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PERFORMING OPERATIONS TRANSPORTING
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Layered products
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LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT
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B32B2457/14
Semiconductor wafers
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Patents Grants
last 30 patents
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Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
Patent number
11,967,539
Issue date
Apr 23, 2024
Fujitsu Limited
Shinichi Hirose
B32 - LAYERED PRODUCTS
Information
Patent Grant
SP2-bonded carbon structures
Patent number
11,938,715
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Luigi Colombo
B82 - NANO-TECHNOLOGY
Information
Patent Grant
Silicone-based adhesive sheet, multilayer structure including same,...
Patent number
11,939,497
Issue date
Mar 26, 2024
Dow Toray Co., Ltd.
Nohno Toda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for attaching protective tape on semiconductor wafer
Patent number
11,935,768
Issue date
Mar 19, 2024
DISCO HI-TEC EUROPE GMBH
Karl Heinz Priewasser
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Hydrophobic film
Patent number
11,904,586
Issue date
Feb 20, 2024
Tsinghua University
Yuan-Hao Jin
B32 - LAYERED PRODUCTS
Information
Patent Grant
Adhesive bonding composition and electronic components prepared fro...
Patent number
11,901,331
Issue date
Feb 13, 2024
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate laminated body and method of manufacturing substrate lami...
Patent number
11,859,110
Issue date
Jan 2, 2024
Mitsui Chemicals, Inc.
Jun Kamada
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Method and manufacturing system of producing microelectronic compon...
Patent number
11,799,055
Issue date
Oct 24, 2023
3D-Micromac AG
Sven Albert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective sheet sticking apparatus
Patent number
11,769,676
Issue date
Sep 26, 2023
Disco Corporation
Yoshinori Kakinuma
B32 - LAYERED PRODUCTS
Information
Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
Patent number
11,764,117
Issue date
Sep 19, 2023
Corning Incorporated
Robert Alan Bellman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Glass substrate, laminated substrate, and laminate
Patent number
11,753,330
Issue date
Sep 12, 2023
AGC Inc.
Yu Hanawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sinterable films and pastes and methods for use thereof
Patent number
11,745,294
Issue date
Sep 5, 2023
Henkel AG & Co., KGaA
Pukun Zhu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
11,749,574
Issue date
Sep 5, 2023
Nippon Electric Glass Co., Ltd.
Hiroki Katayama
B24 - GRINDING POLISHING
Information
Patent Grant
Neutral layer composition
Patent number
11,732,072
Issue date
Aug 22, 2023
LG Chem, Ltd.
Se Jin Ku
B32 - LAYERED PRODUCTS
Information
Patent Grant
Substrate support features and method of application
Patent number
11,728,199
Issue date
Aug 15, 2023
ASMPT NEXX, INC.
I-Kuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
Patent number
11,728,201
Issue date
Aug 15, 2023
Kulicke and Soffa Industries, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus
Patent number
11,721,562
Issue date
Aug 8, 2023
Samsung Electronics Co., Ltd.
Hyungjun Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Curable resin composition and curable sheet
Patent number
11,718,770
Issue date
Aug 8, 2023
Nagase Chemtex Corporation
Takayuki Hashimoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Glass substrate and laminated substrate
Patent number
11,715,673
Issue date
Aug 1, 2023
AGC Inc.
Yu Hanawa
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Grant
Device and method for bonding substrates
Patent number
11,697,281
Issue date
Jul 11, 2023
EV Group E. Thallner GmbH
Thomas Wagenleitner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Fully automated wafer debonding system and method thereof
Patent number
11,670,524
Issue date
Jun 6, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Protective sheet application apparatus and method
Patent number
11,651,978
Issue date
May 16, 2023
Disco Corporation
Kazuma Sekiya
B32 - LAYERED PRODUCTS
Information
Patent Grant
Adhesive bonding composition and method of use
Patent number
11,648,750
Issue date
May 16, 2023
Immunolight, LLC
Zakaryae Fathi
B32 - LAYERED PRODUCTS
Information
Patent Grant
Method and system for mass assembly of thin-film materials
Patent number
11,648,762
Issue date
May 16, 2023
Palo Alto Research Center Incorporated
JengPing Lu
B32 - LAYERED PRODUCTS
Information
Patent Grant
Thermosetting adhesive sheet and semiconductor device manufacturing...
Patent number
11,624,011
Issue date
Apr 11, 2023
Lintec Corporation
Daichi Mori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Curable resin film and first protective film forming sheet
Patent number
11,594,458
Issue date
Feb 28, 2023
Lintec Corporation
Akinori Sato
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Anisotropic graphite and anisotropic graphite composite
Patent number
11,578,246
Issue date
Feb 14, 2023
Kaneka Corporation
Makoto Kutsumizu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding apparatus
Patent number
11,581,188
Issue date
Feb 14, 2023
Samsung Electronics Co., Ltd.
Junhyung Kim
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for embedding semiconductor devices
Patent number
11,538,699
Issue date
Dec 27, 2022
Rohinni, LLC
Cody Peterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of making printed structures
Patent number
11,540,398
Issue date
Dec 27, 2022
X Display Company Technology Limited
Christopher Andrew Bower
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
Information
Patent Application
BONDING APPARATUS AND BONDING METHOD
Publication number
20240096846
Publication date
Mar 21, 2024
TOKYO ELECTRON LIMITED
Hideyuki Fukushima
B32 - LAYERED PRODUCTS
Information
Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
Publication number
20230377936
Publication date
Nov 23, 2023
Kulicke and Soffa Industries, Inc.
Val Marinov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
Publication number
20230352324
Publication date
Nov 2, 2023
SHINKAWA LTD.
Kohei SEYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUPPORTING GLASS SUBSTRATE, LAMINATE, SEMICONDUCTOR PACKAGE, ELECTR...
Publication number
20230352355
Publication date
Nov 2, 2023
Nippon Electric Glass Co., Ltd.
Hiroki KATAYAMA
B24 - GRINDING POLISHING
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230335415
Publication date
Oct 19, 2023
Samsung Electronics Co., Ltd.
Hyungjun Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD FOR BONDING SUBSTRATES
Publication number
20230294390
Publication date
Sep 21, 2023
EV GROUP E. THALLNER GMBH
Thomas Wagenleitner
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
BONDING APPARATUS AND A BONDING DEVICE THEREOF
Publication number
20230298913
Publication date
Sep 21, 2023
ALL RING TECH CO., LTD.
Chun-Hung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF
Publication number
20230282494
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Fei Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED BODY MANUFACTURING METHOD AND BONDED BODY MANUFACTURING DEVICE
Publication number
20230265012
Publication date
Aug 24, 2023
NIPPON ELECTRIC GLASS CO., LTD.
Toru SHIRAGAMI
C03 - GLASS MINERAL OR SLAG WOOL
Information
Patent Application
ADHESIVE BONDING COMPOSITION AND METHOD OF USE
Publication number
20230191747
Publication date
Jun 22, 2023
Immunolight, LLC
Zakaryae Fathi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE, COPPER CLAD LAMINATE A...
Publication number
20230182443
Publication date
Jun 15, 2023
LG Innotek Co., Ltd.
Koh Eun Lee
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20230187255
Publication date
Jun 15, 2023
KIOXIA Corporation
Aoi SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHEET PEELING METHOD AND SHEET PEELING APPARATUS USING PEELING TOOL
Publication number
20230127184
Publication date
Apr 27, 2023
Disco Corporation
Yoshinori KAKINUMA
B32 - LAYERED PRODUCTS
Information
Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20230091517
Publication date
Mar 23, 2023
KIOXIA Corporation
Yoshio MIZUTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING GAS BLOWING AGENT
Publication number
20230087718
Publication date
Mar 23, 2023
Samsung Electronics Co., Ltd.
Cheonil PARK
B32 - LAYERED PRODUCTS
Information
Patent Application
METHODS OF MAKING PRINTED STRUCTURES
Publication number
20230091571
Publication date
Mar 23, 2023
X Display Company Technology Limited
Christopher Andrew Bower
B32 - LAYERED PRODUCTS
Information
Patent Application
SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM
Publication number
20230055853
Publication date
Feb 23, 2023
TOKYO ELECTRON LIMITED
Takashi Terada
B32 - LAYERED PRODUCTS
Information
Patent Application
HIGH-SURFACE AREA ELECTRODES FOR WEARABLE ELECTROCHEMICAL BIOSENSING
Publication number
20230050906
Publication date
Feb 16, 2023
The Regents of the University of California
Julia A. Zakashansky
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
SUBSTRATE-CONVEYING SUPPORT TAPE AND ELECTRONIC APPARATUS/DEVICE PR...
Publication number
20230039482
Publication date
Feb 9, 2023
Showa Denko Materials Co., Ltd.
Shinji IRIZAWA
B32 - LAYERED PRODUCTS
Information
Patent Application
AFFIXING METHOD AND AFFIXING APPARATUS
Publication number
20230014530
Publication date
Jan 19, 2023
Disco Corporation
Yohei MASUDA
B32 - LAYERED PRODUCTS
Information
Patent Application
ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
Publication number
20230005872
Publication date
Jan 5, 2023
Samsung Electronics Co., Ltd.
Dongkwan Kim
B32 - LAYERED PRODUCTS
Information
Patent Application
APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
Publication number
20230005768
Publication date
Jan 5, 2023
SEMES CO., LTD.
MYUNG A JEON
B08 - CLEANING
Information
Patent Application
ADHESIVE COMPOSITION, LAMINATE AND METHOD FOR PRODUCING SAME, METHO...
Publication number
20220411684
Publication date
Dec 29, 2022
NISSAN CHEMICAL CORPORATION
Hiroto OGATA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ADHESION PROMOTING COMPOSITION AND METHOD FOR PRODUCING LAMINATE, A...
Publication number
20220403216
Publication date
Dec 22, 2022
Merck Patent GmbH
Yoshio NOJIMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
METHOD AND SYSTEM FOR MASS ASSEMBLY OF THIN-FILM MATERIALS
Publication number
20220388295
Publication date
Dec 8, 2022
Palo Alto Research Center Incorporated
JengPing Lu
B32 - LAYERED PRODUCTS
Information
Patent Application
DEBONDING TAPE AND METHOD OF PROCESSING SEMICONDUCTOR WAFER USING T...
Publication number
20220384238
Publication date
Dec 1, 2022
Samsung Electronics Co., Ltd.
Seonho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PR...
Publication number
20220352001
Publication date
Nov 3, 2022
Shin-Etsu Chemical Co., Ltd.
Mitsuo MUTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROTECTIVE SHEET STICKING APPARATUS
Publication number
20220310421
Publication date
Sep 29, 2022
Disco Corporation
Yoshinori KAKINUMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Precision Structured Glass Articles, integrated circuit packages, o...
Publication number
20220278005
Publication date
Sep 1, 2022
Corning Incorporated
Heather Debra Boek
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Die Bonding Apparatus and Manufacturing Method for Semiconductor De...
Publication number
20220238357
Publication date
Jul 28, 2022
Fasford Technology Co., Ltd.
Akira SAITO
H01 - BASIC ELECTRIC ELEMENTS