Semiconductor wafers

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CPC
B32B2457/14

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B32Layered products B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT B32B2457/00Electrical equipment

Current Industry

B32B2457/14Semiconductor wafers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for processing substrate
- Patent number 12,198,950
- Issue date Jan 14, 2025
- Semes Co., Ltd.
- Myung A Jeon
- B08 - CLEANING
Information Patent Grant
Separating method, separating apparatus, and separating system
- Patent number 12,157,293
- Issue date Dec 3, 2024
- Tokyo Electron Limited
- Takashi Terada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Curable hot-melt silicone composition, cured material thereof, and...
- Patent number 12,134,697
- Issue date Nov 5, 2024
- Dow Toray Co., Ltd.
- Ryosuke Yamazaki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Affixing method and affixing apparatus
- Patent number 12,128,664
- Issue date Oct 29, 2024
- Disco Corporation
- Yohei Masuda
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing apparatus of semiconductor device
- Patent number 12,131,921
- Issue date Oct 29, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Siloxane plasma polymers for sheet bonding
- Patent number 12,122,138
- Issue date Oct 22, 2024
- Corning Incorporated
- Robert Alan Bellman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Bonding apparatus and method of manufacturing semiconductor device
- Patent number 12,125,718
- Issue date Oct 22, 2024
- Kioxia Corporation
- Yoshio Mizuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet peeling method and sheet peeling apparatus using peeling tool
- Patent number 12,122,135
- Issue date Oct 22, 2024
- Disco Corporation
- Yoshinori Kakinuma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing a supporting glass substrate
- Patent number 12,119,278
- Issue date Oct 15, 2024
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pseudo-substrate with improved efficiency of usage of single crysta...
- Patent number 12,112,976
- Issue date Oct 8, 2024
- Soitec
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 12,042,883
- Issue date Jul 23, 2024
- Henkel AG & Co. KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for attaching detectors to electronic readout s...
- Patent number 12,043,016
- Issue date Jul 23, 2024
- Rapiscan Systems, Inc.
- Evgeniy Kuksin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive and protective coating for electronic device
- Patent number 12,033,426
- Issue date Jul 9, 2024
- Next Biometrics Group ASA
- Matias N. Troccoli
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cover lid with selective and edge metallization and methods of making
- Patent number 12,020,999
- Issue date Jun 25, 2024
- Materion Corporation
- Ramesh Kothandapani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temporary adhesive for wafer processing, wafer laminate and method...
- Patent number 11,970,639
- Issue date Apr 30, 2024
- Shin-Etsu Chemical Co., Ltd.
- Mitsuo Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
SP2-bonded carbon structures
- Patent number 11,938,715
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Luigi Colombo
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Silicone-based adhesive sheet, multilayer structure including same,...
- Patent number 11,939,497
- Issue date Mar 26, 2024
- Dow Toray Co., Ltd.
- Nohno Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for attaching protective tape on semiconductor wafer
- Patent number 11,935,768
- Issue date Mar 19, 2024
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Hydrophobic film
- Patent number 11,904,586
- Issue date Feb 20, 2024
- Tsinghua University
- Yuan-Hao Jin
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive bonding composition and electronic components prepared fro...
- Patent number 11,901,331
- Issue date Feb 13, 2024
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate laminated body and method of manufacturing substrate lami...
- Patent number 11,859,110
- Issue date Jan 2, 2024
- Mitsui Chemicals, Inc.
- Jun Kamada
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and manufacturing system of producing microelectronic compon...
- Patent number 11,799,055
- Issue date Oct 24, 2023
- 3D-Micromac AG
- Sven Albert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective sheet sticking apparatus
- Patent number 11,769,676
- Issue date Sep 26, 2023
- Disco Corporation
- Yoshinori Kakinuma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Glass substrate, laminated substrate, and laminate
- Patent number 11,753,330
- Issue date Sep 12, 2023
- AGC Inc.
- Yu Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sinterable films and pastes and methods for use thereof
- Patent number 11,745,294
- Issue date Sep 5, 2023
- Henkel AG & Co., KGaA
- Pukun Zhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 11,749,574
- Issue date Sep 5, 2023
- Nippon Electric Glass Co., Ltd.
- Hiroki Katayama
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...
- Publication number 20250022747
- Publication date Jan 16, 2025
- SOITEC
- Fabrice Letertre
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240420988
- Publication date Dec 19, 2024
- EPISTAR CORPORATION
- Chien-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT METHOD, PEELING METHOD, AND PEELING STRENGTH MEASURING...
- Publication number 20240421006
- Publication date Dec 19, 2024
- Yamaha Robotics Holdings Co., Ltd.
- HIROSHI KIKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED WAFER AND METHOD FOR PRODUCING BONDED WAFER
- Publication number 20240379899
- Publication date Nov 14, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240379403
- Publication date Nov 14, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Making and Using an Enhanced Ca...
- Publication number 20240355655
- Publication date Oct 24, 2024
- STATS ChipPAC Pte Ltd.
- MoonSu Han
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods and Systems for Attaching Detectors to Electronic Readout S...
- Publication number 20240336051
- Publication date Oct 10, 2024
- Rapiscan Systems, Inc.
- Evgeniy Kuksin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A DETACHABLE FOIL, POWER ELECTRONICS AR...
- Publication number 20240332055
- Publication date Oct 3, 2024
- Infineon Technologies Austria AG
- Gerardo Pantoja
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING...
- Publication number 20240321806
- Publication date Sep 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Koutarou Iwata
- B22 - CASTING POWDER METALLURGY
Information Patent Application
DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...
- Publication number 20240308200
- Publication date Sep 19, 2024
- Skiileux Electricity Inc.
- SHENG-HSIANG YU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION FOR INFRARED PEELING, LAMINATE, METHOD FOR PRO...
- Publication number 20240301263
- Publication date Sep 12, 2024
- NISSAN CHEMICAL CORPORATION
- Kazuhiro SAWADA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING MEMBER
- Publication number 20240290684
- Publication date Aug 29, 2024
- SUPERUFO291 TEC
- Akira FUKUI
- B32 - LAYERED PRODUCTS
Information Patent Application
HOLDING TOOL AND MANUFACTURING METHOD
- Publication number 20240282615
- Publication date Aug 22, 2024
- Mitsubishi Gas Chemical Company, Inc.
- Yusaku NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION APPARATUS AND METHOD
- Publication number 20240262096
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ting Chiu
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...
- Publication number 20240258195
- Publication date Aug 1, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Hideaki YAMADA
- B32 - LAYERED PRODUCTS
Information Patent Application
SP2-Bonded Carbon Structures
- Publication number 20240246317
- Publication date Jul 25, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Luigi COLOMBO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, A...
- Publication number 20240199918
- Publication date Jun 20, 2024
- NISSAN CHEMICAL CORPORATION
- Yuki USUI
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...
- Publication number 20240199924
- Publication date Jun 20, 2024
- NISSAN CHEMICAL CORPORATION
- Shunsuke MORIYA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240096846
- Publication date Mar 21, 2024
- TOKYO ELECTRON LIMITED
- Hideyuki Fukushima
- B32 - LAYERED PRODUCTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230352324
- Publication date Nov 2, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
- Publication number 20230352355
- Publication date Nov 2, 2023
- Nippon Electric Glass Co., Ltd.
- Hiroki KATAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230335415
- Publication date Oct 19, 2023
- Samsung Electronics Co., Ltd.
- Hyungjun Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
- Publication number 20230294390
- Publication date Sep 21, 2023
- EV GROUP E. THALLNER GMBH
- Thomas Wagenleitner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING APPARATUS AND A BONDING DEVICE THEREOF
- Publication number 20230298913
- Publication date Sep 21, 2023
- ALL RING TECH CO., LTD.
- Chun-Hung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
- Publication number 20230282494
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Fei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED BODY MANUFACTURING METHOD AND BONDED BODY MANUFACTURING DEVICE
- Publication number 20230265012
- Publication date Aug 24, 2023
- NIPPON ELECTRIC GLASS CO., LTD.
- Toru SHIRAGAMI
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
- Publication number 20230191747
- Publication date Jun 22, 2023
- Immunolight, LLC
- Zakaryae Fathi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230187255
- Publication date Jun 15, 2023
- KIOXIA Corporation
- Aoi SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, COPPER CLAD LAMINATE A...
- Publication number 20230182443
- Publication date Jun 15, 2023
- LG Innotek Co., Ltd.
- Koh Eun Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Semiconductor wafers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for processing substrate

Separating method, separating apparatus, and separating system

Curable hot-melt silicone composition, cured material thereof, and...

Affixing method and affixing apparatus

Thermosetting resin composition for semiconductor package, prepreg...

Manufacturing apparatus of semiconductor device

Siloxane plasma polymers for sheet bonding

Bonding apparatus and method of manufacturing semiconductor device

Sheet peeling method and sheet peeling apparatus using peeling tool

Method of manufacturing a supporting glass substrate

Pseudo-substrate with improved efficiency of usage of single crysta...

Thermosetting resin composite and metal clad laminate using the same

Sinterable films and pastes and methods for use thereof

Methods and systems for attaching detectors to electronic readout s...

Thermally conductive and protective coating for electronic device

Cover lid with selective and edge metallization and methods of making

Temporary adhesive for wafer processing, wafer laminate and method...

Heat dissipation sheet, manufacturing method of heat dissipation sh...

SP2-bonded carbon structures

Silicone-based adhesive sheet, multilayer structure including same,...

Device and method for attaching protective tape on semiconductor wafer

Hydrophobic film

Adhesive bonding composition and electronic components prepared fro...

Substrate laminated body and method of manufacturing substrate lami...

Method and manufacturing system of producing microelectronic compon...

Protective sheet sticking apparatus

Hermetically sealed optically transparent wafer-level packages and...

Glass substrate, laminated substrate, and laminate

Sinterable films and pastes and methods for use thereof

Method of manufacturing semiconductor package

Patents Applicationslast 30 patents

PSEUDO-SUBSTRATE WITH IMPROVED EFFICIENCY OF USAGE OF SINGLE CRYSTA...

SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD OF MANUFACTURING THE SAME

MEASUREMENT METHOD, PEELING METHOD, AND PEELING STRENGTH MEASURING...

BONDED WAFER AND METHOD FOR PRODUCING BONDED WAFER

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

Semiconductor Device and Methods of Making and Using an Enhanced Ca...

Methods and Systems for Attaching Detectors to Electronic Readout S...

SEMICONDUCTOR DEVICE HAVING A DETACHABLE FOIL, POWER ELECTRONICS AR...

BONDING PASTE, BONDING LAYER, BONDED BODY, AND METHOD FOR PRODUCING...

DEVICE FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR TRANSFE...

ADHESIVE COMPOSITION FOR INFRARED PEELING, LAMINATE, METHOD FOR PRO...

BONDING MEMBER

HOLDING TOOL AND MANUFACTURING METHOD

LAMINATION APPARATUS AND METHOD

BONDED BODY COMPRISING MOSAIC DIAMOND WAFER AND SEMICONDUCTOR OF DI...

SP2-Bonded Carbon Structures

ADHESIVE COMPOSITION, LAMINATE, METHOD OF MANUFACTURING LAMINATE, A...

LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR MANUFACTURING P...

BONDING APPARATUS AND BONDING METHOD

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DEVICE AND METHOD FOR BONDING SUBSTRATES

BONDING APPARATUS AND A BONDING DEVICE THEREOF

FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF

BONDED BODY MANUFACTURING METHOD AND BONDED BODY MANUFACTURING DEVICE

ADHESIVE BONDING COMPOSITION AND METHOD OF USE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, COPPER CLAD LAMINATE A...