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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/09Shape and layout
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
    • Publication number 20250106998
    • Publication date Mar 27, 2025
    • Canon Kabushiki Kaisha
    • TAKASHI NUMAGI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20250106985
    • Publication date Mar 27, 2025
    • Innolux Corporation
    • Ju-Li Wang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250107005
    • Publication date Mar 27, 2025
    • HongQiSheng Precision Electronics (QinHuangdao) Co., Ltd.
    • Xiao-Long HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250107008
    • Publication date Mar 27, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyun Hu Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ABSORBER FOR PRINTED CIRCUIT BOARD ASSEMBLY
    • Publication number 20250107055
    • Publication date Mar 27, 2025
    • Cisco Technology, Inc.
    • Wenbin Ma
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...
    • Publication number 20250106987
    • Publication date Mar 27, 2025
    • CYNTEC CO., LTD.
    • Chia-Fu Hsu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • Publication number 20250105197
    • Publication date Mar 27, 2025
    • Mitsubishi Electric Corporation
    • Tatsuto NISHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Source Printed Circuit Board and Display Device
    • Publication number 20250104652
    • Publication date Mar 27, 2025
    • LG Display Co., Ltd.
    • ChulWoo Park
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Application

    ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
    • Publication number 20250106997
    • Publication date Mar 27, 2025
    • Intel Corporation
    • Ehsan ZAMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COATED ELECTRICAL ASSEMBLY
    • Publication number 20250098077
    • Publication date Mar 20, 2025
    • HZO, Inc.
    • Gianfranco Aresta
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    IO INTERCONNECT CAGE STRUCTURE FOR PACKAGE FORM REDUCTION
    • Publication number 20250096094
    • Publication date Mar 20, 2025
    • QUALCOMM Incorporated
    • Aniket PATIL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Component Carrier and Method of Manufacturing the Same
    • Publication number 20250098060
    • Publication date Mar 20, 2025
    • AT&S (Chongqing) Company Limited
    • Lei Tang
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250098067
    • Publication date Mar 20, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Chi Hyeon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SWITCHING POWER SUPPLY DEVICE
    • Publication number 20250096673
    • Publication date Mar 20, 2025
    • Murata Manufacturing Co., Ltd.
    • Tatsuya HOSOTANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK
    • Publication number 20250098066
    • Publication date Mar 20, 2025
    • QUALCOMM Incorporated
    • Hong Bok WE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
    • Publication number 20250098068
    • Publication date Mar 20, 2025
    • KIOXIA Corporation
    • Kiyohito NISHIHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY APPARATUS
    • Publication number 20250093702
    • Publication date Mar 20, 2025
    • Samsung Electronics Co., Ltd.
    • Ajeong KANG
    • F21 - LIGHTING
  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20250098404
    • Publication date Mar 20, 2025
    • SAMSUNG DISPLAY CO., LTD.
    • Kiho Bang
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Application

    STORAGE DEVICE
    • Publication number 20250089170
    • Publication date Mar 13, 2025
    • Samsung Electronics Co., Ltd.
    • Suin KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20250089171
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICES AND METHODS RELATED TO METALLIZATION OF CERAMIC SUBSTRATES...
    • Publication number 20250089154
    • Publication date Mar 13, 2025
    • Skyworks Solutions, Inc.
    • Shaul BRANCHEVSKY
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER SUBSTRATE
    • Publication number 20250089160
    • Publication date Mar 13, 2025
    • Murata Manufacturing Co., Ltd.
    • Tomoki YAMAMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE STRUCTURE
    • Publication number 20250089162
    • Publication date Mar 13, 2025
    • Subtron Technology Co., Ltd.
    • Chung Ying Lu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE
    • Publication number 20250089168
    • Publication date Mar 13, 2025
    • Shinko Electric Industries Co., Ltd.
    • Kensuke UCHIDA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20250089172
    • Publication date Mar 13, 2025
    • LG Innotek Co., Ltd.
    • Eom Ji KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPUTING NODE AND COMPUTING DEVICE
    • Publication number 20250089169
    • Publication date Mar 13, 2025
    • xFusion Digital Technologies Co., Ltd
    • Guoqiang Liu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
    • Publication number 20250089174
    • Publication date Mar 13, 2025
    • International Business Machines Corporation
    • Hongqing ZHANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20250089165
    • Publication date Mar 13, 2025
    • Samsung Electro-Mechanics Co., Ltd.
    • Seong Hun NA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING SUBSTRATE
    • Publication number 20250089167
    • Publication date Mar 13, 2025
    • IBIDEN CO., LTD.
    • Shunsuke SAKAI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    POWER MODULE
    • Publication number 20250081346
    • Publication date Mar 6, 2025
    • Hyundai Motor Company
    • Se Yoon JEONG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR