Separation by peeling

Industry

CPC
H01L2221/68386

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00

Current Industry

H01L2221/68386Separation by peeling

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display device and method for manufacturing display device
- Patent number 12,167,665
- Issue date Dec 10, 2024
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stack for manufacturing flexible element and method for manufacturi...
- Patent number 12,154,815
- Issue date Nov 26, 2024
- LG Chem, Ltd.
- Chae Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin composition for temporary fixing use, resin film for temporar...
- Patent number 12,094,749
- Issue date Sep 17, 2024
- Shogo Sobue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible display device that suppresses peeling of a layered structure
- Patent number 12,087,779
- Issue date Sep 10, 2024
- SHARP KABUSHIKI KAISHA
- Tetsunori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for temporary attachment and method for producing se...
- Patent number 12,065,595
- Issue date Aug 20, 2024
- LG Chem, Ltd.
- Sera Kim
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Package structure with improved antenna patterns performance
- Patent number 11,973,038
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition for peeling off by irradiation with light, lay...
- Patent number 11,926,765
- Issue date Mar 12, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa Okuno
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High-resolution micro-LED display panel and manufacturing method of...
- Patent number 11,915,962
- Issue date Feb 27, 2024
- KUNSHAN FANTAVIEW ELECTRONIC TECHNOLOGY CO., LTD.
- Xiaosong Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,887,975
- Issue date Jan 30, 2024
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,881,471
- Issue date Jan 23, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 11,848,215
- Issue date Dec 19, 2023
- Mitsui Chemicals Tohcello, Inc.
- Kouji Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with alignment mark and manufacturing method...
- Patent number 11,842,902
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device comprising thin glass layer
- Patent number 11,844,260
- Issue date Dec 12, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Temporary die support structures and related methods
- Patent number 11,830,756
- Issue date Nov 28, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling method and manufacturing method of flexible device
- Patent number 11,791,350
- Issue date Oct 17, 2023
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,776,838
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Chieh Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing flexible display device to suppress peeling of...
- Patent number 11,735,604
- Issue date Aug 22, 2023
- SHARP KABUSHIKI KAISHA
- Tetsunori Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of demounting thin semiconductor devices
- Patent number 11,735,464
- Issue date Aug 22, 2023
- American Semiconductor, Inc.
- Douglas R. Hackler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to control transfer parameters during transfer of semicon...
- Patent number 11,728,189
- Issue date Aug 15, 2023
- Rohinni, Inc.
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for temporary fixation and method of manufacturing s...
- Patent number 11,702,571
- Issue date Jul 18, 2023
- LG Chem, Ltd.
- Sera Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer transferring method
- Patent number 11,651,989
- Issue date May 16, 2023
- Disco Corporation
- Yoshinori Kakinuma
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Panel for display by micro LED and method for making same
- Patent number 11,652,089
- Issue date May 16, 2023
- Hon Hai Precision Industry Co., Ltd.
- Wei-Chih Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer device and transfer method for micro light-emitting diode...
- Patent number 11,621,183
- Issue date Apr 4, 2023
- TCL China Star Optoelectronics Technology Co., Ltd.
- Wei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold fluid semiconductor device release during pick and place opera...
- Patent number 11,594,432
- Issue date Feb 28, 2023
- Micron Technology, Inc.
- Jeremy E. Minnich
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Carrier substrate, laminate, and method for manufacturing electroni...
- Patent number 11,587,958
- Issue date Feb 21, 2023
- AGC Inc.
- Kazutaka Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier plate removing method
- Patent number 11,538,710
- Issue date Dec 27, 2022
- Disco Corporation
- Takatoshi Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,525,073
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,521,948
- Issue date Dec 6, 2022
- AOI Electronics Co., Ltd.
- Ichiro Kono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for transferring micro device, and electronic...
- Patent number 11,417,546
- Issue date Aug 16, 2022
- Korea Institute of Machinery & Materials
- Byung-Ik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peeling apparatus
- Patent number 11,417,547
- Issue date Aug 16, 2022
- Disco Corporation
- Gentaro Tsuruta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPA...
- Publication number 20240363599
- Publication date Oct 31, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Can WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS
- Publication number 20240363387
- Publication date Oct 31, 2024
- NISSAN CHEMICAL CORPORATION
- Takahisa OKUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE TAPE REMOVING
- Publication number 20240355651
- Publication date Oct 24, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jinhua YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRO...
- Publication number 20240355665
- Publication date Oct 24, 2024
- Resonac Corporation
- Kenta KIKUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Manufacturing Device, Push-up Unit, and Method of Man...
- Publication number 20240312825
- Publication date Sep 19, 2024
- Fasford Technology Co., Ltd.
- Akira Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240304474
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Chun Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240297045
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20240297064
- Publication date Sep 5, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...
- Publication number 20240297078
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240298444
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mitsuhiko NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20240282616
- Publication date Aug 22, 2024
- Tokyo Ohka Kogyo Co., Ltd.
- Yubun Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...
- Publication number 20240274460
- Publication date Aug 15, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240266203
- Publication date Aug 8, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF LAYING PROTECTIVE SHEET AND PROTECTIVE SHEET
- Publication number 20240258149
- Publication date Aug 1, 2024
- Disco Corporation
- Koshiro SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240258150
- Publication date Aug 1, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240258152
- Publication date Aug 1, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240258151
- Publication date Aug 1, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240249967
- Publication date Jul 25, 2024
- MITSUI CHEMICALS TOHCELLO, INC.
- Hiroto YASUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUPPORT ASSEMBLY AND METHOD FOR MANUFACTUR...
- Publication number 20240234191
- Publication date Jul 11, 2024
- CHONGQING KONKA OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Guangchao DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240234329
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER
- Publication number 20240222183
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Ankur Harish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFAC...
- Publication number 20240222180
- Publication date Jul 4, 2024
- NISSAN CHEMICAL CORPORATION
- Masafumi YAGYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETI...
- Publication number 20240222182
- Publication date Jul 4, 2024
- Intel Corporation
- Amey Anant Apte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240162187
- Publication date May 16, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...
- Publication number 20240112941
- Publication date Apr 4, 2024
- Masaaki TAKEKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...
- Publication number 20240087940
- Publication date Mar 14, 2024
- Samsung Electronics Co., Ltd.
- Cheonil PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIFT-OFF METHOD
- Publication number 20240038591
- Publication date Feb 1, 2024
- Disco Corporation
- Masato TERAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WAFER PROCESSING METHOD
- Publication number 20240006239
- Publication date Jan 4, 2024
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...
- Publication number 20230395419
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Ankur Harish Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Protective Tapes, Articles Therefrom, and Methods of Making and Usi...
- Publication number 20230377937
- Publication date Nov 23, 2023
- 3M Innovative Properties Company
- Shujun J. Wang
- H01 - BASIC ELECTRIC ELEMENTS

Separation by peeling

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display device and method for manufacturing display device

Stack for manufacturing flexible element and method for manufacturi...

Resin composition for temporary fixing use, resin film for temporar...

Flexible display device that suppresses peeling of a layered structure

Adhesive sheet for temporary attachment and method for producing se...

Package structure with improved antenna patterns performance

Adhesive composition for peeling off by irradiation with light, lay...

High-resolution micro-LED display panel and manufacturing method of...

Semiconductor device manufacturing method

Semiconductor device and manufacturing method thereof

Method for manufacturing electronic device

Semiconductor package with alignment mark and manufacturing method...

Display device comprising thin glass layer

Temporary die support structures and related methods

Peeling method and manufacturing method of flexible device

Semiconductor package and manufacturing method thereof

Method for producing flexible display device to suppress peeling of...

Method of demounting thin semiconductor devices

Apparatus to control transfer parameters during transfer of semicon...

Adhesive sheet for temporary fixation and method of manufacturing s...

Wafer transferring method

Panel for display by micro LED and method for making same

Transfer device and transfer method for micro light-emitting diode...

Cold fluid semiconductor device release during pick and place opera...

Carrier substrate, laminate, and method for manufacturing electroni...

Carrier plate removing method

Multilayer circuit board manufacturing method

Method of manufacturing semiconductor device

Method and apparatus for transferring micro device, and electronic...

Peeling apparatus

Patents Applicationslast 30 patents

DISPLAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPA...

METHOD OF MANUFACTURING LAMINATE AND KIT OF ADHESIVE COMPOSITIONS

WORKPIECE TAPE REMOVING

ADHESIVE SHEET, PRODUCTION METHOD FOR ADHESIVE SHEET, ROLL, AND PRO...

Semiconductor Manufacturing Device, Push-up Unit, and Method of Man...

PICKUP APPARATUS AND METHOD OF USING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CIRCUIT BOARD MANUFACTURING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PRODUCTION METHOD

BACK GRINDING ADHESIVE FILM AND METHOD FOR MANUFACTURING ELECTRONIC...

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD OF LAYING PROTECTIVE SHEET AND PROTECTIVE SHEET

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SUPPORT ASSEMBLY AND METHOD FOR MANUFACTUR...

METHOD OF FORMING PACKAGE STRUCTURE

CROSSLINKING A BACK GRINDING TAPE FOR A SEMICONDUCTOR WAFER

LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFAC...

METHOD AND APPARATUS FOR A SILICON DIE PREPARATION INCLUDING AUXETI...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC...

WAFER TEMPORARY ADHESIVE TAPE, WAFER STACK STRUCTURE, AND METHOD OF...

LIFT-OFF METHOD

DEVICE WAFER PROCESSING METHOD

METHODS OF DETECTING PROCESS DEVIATIONS DURING MICROELECTRONIC DEVI...

Protective Tapes, Articles Therefrom, and Methods of Making and Usi...