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CPC
H05K2201/09

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09Shape and layout

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electric motor and printed circuit board
- Patent number 12,362,622
- Issue date Jul 15, 2025
- GKN Powder Metallurgy Engineering GmbH
- Stefan Tiller
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Patterned conductive article
- Patent number 12,363,825
- Issue date Jul 15, 2025
- 3M Innovative Properties Company
- Raymond P. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure for flexible printed board and method for manu...
- Patent number 12,362,525
- Issue date Jul 15, 2025
- Autonetworks Technologies, Ltd.
- Shinji Nozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel
- Patent number 12,363,824
- Issue date Jul 15, 2025
- Yungu (Gu'an) Technology Co., Ltd.
- Hongrui Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,363,830
- Issue date Jul 15, 2025
- CARUX TECHNOLOGY PTE. LTD.
- Hsin-Fa Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,356,546
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Woo Seok Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 12,356,547
- Issue date Jul 8, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,356,541
- Issue date Jul 8, 2025
- HITACHI ASTEMO, LTD.
- Ryo Akiba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-guided placement of memory device component packages
- Patent number 12,349,278
- Issue date Jul 1, 2025
- SanDisk Technologies, Inc.
- Uthayarajan A/L Rasalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable electronic device
- Patent number 12,349,286
- Issue date Jul 1, 2025
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Stephan Harkema
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuit board assembly and electronic device inclu...
- Patent number 12,349,271
- Issue date Jul 1, 2025
- Samsung Electronics Co., Ltd.
- Bumhee Bae
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component embedded substrate
- Patent number 12,349,283
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board including a core layer provided with plurality of ins...
- Patent number 12,349,288
- Issue date Jul 1, 2025
- LG Innotek Co., Ltd
- Myung Jae Kwon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost, low loss material for microwave or antenna printed circui...
- Patent number 12,347,927
- Issue date Jul 1, 2025
- Hughes Network Systems, L.L.C.
- Bingqian Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitors in through glass vias
- Patent number 12,349,282
- Issue date Jul 1, 2025
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connectors for linear lighting
- Patent number 12,345,398
- Issue date Jul 1, 2025
- Elemental LED, Inc.
- Kenneth A. Afan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 12,349,273
- Issue date Jul 1, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional circuit mounting structures
- Patent number 12,342,448
- Issue date Jun 24, 2025
- NVIDIA Corp.
- Joey Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board and electric wiring
- Patent number 12,342,459
- Issue date Jun 24, 2025
- MEKTEC CORPORATION
- Shunsuke Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,342,462
- Issue date Jun 24, 2025
- Samsung Display Co., Ltd.
- Tae Hyun Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods to fill through-holes of a substrate with metal paste
- Patent number 12,342,470
- Issue date Jun 24, 2025
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layer-to-layer registration measurement mark
- Patent number 12,342,455
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Hiroyuki Mori
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board and electronic device
- Patent number 12,342,452
- Issue date Jun 24, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ESD structure for a display substrate edge
- Patent number 12,342,453
- Issue date Jun 24, 2025
- Innolux Corporation
- Chiu-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method of wiring board
- Patent number 12,342,457
- Issue date Jun 24, 2025
- Shinko Electric Industries Co., Ltd.
- Takashi Kasuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate unit and substrate assembly, and camera module using same
- Patent number 12,342,475
- Issue date Jun 24, 2025
- LG Innotek Co., Ltd
- Hyun Woo Ryou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Display panel, display device, and driver chip
- Patent number 12,336,099
- Issue date Jun 17, 2025
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Yiyu Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...
- Publication number 20250227837
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- John A. Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING ARCHITECTURE FOR A HIGH FREQUENCY ACTIVE ELECTRONICALLY S...
- Publication number 20250227848
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250227846
- Publication date Jul 10, 2025
- Murata Manufacturing Co., Ltd.
- Yasuhiro TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...
- Publication number 20250227854
- Publication date Jul 10, 2025
- HAMILTON SUNDSTRAND CORPORATION
- Robert C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER
- Publication number 20250227857
- Publication date Jul 10, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...
- Publication number 20250227840
- Publication date Jul 10, 2025
- LG Innotek Co., Ltd.
- Sang Hun PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20250218917
- Publication date Jul 3, 2025
- LG Display Co., Ltd.
- Jun HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...
- Publication number 20250220823
- Publication date Jul 3, 2025
- Hitron Technologies Inc.
- KUO-HAO PAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board Assembly and Electronic Device
- Publication number 20250220096
- Publication date Jul 3, 2025
- Honor Device Co., Ltd.
- Tianye Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TEST PAD
- Publication number 20250220807
- Publication date Jul 3, 2025
- Chipbond Technology Corporation
- Kung-Tzu Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL, BONDING DEVICE THEREOF, AND DISPLAY DEVICE
- Publication number 20250220803
- Publication date Jul 3, 2025
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya DONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL PLANAR METROLOGY MOUNTING DEVICE AND METHODS FOR ABRASIVE C...
- Publication number 20250216190
- Publication date Jul 3, 2025
- The United States of America, as represented by the Secretary of the Navy
- Derek Lengacher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250220815
- Publication date Jul 3, 2025
- PanelSemi Corporation
- CHIN-TANG LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND TERMINAL DEVICE
- Publication number 20250220816
- Publication date Jul 3, 2025
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- MING-HSUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
- Publication number 20250220804
- Publication date Jul 3, 2025
- Prime World International Holdings Ltd.
- Chao-Hung TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POINT HEAT DETECTORS BASED ON SURFACE MOUNTED THERMISTORS
- Publication number 20250218267
- Publication date Jul 3, 2025
- Honeywell International Inc.
- Andrea Chiatti
- G08 - SIGNALLING
Information Patent Application
CIRCUIT BOARD
- Publication number 20250220810
- Publication date Jul 3, 2025
- LG Innotek Co., Ltd.
- Han Sang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...
- Publication number 20250220814
- Publication date Jul 3, 2025
- Shenzhen STS Microelectronics Co., Ltd.
- Qiao CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONDUCTING PLATE STRUCTURE FOR AXIAL FAN
- Publication number 20250207600
- Publication date Jun 26, 2025
- Asia Vital Components Co., Ltd.
- Hsu-Jung Lin
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY
- Publication number 20250212317
- Publication date Jun 26, 2025
- NVIDIA Corporation
- Tibet Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...
- Publication number 20250212320
- Publication date Jun 26, 2025
- Rockwell Collins, Inc.
- James B. Mayfield
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20250212321
- Publication date Jun 26, 2025
- Dyi-Chung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERSONAL ANOMALY DETECTION METHODS AND APPARATUS
- Publication number 20250211965
- Publication date Jun 26, 2025
- Ouraring, Inc.
- Denis MARS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20250211663
- Publication date Jun 26, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Haotian YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE PRINTED CIRCUIT, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DE...
- Publication number 20250212330
- Publication date Jun 26, 2025
- Huawei Technologies Co., Ltd
- Tong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250212334
- Publication date Jun 26, 2025
- Mitsubishi Electric Corporation
- Taketoshi SHIKANO
- H01 - BASIC ELECTRIC ELEMENTS

Shape and layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electric motor and printed circuit board

Patterned conductive article

Connection structure for flexible printed board and method for manu...

Display panel

Electronic substrate and electronic device

Electronic device and manufacturing method thereof

Electronic component module

Printed circuit board

Printed circuit board

Electronic control device

Self-guided placement of memory device component packages

Recyclable electronic device

Flexible printed circuit board assembly and electronic device inclu...

Apparatus, system, and method for achieving certain characteristics...

Electronic component embedded substrate

Circuit board including a core layer provided with plurality of ins...

Low cost, low loss material for microwave or antenna printed circui...

Capacitors in through glass vias

Connectors for linear lighting

Printed circuit board

Three dimensional circuit mounting structures

Flexible printed wiring board and electric wiring

Display device

Methods to fill through-holes of a substrate with metal paste

Layer-to-layer registration measurement mark

Circuit board and electronic device

ESD structure for a display substrate edge

Wiring board and manufacturing method of wiring board

Substrate unit and substrate assembly, and camera module using same

Display panel, display device, and driver chip

Patents Applicationslast 30 patents

SELECTIVE REMOVAL OF ADHESIVE FROM COVERLAY FOR PRINTED CIRCUIT BOA...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

PACKAGING ARCHITECTURE FOR A HIGH FREQUENCY ACTIVE ELECTRONICALLY S...

WIRING BOARD

COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CON...

MANUFACTURING METHOD OF CIRCUIT CARRIER

FLEXIBLE PRINTED CIRCUIT BOARD, COF MODULE, AND ELECTRONIC DEVICE C...

DISPLAY DEVICE

METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED S...

Circuit Board Assembly and Electronic Device

TEST PAD

DISPLAY PANEL, BONDING DEVICE THEREOF, AND DISPLAY DEVICE

OPTICAL PLANAR METROLOGY MOUNTING DEVICE AND METHODS FOR ABRASIVE C...

ELECTRONIC DEVICE

CIRCUIT BOARD ASSEMBLY AND TERMINAL DEVICE

OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA

POINT HEAT DETECTORS BASED ON SURFACE MOUNTED THERMISTORS

CIRCUIT BOARD

MULTILAYER PRINTED CIRCUIT BOARD FOR INTERCONNECTING PIN(S) AND SEM...

PRINTED CIRCUIT BOARD

ELECTRICAL CONDUCTING PLATE STRUCTURE FOR AXIAL FAN

SLOT GROUND FOR IMPROVED SIGNAL INTEGRITY

METHOD FOR ACCOMMODATING SUBSTRATE WARPAGE IN PRINTED CIRCUIT BOARD...

SUBSTRATE AND MANUFACTURING METHOD THEREOF

WIRING BOARD

PERSONAL ANOMALY DETECTION METHODS AND APPARATUS

DISPLAY MODULE AND DISPLAY DEVICE

FLEXIBLE PRINTED CIRCUIT, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DE...

SEMICONDUCTOR MODULE