Semiconductors

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CPC
C25D7/12

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D7/00Electroplating characterised by the article coated

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C25D7/12Semiconductors

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Patents Grantslast 30 patents

Information Patent Grant
Plating membrane
- Patent number 12,195,866
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Hsiang Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical deposition systems with enhanced crystallization pr...
- Patent number 12,195,867
- Issue date Jan 14, 2025
- Applied Materials, Inc.
- Kwan Wook Roh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer immersion in semiconductor processing chambers
- Patent number 12,188,144
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- John L. Klocke
- G05 - CONTROLLING REGULATING
Information Patent Grant
Composite array electrode, preparation method thereof and use thereof
- Patent number 12,180,609
- Issue date Dec 31, 2024
- SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY
- Qi Zeng
- B08 - CLEANING
Information Patent Grant
Device and method for pressure force inspection
- Patent number 12,181,362
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Photoresist-free deposition and patterning with vacuum ultraviolet...
- Patent number 12,174,544
- Issue date Dec 24, 2024
- The Board of Trustees of the University of Illinois
- J. Gary Eden
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photosensitive resin composition, method for forming resist pattern...
- Patent number 12,158,700
- Issue date Dec 3, 2024
- JSR Corporation
- Hirokazu Sakakibara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Lipseals and contact elements for semiconductor electroplating appa...
- Patent number 12,157,950
- Issue date Dec 3, 2024
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method, insoluble anode for plating, and plating apparatus
- Patent number 12,157,951
- Issue date Dec 3, 2024
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cross flow conduit for foaming prevention in high convection platin...
- Patent number 12,157,949
- Issue date Dec 3, 2024
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating and deplating currents for material co-planarity in semicon...
- Patent number 12,146,235
- Issue date Nov 19, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for an inert anode plating cell
- Patent number 12,134,831
- Issue date Nov 5, 2024
- Lam Research Corporation
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF modules with an enclosure having a micromachined interior using...
- Patent number 12,126,098
- Issue date Oct 22, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parameter adjustment model for semiconductor processing chambers
- Patent number 12,116,686
- Issue date Oct 15, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mechanically-driven oscillating flow agitation
- Patent number 12,104,269
- Issue date Oct 1, 2024
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Composition for cobalt plating comprising additive for void-free su...
- Patent number 12,098,473
- Issue date Sep 24, 2024
- BASF SE
- Sathana Kitayaporn
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Acidic aqueous composition for electrolytic copper plating
- Patent number 12,071,702
- Issue date Aug 27, 2024
- Atotech Deutschland GmbH
- Kun Si
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electro-chemical plating
- Patent number 12,071,699
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating system and method of plating wafer
- Patent number 12,071,701
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung Hou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 12,054,846
- Issue date Aug 6, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dual wafer plating fixture for a continuous plating line
- Patent number 12,024,785
- Issue date Jul 2, 2024
- Maxeon Solar Pte. Ltd.
- Hung-Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for electro-chemical plating
- Patent number 12,020,922
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Lung Hou
- B08 - CLEANING
Information Patent Grant
Copper electrofill on non-copper liner layers
- Patent number 12,012,667
- Issue date Jun 18, 2024
- Lam Research Corporation
- Lee J. Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating system
- Patent number 11,982,008
- Issue date May 14, 2024
- Applied Materials, Inc.
- Paul R McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for manufacturing electrical components using e...
- Patent number 11,970,783
- Issue date Apr 30, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nanotwin copper materials in semiconductor devices
- Patent number 11,973,034
- Issue date Apr 30, 2024
- Applied Materials, Inc.
- Eric J. Bergman
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper or copper alloy electroplating bath
- Patent number 11,946,153
- Issue date Apr 2, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy electroplating bath, and electronic component havi...
- Patent number 11,939,691
- Issue date Mar 26, 2024
- Ishihara Chemical Co., LTD
- Syohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JET STREAM TYPE PLATING DEVICE
- Publication number 20250027225
- Publication date Jan 23, 2025
- ASKA CORPORATION
- Takayuki FURUSAWA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR AN INERT ANODE PLATING CELL
- Publication number 20250019857
- Publication date Jan 16, 2025
- LAM RESEARCH CORPORATION
- Gregory Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE
- Publication number 20250022722
- Publication date Jan 16, 2025
- HAESUNG DS CO., LTD.
- Jongwoo PARK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS
- Publication number 20250003105
- Publication date Jan 2, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Joel MEDINA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF FABRICATING A CATALYST ON A SUBSTRATE
- Publication number 20240417872
- Publication date Dec 19, 2024
- Australian National University
- Siva Krishna KARUTURI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION
- Publication number 20240393199
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung Chang HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240368795
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Taiseung Cha
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF ELECTROCHEMICAL PLATING
- Publication number 20240360585
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEM AND METHOD OF PLATING WAFER
- Publication number 20240360584
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Lung HOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD
- Publication number 20240341039
- Publication date Oct 10, 2024
- Resonac Corporation
- Kei TOGASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...
- Publication number 20240318343
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Kazuyuki Goto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...
- Publication number 20240318342
- Publication date Sep 26, 2024
- MacDermid Enthone Inc.
- Jianwen Han
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROTOCOL FOR THE SYNTHESIS OF BISMUTH VANADATE DOUBLE-LAYER HOMOJUN...
- Publication number 20240295037
- Publication date Sep 5, 2024
- City University of Hong Kong
- Ruiqin Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...
- Publication number 20240279839
- Publication date Aug 22, 2024
- LAM RESEARCH CORPORATION
- Steven T. MAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION
- Publication number 20240279835
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20240254646
- Publication date Aug 1, 2024
- SUZHOU MAXWELL TECHNOLOGIES CO., LTD.
- Cao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING METALLIZATION
- Publication number 20240254645
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20240247394
- Publication date Jul 25, 2024
- EBARA CORPORATION
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Dielectric Material Layer, Surface Treatment Method, Package Substr...
- Publication number 20240250016
- Publication date Jul 25, 2024
- Honor Device Co., Ltd.
- Xueping Guo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...
- Publication number 20240240347
- Publication date Jul 18, 2024
- FABRIC8LABS, INC.
- David Pain
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
LIGHT-INDUCED ALUMINUM PLATING ON SILICON FOR SOLAR CELL METALLIZATION
- Publication number 20240240346
- Publication date Jul 18, 2024
- Meng Tao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL COMPONENT
- Publication number 20240243045
- Publication date Jul 18, 2024
- MITSUI HIGH-TEC, INC.
- Kimihiko KUBO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR FORMING VIA HOLE AND FILLING VIA HOLE IN FLEXIBLE SUBST...
- Publication number 20240222141
- Publication date Jul 4, 2024
- Beijing BOE Technology Development Co., Ltd.
- Shuo Zhang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF
- Publication number 20240218548
- Publication date Jul 4, 2024
- Huawei Technologies Co., Ltd
- Changyou REN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING
- Publication number 20240213131
- Publication date Jun 27, 2024
- Intel Corporation
- Yi YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURI...
- Publication number 20240194495
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Liang Chang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD
- Publication number 20240183051
- Publication date Jun 6, 2024
- ACM Research (Shanghai) Inc.
- Zhaowei JIA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING LAMINATE
- Publication number 20240179848
- Publication date May 30, 2024
- Namics Corporation
- Naoki OBATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Semiconductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating membrane

Electrochemical deposition systems with enhanced crystallization pr...

Wafer immersion in semiconductor processing chambers

Composite array electrode, preparation method thereof and use thereof

Device and method for pressure force inspection

Photoresist-free deposition and patterning with vacuum ultraviolet...

Photosensitive resin composition, method for forming resist pattern...

Lipseals and contact elements for semiconductor electroplating appa...

Method of controlling chemical concentration in electrolyte

Plating method, insoluble anode for plating, and plating apparatus

Cross flow conduit for foaming prevention in high convection platin...

Plating and deplating currents for material co-planarity in semicon...

Apparatus for an inert anode plating cell

Hermetic metallized via with improved reliability

RF modules with an enclosure having a micromachined interior using...

Parameter adjustment model for semiconductor processing chambers

Mechanically-driven oscillating flow agitation

Composition for cobalt plating comprising additive for void-free su...

Acidic aqueous composition for electrolytic copper plating

Apparatus for electro-chemical plating

Plating system and method of plating wafer

Electroplating apparatus and electroplating method

Dual wafer plating fixture for a continuous plating line

Apparatus for electro-chemical plating

Copper electrofill on non-copper liner layers

Electroplating system

Systems and methods for manufacturing electrical components using e...

Nanotwin copper materials in semiconductor devices

Copper or copper alloy electroplating bath

Tin or tin alloy electroplating bath, and electronic component havi...

Patents Applicationslast 30 patents

JET STREAM TYPE PLATING DEVICE

APPARATUS FOR AN INERT ANODE PLATING CELL

METHOD FOR MANUFACTURING SUBSTRATE

ELECTROPLATING SYSTEMS AND METHODS

METHOD OF FABRICATING A CATALYST ON A SUBSTRATE

DEVICE AND METHOD FOR PRESSURE FORCE INSPECTION

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHODS OF ELECTROCHEMICAL PLATING

PLATING SYSTEM AND METHOD OF PLATING WAFER

METHOD FOR MANUFACTURING WIRING BOARD, AND WIRING BOARD

SUBSTRATE LIQUID PROCESSING APPARATUS AND SUBSTRATE LIQUID PROCESSI...

COMPOSITIONS AND METHODS FOR THE ELETRODEPOSITION OF NANOTWINNED CO...

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

PROTOCOL FOR THE SYNTHESIS OF BISMUTH VANADATE DOUBLE-LAYER HOMOJUN...

MICRO INERT ANODE ARRAY FOR DIE LEVEL ELECTRODEPOSITION THICKNESS D...

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

MANUFACTURING METHOD AND APPARATUS FOR ELECTRONIC COMPONENT

LOW TEMPERATURE HYBRID BONDING METALLIZATION

PLATING APPARATUS AND PLATING METHOD

Dielectric Material Layer, Surface Treatment Method, Package Substr...

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRICAL COMPONENTS USING E...

LIGHT-INDUCED ALUMINUM PLATING ON SILICON FOR SOLAR CELL METALLIZATION

METAL COMPONENT

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

METHODS FOR FORMING VIA HOLE AND FILLING VIA HOLE IN FLEXIBLE SUBST...

ELECTROPLATING GOLD PLATING SOLUTION AND USE THEREOF

DIRECT PLATING OF COPPER ON DIELECTRICS FOR GLASS CORE PLATING

METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURI...

ELECTROPLATING APPARATUS AND ELECTROPLATING METHOD

METHOD FOR MANUFACTURING LAMINATE