHOD

WAFER PRODUCING METHOD

LASER PROCESSING APPARATUS

FORMATION OF HETEROEPITAXIAL LAYERS WITH RAPID THERMAL PROCESSING T...