Semiconductors

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CPC
C25D7/12

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D7/00Electroplating characterised by the article coated

Current Industry

C25D7/12Semiconductors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for wafer pre-wetting
- Patent number 12,366,004
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plate, apparatus for plating, and method of manufacturing plate
- Patent number 12,359,338
- Issue date Jul 15, 2025
- Ebara Corporation
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 12,359,334
- Issue date Jul 15, 2025
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and substrate holder operation method
- Patent number 12,359,339
- Issue date Jul 15, 2025
- Ebara Corporation
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Distribution body for a process fluid for chemical and/or electroly...
- Patent number 12,351,921
- Issue date Jul 8, 2025
- SEMSYSCO GMBH
- Andreas Gleissner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method and apparatus for electronic component
- Patent number 12,351,934
- Issue date Jul 8, 2025
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao Yu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for making a packaging substrate
- Patent number 12,354,884
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ching Hsu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating co-planarity improvement by die shielding
- Patent number 12,344,955
- Issue date Jul 1, 2025
- Applied Materials, Inc.
- Charles Sharbono
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor material based on metal nanowires and porous nitride...
- Patent number 12,343,711
- Issue date Jul 1, 2025
- Institute of Semiconductors, Chinese Academy of Sciences
- Lixia Zhao
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Prewet module and prewet method
- Patent number 12,347,697
- Issue date Jul 1, 2025
- Ebara Corporation
- Masaya Seki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 12,331,420
- Issue date Jun 17, 2025
- Ebara Corporation
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Complex waveform for electrolytic plating
- Patent number 12,325,927
- Issue date Jun 10, 2025
- MacDermid Enthone Inc.
- Donald Desalvo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 12,312,702
- Issue date May 27, 2025
- Applied Materials, Inc.
- Cameron Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Neutral pH copper plating solution for undercut reduction
- Patent number 12,312,703
- Issue date May 27, 2025
- Texas Instruments Incorporated
- Nazila Dadvand
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
TSV process window and fill performance enhancement by long pulsing...
- Patent number 12,305,307
- Issue date May 20, 2025
- Lam Research Corporation
- Jae Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Indium electroplating on physical vapor deposition tantalum
- Patent number 12,305,310
- Issue date May 20, 2025
- Raytheon Company
- Michael J. Rondon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gold through silicon mask plating
- Patent number 12,293,943
- Issue date May 6, 2025
- Lam Research Corporation
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Light-induced aluminum plating on silicon for solar cell metallization
- Patent number 12,286,722
- Issue date Apr 29, 2025
- Arizona Board of Regents on behalf of Arizona State University
- Meng Tao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,289,838
- Issue date Apr 29, 2025
- Ibiden Co., Ltd.
- Yasuki Kimishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Display panel, manufacturing method thereof, and mobile terminal
- Patent number 12,279,514
- Issue date Apr 15, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Rongkun Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for manufacturing solar cell, solar module, and power genera...
- Patent number 12,278,306
- Issue date Apr 15, 2025
- SOLARLAB AIKO EUROPE GMBH
- Yongqian Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and operation method thereof
- Patent number 12,270,119
- Issue date Apr 8, 2025
- PYXIS CF PTE. LTD.
- Amlan Sen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition and method for fabrication of nickel interconnects
- Patent number 12,270,121
- Issue date Apr 8, 2025
- MacDermid Enthone Inc.
- Eric Yakobson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Lipseal edge exclusion engineering to maintain material integrity a...
- Patent number 12,247,310
- Issue date Mar 11, 2025
- Lam Research Corporation
- Justin Oberst
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer shielding for prevention of lipseal plate-out
- Patent number 12,241,173
- Issue date Mar 4, 2025
- Lam Research Corporation
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 12,227,867
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and method for electroplating wafer
- Patent number 12,227,865
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Che-Min Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Protocol for the synthesis of bismuth vanadate double-layer homojun...
- Patent number 12,227,856
- Issue date Feb 18, 2025
- City University of Hong Kong
- Ruiqin Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
LIGHT-INDUCED ALUMINUM PLATING ON SILICON FOR SOLAR CELL METALLIZATION
- Publication number 20250236983
- Publication date Jul 24, 2025
- Meng Tao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...
- Publication number 20250239545
- Publication date Jul 24, 2025
- Honeywell International Inc.
- Bryan Roger Seppala
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE
- Publication number 20250236981
- Publication date Jul 24, 2025
- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY CHINESE ACADEMY OF SCIENCES
- Zhi-Quan LIU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MULTI-SCALE ELECTROPLATED POROUS COATING FOR IMMERSION COOLING OF E...
- Publication number 20250233049
- Publication date Jul 17, 2025
- Systemex Énergies Inc.
- Julien Sylvestre
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEVICE, METHOD AND EQUIPMENT FOR IMPROVING ELECTROPLATING UNIFORMIT...
- Publication number 20250215604
- Publication date Jul 3, 2025
- SINYANG SEMICONDUCTOR (SHANGHAI) TECHNOLOGY & INNOVATION CO., LTD.
- Steven He WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SOLAR CELL PRECURSOR
- Publication number 20250215601
- Publication date Jul 3, 2025
- SUZHOU SUNWELL NEW ENERGY CO., LTD.
- Yu Yao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING...
- Publication number 20250188640
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Gregory J. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20250163602
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
- Publication number 20250146159
- Publication date May 8, 2025
- STMicroelectronics International N.V.
- Paolo CREMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE STATE MEASUREMENT DEVICE, PLATING APPARATUS, AND SUBSTRAT...
- Publication number 20250146952
- Publication date May 8, 2025
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Stamping Surface Profile in Design Layer and Using Patterned Electr...
- Publication number 20250137159
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich TRISCHLER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER EL...
- Publication number 20250137157
- Publication date May 1, 2025
- MacDermid Enthone Inc.
- Hermine Marie BERTHON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...
- Publication number 20250129503
- Publication date Apr 24, 2025
- BASF SE
- Marco ARNOLD
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...
- Publication number 20250125151
- Publication date Apr 17, 2025
- Louis Caillard
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER
- Publication number 20250116028
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING MEMBRANE
- Publication number 20250101628
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Hsiang CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105176
- Publication date Mar 27, 2025
- Kabushiki Kaisha Toshiba
- Teppei TSUKAMOTO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEPOSITION MASK AND METHOD OF FABRICATING THE SAME
- Publication number 20250101626
- Publication date Mar 27, 2025
- SAMSUNG DISPLAY CO., LTD.
- Jeong Kuk KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...
- Publication number 20250092559
- Publication date Mar 20, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR PLATING AND METHOD OF PLATING
- Publication number 20250075362
- Publication date Mar 6, 2025
- EBARA CORPORATION
- Naoto TAKAHASHI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE
- Publication number 20250069999
- Publication date Feb 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Huo Yun Duan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...
- Publication number 20250051950
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATION OF ELECTROPLATED NICKEL-IRON LAYERS WITH TITANIUM-COPPE...
- Publication number 20250057051
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Michael KIRSCH
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...
- Publication number 20250051951
- Publication date Feb 13, 2025
- Applied Materials, Inc.
- Paul R. McHugh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...
- Publication number 20250054773
- Publication date Feb 13, 2025
- Samsung Electronics Co., Ltd.
- Yuseon HEO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...
- Publication number 20250051949
- Publication date Feb 13, 2025
- BASF SE
- Charlotte Emnet
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...
- Publication number 20250051953
- Publication date Feb 13, 2025
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
JET STREAM TYPE PLATING DEVICE
- Publication number 20250027225
- Publication date Jan 23, 2025
- ASKA CORPORATION
- Takayuki FURUSAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20250019857
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20250022722
- Publication date Jan 16, 2025
- HAESUNG DS CO., LTD.
- Jongwoo PARK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Semiconductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for wafer pre-wetting

Plate, apparatus for plating, and method of manufacturing plate

Systems and methods for manufacturing electrical components using e...

Plating apparatus and substrate holder operation method

Distribution body for a process fluid for chemical and/or electroly...

Manufacturing method and apparatus for electronic component

Method for making a packaging substrate

Electroplating co-planarity improvement by die shielding

Semiconductor material based on metal nanowires and porous nitride...

Prewet module and prewet method

Plating apparatus and plating method

Complex waveform for electrolytic plating

Plating systems having reduced air entrainment

Neutral pH copper plating solution for undercut reduction

TSV process window and fill performance enhancement by long pulsing...

Indium electroplating on physical vapor deposition tantalum

Gold through silicon mask plating

Conductive structure including copper-phosphorous alloy and a metho...

Light-induced aluminum plating on silicon for solar cell metallization

Wiring substrate and method for manufacturing wiring substrate

Display panel, manufacturing method thereof, and mobile terminal

Method for manufacturing solar cell, solar module, and power genera...

Plating apparatus and operation method thereof

Composition and method for fabrication of nickel interconnects

Lipseal edge exclusion engineering to maintain material integrity a...

Wafer shielding for prevention of lipseal plate-out

Plating apparatus for plating semiconductor wafer and plating method

Plating apparatus and method for electroplating wafer

Protocol for the synthesis of bismuth vanadate double-layer homojun...

Printed circuit board and method of fabricating the same

Patents Applicationslast 30 patents

LIGHT-INDUCED ALUMINUM PLATING ON SILICON FOR SOLAR CELL METALLIZATION

ELECTRICAL CONTACTS AND SYSTEMS AND TECHNIQUES FOR FORMING ELECTRIC...

TWIN CRYSTAL COPPER MATERIAL AND HYBRID BONDING STRUCTURE

MULTI-SCALE ELECTROPLATED POROUS COATING FOR IMMERSION COOLING OF E...

DEVICE, METHOD AND EQUIPMENT FOR IMPROVING ELECTROPLATING UNIFORMIT...

METHOD AND APPARATUS FOR ELECTROPLATING SOLAR CELL PRECURSOR

FLOW-THROUGH EDGE SHIELD TO LESSEN CURRENT CROWDING EFFECTS DURING...

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS

SUBSTRATE STATE MEASUREMENT DEVICE, PLATING APPARATUS, AND SUBSTRAT...

Stamping Surface Profile in Design Layer and Using Patterned Electr...

ELECTROLYTE COMPRISING AN ACCELERATOR AGENT FOR BOTTOM-UP COPPER EL...

COMPOSITION FOR COPPER ELECTRODEPOSITION COMPRISING A POLYAMINOAMID...

Electrolyte and Deposition of a Copper Barrier Layer in a Damascene...

ELECTROPLATING CHAMBER USING JET ARRAY TO ENABLE HIGH MASS-TRANSFER

PLATING MEMBRANE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DEPOSITION MASK AND METHOD OF FABRICATING THE SAME

ELECTROCHEMICAL DEPOSITION SYSTEMS WITH ENHANCED CRYSTALLIZATION PR...

APPARATUS FOR PLATING AND METHOD OF PLATING

DYNAMIC PLATED METAL THICKNESS FOR SEMICONDUCTOR PACKAGE

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A DEFECT...

FABRICATION OF ELECTROPLATED NICKEL-IRON LAYERS WITH TITANIUM-COPPE...

PLATING AND DEPLATING CURRENTS FOR MATERIAL CO-PLANARITY IN SEMICON...

FORMATION METHOD OF PLATING PATTERN AND SEMICONDUCTOR PACKAGE INCLU...

ALKALINE COMPOSITION FOR COPPER ELECTROPLATING COMPRISING A GRAIN R...

CROSS FLOW CONDUIT FOR FOAMING PREVENTION IN HIGH CONVECTION PLATIN...

JET STREAM TYPE PLATING DEVICE

APPARATUS FOR AN INERT ANODE PLATING CELL

METHOD FOR MANUFACTURING SUBSTRATE