TREA

Semiconductor purity grades

Follow

Industry

  • CPC
  • H01L2924/012
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/012Semiconductor purity grades
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240113066
    • Publication date Apr 4, 2024
    • Sony Semiconductor Solutions Corporation
    • Takashi IMAHIGASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE BONDING METHOD AND DIE BONDING APPARATUS
    • Publication number 20230028219
    • Publication date Jan 26, 2023
    • SEMES CO., LTD.
    • Chang Jin KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICE
    • Publication number 20230013769
    • Publication date Jan 19, 2023
    • NIPPON MICROMETAL CORPORATION
    • Ryo OISHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRE BONDING SYSTEMS AND RELATED METHODS
    • Publication number 20190013290
    • Publication date Jan 10, 2019
    • Semiconductor Components Industries, LLC
    • Wentao QIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20180122765
    • Publication date May 3, 2018
    • NIPPON MICROMETAL CORPORATION
    • Daizo ODA
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20180005981
    • Publication date Jan 4, 2018
    • Rohm Co., Ltd.
    • Motoharu HAGA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20150054146
    • Publication date Feb 26, 2015
    • SUMITOMO BAKELITE CO., LTD.
    • Shingo Itoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE...
    • Publication number 20150014399
    • Publication date Jan 15, 2015
    • Tanaka Kikinzoku Kogyo K.K.
    • Toshinori Ogashiwa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
    • Publication number 20140295619
    • Publication date Oct 2, 2014
    • Tanaka Kikinzoku Kogyo K.K.
    • TOSHINORI OGASHIWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20140035115
    • Publication date Feb 6, 2014
    • SUMITOMO BAKELITE CO., LTD.
    • Shin-ichi Zenbutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120306077
    • Publication date Dec 6, 2012
    • RENESAS ELECTRONICS CORPORATION
    • Takekazu Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120292774
    • Publication date Nov 22, 2012
    • Shingo Itoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
    • Publication number 20120111927
    • Publication date May 10, 2012
    • LSI Corporation
    • Frank A. Baiocchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20120104613
    • Publication date May 3, 2012
    • NIPPON MICROMETAL CORPORATION
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20120074551
    • Publication date Mar 29, 2012
    • Renesas Electronics Corporation
    • Mitsuru OHTA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME
    • Publication number 20110304046
    • Publication date Dec 15, 2011
    • ON SEMICONDUCTOR TRADING, LTD. a Bermuda limited company
    • Takashi Kitazawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BUMP, METHOD FOR FORMING THE BUMP, AND METHOD FOR MOUNTING SUBSTRAT...
    • Publication number 20110272802
    • Publication date Nov 10, 2011
    • Toshinori Ogashiwa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device
    • Publication number 20110241204
    • Publication date Oct 6, 2011
    • RENESAS ELECTRONICS CORPORATION
    • Takekazu Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ALUMINUM FOR ULTRASONIC BONDING
    • Publication number 20110236697
    • Publication date Sep 29, 2011
    • TANAKA DENSHI KOGYO, K.K.
    • Michitaka Mikami
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Bonding Connection Between a Bonding Wire and a Power Semiconductor...
    • Publication number 20110121458
    • Publication date May 26, 2011
    • INFINEON TECHNOLOGIES AG
    • Dirk Siepe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING STRUCTURE OF BONDING WIRE
    • Publication number 20110104510
    • Publication date May 5, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110089549
    • Publication date Apr 21, 2011
    • SUMITOMO BAKELITE CO., LTD.
    • Shin-ichi Zenbutsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20110062585
    • Publication date Mar 17, 2011
    • NEC Electronics Corporation
    • Takekazu Tanaka
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING WIRE
    • Publication number 20110058979
    • Publication date Mar 10, 2011
    • TANAKA DENSHI KOGYO K.K.
    • Hiroshi Murai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE UNDER BONDING PAD USING SINGLE METALLIZATION
    • Publication number 20110037177
    • Publication date Feb 17, 2011
    • Semiconductor Manufacturing International (Shanghai) Corporation
    • CHI KANG LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
    • Publication number 20110011618
    • Publication date Jan 20, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    BONDING WIRE FOR SEMICONDUCTOR DEVICES
    • Publication number 20110011619
    • Publication date Jan 20, 2011
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD
    • Publication number 20100327450
    • Publication date Dec 30, 2010
    • Nippon Steel Materials Co., Ltd.
    • Tomohiro Uno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    AU ALLOY WIRE FOR BALL BONDING
    • Publication number 20100314156
    • Publication date Dec 16, 2010
    • TANAKA DENSHI KOGYO K.K.
    • Mitsuo Takada
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY
    • Publication number 20100300741
    • Publication date Dec 2, 2010
    • LSI Corporation
    • Frank A. Baiocchi
    • H01 - BASIC ELECTRIC ELEMENTS