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H01L2221/68386
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2221/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
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H01L2221/68386
Separation by peeling
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Patents Grants
last 30 patents
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Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive composition for peeling off by irradiation with light, lay...
Patent number
11,926,765
Issue date
Mar 12, 2024
NISSAN CHEMICAL CORPORATION
Takahisa Okuno
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
High-resolution micro-LED display panel and manufacturing method of...
Patent number
11,915,962
Issue date
Feb 27, 2024
KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD.
Xiaosong Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method
Patent number
11,887,975
Issue date
Jan 30, 2024
Daicel Corporation
Naoko Tsuji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,881,471
Issue date
Jan 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Ronald Huemoeller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing electronic device
Patent number
11,848,215
Issue date
Dec 19, 2023
Mitsui Chemicals Tohcello, Inc.
Kouji Igarashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with alignment mark and manufacturing method...
Patent number
11,842,902
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display device comprising thin glass layer
Patent number
11,844,260
Issue date
Dec 12, 2023
Semiconductor Energy Laboratory Co., Ltd.
Shunpei Yamazaki
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Temporary die support structures and related methods
Patent number
11,830,756
Issue date
Nov 28, 2023
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Francis J. Carney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Peeling method and manufacturing method of flexible device
Patent number
11,791,350
Issue date
Oct 17, 2023
Semiconductor Energy Laboratory Co., Ltd.
Shunpei Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,776,838
Issue date
Oct 3, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing flexible display device to suppress peeling of...
Patent number
11,735,604
Issue date
Aug 22, 2023
SHARP KABUSHIKI KAISHA
Tetsunori Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of demounting thin semiconductor devices
Patent number
11,735,464
Issue date
Aug 22, 2023
American Semiconductor, Inc.
Douglas R. Hackler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
Patent number
11,728,189
Issue date
Aug 15, 2023
Rohinni, Inc.
Justin Wendt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive sheet for temporary fixation and method of manufacturing s...
Patent number
11,702,571
Issue date
Jul 18, 2023
LG Chem, Ltd.
Sera Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer transferring method
Patent number
11,651,989
Issue date
May 16, 2023
Disco Corporation
Yoshinori Kakinuma
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Panel for display by micro LED and method for making same
Patent number
11,652,089
Issue date
May 16, 2023
Hon Hai Precision Industry Co., Ltd.
Wei-Chih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer device and transfer method for micro light-emitting diode...
Patent number
11,621,183
Issue date
Apr 4, 2023
TCL China Star Optoelectronics Technology Co., Ltd.
Wei Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cold fluid semiconductor device release during pick and place opera...
Patent number
11,594,432
Issue date
Feb 28, 2023
Micron Technology, Inc.
Jeremy E. Minnich
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Carrier substrate, laminate, and method for manufacturing electroni...
Patent number
11,587,958
Issue date
Feb 21, 2023
AGC Inc.
Kazutaka Ono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Carrier plate removing method
Patent number
11,538,710
Issue date
Dec 27, 2022
Disco Corporation
Takatoshi Sakurai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer circuit board manufacturing method
Patent number
11,525,073
Issue date
Dec 13, 2022
Mitsui Mining & Smelting Co., Ltd.
Yoshinori Matsuura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
11,521,948
Issue date
Dec 6, 2022
AOI Electronics Co., Ltd.
Ichiro Kono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for transferring micro device, and electronic...
Patent number
11,417,546
Issue date
Aug 16, 2022
Korea Institute of Machinery & Materials
Byung-Ik Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Peeling apparatus
Patent number
11,417,547
Issue date
Aug 16, 2022
Disco Corporation
Gentaro Tsuruta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor package
Patent number
11,417,559
Issue date
Aug 16, 2022
Samsung Electronics Co., Ltd.
Yeonga Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing electronic device
Patent number
11,367,647
Issue date
Jun 21, 2022
Daegu Gyeongbuk Institute of Science & Technology
Kyung In Jang
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Peeling method, semiconductor device, and peeling apparatus
Patent number
11,355,382
Issue date
Jun 7, 2022
Semiconductor Energy Laboratory Co., Ltd.
Seiji Yasumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Support substrate, method for peeling off support substrate, and me...
Patent number
11,348,822
Issue date
May 31, 2022
Kabushi Kaisha Toshiba
Kaori Fuse
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mass transfer method and device for micro light emitting diode chips
Patent number
11,335,583
Issue date
May 17, 2022
BOE Technology Group Co., Ltd.
Yuju Chen
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
Publication number
20240112941
Publication date
Apr 4, 2024
Masaaki TAKEKOSHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...
Publication number
20240087940
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Cheonil PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIFT-OFF METHOD
Publication number
20240038591
Publication date
Feb 1, 2024
Disco Corporation
Masato TERAJIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE WAFER PROCESSING METHOD
Publication number
20240006239
Publication date
Jan 4, 2024
Disco Corporation
Naoko YAMAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...
Publication number
20230395419
Publication date
Dec 7, 2023
Micron Technology, Inc.
Ankur Harish Shah
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Protective Tapes, Articles Therefrom, and Methods of Making and Usi...
Publication number
20230377937
Publication date
Nov 23, 2023
3M Innovative Properties Company
Shujun J. Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
Publication number
20230369093
Publication date
Nov 16, 2023
Resonac Corporation
Yasuyuki OYAMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
FILM FOR TEMPORARY FIXATION, LAYERED PRODUCT FOR TEMPORARY FIXATION...
Publication number
20230360947
Publication date
Nov 9, 2023
Yasuyuki OYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230360949
Publication date
Nov 9, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sheng-Chieh Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER TRANSFER METHOD AND WAFER TRANSFER APPARATUS
Publication number
20230268220
Publication date
Aug 24, 2023
Disco Corporation
Kazuki SUGIURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20230260854
Publication date
Aug 17, 2023
Disco Corporation
Masatoshi WAKAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR FORMING A COATING FILM FOR REMOVING FOREIGN MATTERS
Publication number
20230250314
Publication date
Aug 10, 2023
NISSAN CHEMICAL CORPORATION
Takahiro KISHIOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR FABRICATING AND SEPARATING FLEXIBLE MICROELECTRONICS...
Publication number
20230245913
Publication date
Aug 3, 2023
OMNIPLY TECHNOLOGIES INC.
Francis ZAATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPORARY FIXATION LAYERED FILM AND PRODUCTION METHOD THEREFOR, TEM...
Publication number
20230207374
Publication date
Jun 29, 2023
Showa Denko Materials Co., Ltd.
Yuta AKASU
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTU...
Publication number
20230162992
Publication date
May 25, 2023
TOHOKU UNIVERSITY
Takafumi FUKUSHIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASC PROCESS AUTOMATION DEVICE
Publication number
20230154767
Publication date
May 18, 2023
SK SILTRON CO., LTD.
Ho Yong LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER SUBSTRATE, LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONI...
Publication number
20230154938
Publication date
May 18, 2023
AGC Inc.
Kazutaka ONO
B32 - LAYERED PRODUCTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230142877
Publication date
May 11, 2023
Hitachi, Ltd
Haruka SHIMIZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER SUBSTRATE, LAMINATE, AND METHOD FOR MANUFACTURING ELECTRONI...
Publication number
20230118345
Publication date
Apr 20, 2023
AGC Inc.
Kazutaka ONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DE-BONDING OF THICK FILMS FROM CARRIER AND METHODS THEREOF
Publication number
20230106167
Publication date
Apr 6, 2023
Arizona Board of Regents on behalf of Arizona State University
Nicholas MUNIZZA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD THEREOF
Publication number
20230109132
Publication date
Apr 6, 2023
KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD.
XIAOSONG DU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOSENSITIVE TRANSFER MATERIAL FOR LED ARRAY, LIGHT SHIELDING MAT...
Publication number
20230094866
Publication date
Mar 30, 2023
FUJIFILM CORPORATION
Takashi ARIDOMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PHOTOSENSITIVE TRANSFER MATERIAL, LIGHT SHIELDING MATERIAL, LED ARR...
Publication number
20230102758
Publication date
Mar 30, 2023
FUJIFILM CORPORATION
Takashi ARIDOMI
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
PHOTOSENSITIVE TRANSFER MATERIAL, LIGHT SHIELDING MATERIAL, LED ARR...
Publication number
20230097968
Publication date
Mar 30, 2023
FUJIFILM CORPORATION
Takashi ARIDOMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PROCESSING PLATE-SHAPED WORKPIECE
Publication number
20230099416
Publication date
Mar 30, 2023
Disco Corporation
Nobuyuki FUKUSHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WAFER TRANSFERRING METHOD
Publication number
20230073694
Publication date
Mar 9, 2023
Disco Corporation
Yoshinori KAKINUMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL WITH SUPPO...
Publication number
20230018086
Publication date
Jan 19, 2023
LINTEC CORPORATION
Hidekazu NAKAYAMA
B22 - CASTING POWDER METALLURGY
Information
Patent Application
DEBONDING STRUCTURES FOR WAFER BONDING
Publication number
20220415696
Publication date
Dec 29, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Ting YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR EL...
Publication number
20220416015
Publication date
Dec 29, 2022
KYOCERA CORPORATION
Kentaro MURAKAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE COMPOSITION, LAMINATE AND METHOD FOR PRODUCING SAME, METHO...
Publication number
20220411684
Publication date
Dec 29, 2022
NISSAN CHEMICAL CORPORATION
Hiroto OGATA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...