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CPC
H05K2201/09

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09Shape and layout

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical module assembly, optical module, package for optical module...
- Patent number 12,273,991
- Issue date Apr 8, 2025
- Sumitomo Electric Industries, Ltd.
- Taichi Misawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a carrier arrangement
- Patent number 12,273,993
- Issue date Apr 8, 2025
- Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung E.V.
- Mathias Bottcher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board, COF module, and electronic device c...
- Patent number 12,274,000
- Issue date Apr 8, 2025
- LG Innotek Co., Ltd
- Sang Hun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,274,001
- Issue date Apr 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Min Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, power conversion apparatus, moving body, and...
- Patent number 12,267,955
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Takeshi Higashihata
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Leadless current sensor package with high isolation
- Patent number 12,265,103
- Issue date Apr 1, 2025
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for reversible connection of interchangeable comp...
- Patent number 12,267,959
- Issue date Apr 1, 2025
- Dell Products L.P.
- Eduardo Escamilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for nanoplasma switches
- Patent number 12,267,940
- Issue date Apr 1, 2025
- Analog Devices International Unlimited Company
- Romulo Maggay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of electronic component
- Patent number 12,267,956
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Noboru Serita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component sub-mount and electronic device using the same
- Patent number 12,267,960
- Issue date Apr 1, 2025
- Lextar Electronics Corporation
- Ming-Jing Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support assembly, unit, and light module for a motor vehicle lighti...
- Patent number 12,267,944
- Issue date Apr 1, 2025
- HELLA GMBH & CO. KGAA
- Sebastian Bartscher
- F21 - LIGHTING
Information Patent Grant
Wiring board, electronic module, and electronic apparatus
- Patent number 12,267,947
- Issue date Apr 1, 2025
- Canon Kabushiki Kaisha
- Makoto Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 12,262,465
- Issue date Mar 25, 2025
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit structure
- Patent number 12,262,497
- Issue date Mar 25, 2025
- Autonetworks Technologies, Ltd.
- Akira Haraguchi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed board
- Patent number 12,262,466
- Issue date Mar 25, 2025
- NIDEC SANKYO CORPORATION
- Junro Takeuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Point heat detectors based on surface mounted thermistors
- Patent number 12,260,724
- Issue date Mar 25, 2025
- Honeywell International Inc.
- Andrea Chiatti
- G08 - SIGNALLING
Information Patent Grant
Illuminating circuit structure
- Patent number 12,259,112
- Issue date Mar 25, 2025
- Darfon Electronics Corp.
- Hsin-Cheng Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board
- Patent number 12,262,470
- Issue date Mar 25, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 12,262,472
- Issue date Mar 25, 2025
- Hyundai Motor Company
- Nam Sik Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package board, antenna package including the same and image display...
- Patent number 12,255,414
- Issue date Mar 18, 2025
- Dongwoo Fine-Chem Co., Ltd.
- Na Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid boards with embedded planes
- Patent number 12,256,487
- Issue date Mar 18, 2025
- Intel Corporation
- Jackson Chung Peng Kong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure
- Patent number 12,256,488
- Issue date Mar 18, 2025
- Unimicron Technology Corp.
- Chih-Chiang Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device
- Patent number 12,254,803
- Issue date Mar 18, 2025
- Samsung Display Co., Ltd.
- Tae Hoon Kwon
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board
- Patent number 12,256,501
- Issue date Mar 18, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- In Gun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 12,250,768
- Issue date Mar 11, 2025
- DexCom, Inc.
- Sean Frick
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wiring board and wiring board manufacturing method
- Patent number 12,250,773
- Issue date Mar 11, 2025
- Shinko Electric Industries Co., Ltd.
- Toshiaki Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20250120010
- Publication date Apr 10, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS
- Publication number 20250120020
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Fei Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER RADIO FREQUENCY COMPONENT
- Publication number 20250118881
- Publication date Apr 10, 2025
- Knowles Cazenovia, Inc.
- Jared P. Burdick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUS CONNECTION CABLE REVERSE-WELDING STRUCTURE
- Publication number 20250118912
- Publication date Apr 10, 2025
- JESS-LINK PRODUCTS CO., LTD.
- Wen-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL CONNECTION PORTION FOR ELECTRONIC DEVICE
- Publication number 20250118340
- Publication date Apr 10, 2025
- NHK Spring Co., Ltd.
- Yukie YAMADA
- G11 - INFORMATION STORAGE
Information Patent Application
Contact Hole Assembly and Electronic Device
- Publication number 20250120017
- Publication date Apr 10, 2025
- LG Display Co., Ltd.
- Hyeon-Sik Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250120006
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Chul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECEPTACLE ASSEMBLY AND CIRCUIT BOARD
- Publication number 20250120007
- Publication date Apr 10, 2025
- Yamaichi Electronics Co., Ltd.
- Toshiyasu ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250120009
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE
- Publication number 20250113432
- Publication date Apr 3, 2025
- Global Unichip Corporation
- Huan-Yi LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20250113433
- Publication date Apr 3, 2025
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE...
- Publication number 20250112142
- Publication date Apr 3, 2025
- SIEMENS AKTIENGESELLSCHAFT
- MARKUS LASCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250106985
- Publication date Mar 27, 2025
- Innolux Corporation
- Ju-Li Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250107005
- Publication date Mar 27, 2025
- HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
- Xiao-Long HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250107055
- Publication date Mar 27, 2025
- Cisco Technology, Inc.
- Wenbin Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...
- Publication number 20250106987
- Publication date Mar 27, 2025
- CYNTEC CO., LTD.
- Chia-Fu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Source Printed Circuit Board and Display Device
- Publication number 20250104652
- Publication date Mar 27, 2025
- LG Display Co., Ltd.
- ChulWoo Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250105197
- Publication date Mar 27, 2025
- Mitsubishi Electric Corporation
- Tatsuto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Publication number 20250106997
- Publication date Mar 27, 2025
- Intel Corporation
- Ehsan ZAMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20250098077
- Publication date Mar 20, 2025
- HZO, Inc.
- Gianfranco Aresta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
- Publication number 20250096094
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250098060
- Publication date Mar 20, 2025
- AT&S (Chongqing) Company Limited
- Lei Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250098067
- Publication date Mar 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SWITCHING POWER SUPPLY DEVICE
- Publication number 20250096673
- Publication date Mar 20, 2025
- Murata Manufacturing Co., Ltd.
- Tatsuya HOSOTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
- Publication number 20250098066
- Publication date Mar 20, 2025
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
- Publication number 20250098068
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kiyohito NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20250098404
- Publication date Mar 20, 2025
- SAMSUNG DISPLAY CO., LTD.
- Kiho Bang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Shape and layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical module assembly, optical module, package for optical module...

Method for producing a carrier arrangement

Flexible printed circuit board, COF module, and electronic device c...

Printed circuit board

Semiconductor device, power conversion apparatus, moving body, and...

Leadless current sensor package with high isolation

System and method for reversible connection of interchangeable comp...

Apparatus and methods for nanoplasma switches

Mounting structure of electronic component

Electronic component sub-mount and electronic device using the same

Support assembly, unit, and light module for a motor vehicle lighti...

Wiring board, electronic module, and electronic apparatus

Electronic component and manufacturing method thereof

Capacitor-wire-embedded wiring board

Circuit board

Circuit structure

Printed board

Point heat detectors based on surface mounted thermistors

Illuminating circuit structure

Printed circuit board

Power module

Package board, antenna package including the same and image display...

Hybrid boards with embedded planes

Circuit board structure

Electronic component mounting substrate, electronic component mount...

Display device

Rapid implementation of high-temperature analog interface electronics

Printed circuit board

Sensor interposer employing castellated through-vias

Wiring board and wiring board manufacturing method

Patents Applicationslast 30 patents

WIRING BOARD

SIGNAL TRACE TRANSITION FOR HIGH DATA RATE APPLICATIONS

MULTILAYER RADIO FREQUENCY COMPONENT

BUS CONNECTION CABLE REVERSE-WELDING STRUCTURE

TERMINAL CONNECTION PORTION FOR ELECTRONIC DEVICE

Contact Hole Assembly and Electronic Device

PRINTED CIRCUIT BOARD

RECEPTACLE ASSEMBLY AND CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD DEVICE AND ITS CIRCUIT MODULE

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING BOARD AND SEMICONDUCTOR DEVICE

ARRANGEMENT FOR A SEMICONDUCTOR ARRANGEMENT COMPRISING AT LEAST ONE...

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

ELECTRONIC DEVICE

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY

FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...

Source Printed Circuit Board and Display Device

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES

COATED ELECTRICAL ASSEMBLY

IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION

Component Carrier and Method of Manufacturing the Same

PRINTED CIRCUIT BOARD

SWITCHING POWER SUPPLY DEVICE

PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT

DISPLAY DEVICE