Shape and layout

Industry

CPC
H05K2201/09

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09Shape and layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,982,704
- Issue date May 14, 2024
- E Ink Holdings Inc.
- Ruei-Huan Rao
- G01 - MEASURING TESTING
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery connection module and battery device
- Patent number 11,979,989
- Issue date May 7, 2024
- Molex, LLC
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,979,985
- Issue date May 7, 2024
- LG Innotek Co., Ltd
- Won Suk Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electric device including the same, and bondi...
- Patent number 11,979,987
- Issue date May 7, 2024
- Samsung Display Co., Ltd.
- Han-Sung Bae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method of manufacturing a three-dimensional electronic module havin...
- Patent number 11,974,399
- Issue date Apr 30, 2024
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silica-containing substrates with vias having an axially variable s...
- Patent number 11,972,993
- Issue date Apr 30, 2024
- Corning Incorporated
- Rachel Eileen Dahlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,974,388
- Issue date Apr 30, 2024
- LG Innotek Co., Ltd
- Byeong Kyun Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards and memory modules
- Patent number 11,974,391
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dongyoon Seo
- G11 - INFORMATION STORAGE
Information Patent Grant
Decoupled PCB structure to parallel power transistors
- Patent number 11,973,414
- Issue date Apr 30, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Stretchable substrate having improved stretch uniformity and method...
- Patent number 11,968,778
- Issue date Apr 23, 2024
- Korea Institute of Science and Technology
- Phillip Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Capacitor assembly
- Patent number 11,968,784
- Issue date Apr 23, 2024
- PRODRIVE TECHNOLOGIES INNOVATION SERVICES B.V.
- Michel Alexander Hagenaar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and disk device
- Patent number 11,968,781
- Issue date Apr 23, 2024
- Kabushiki Kaisha Toshiba
- Kazuyoshi Akutsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting display device including dam structure and a...
- Patent number 11,968,860
- Issue date Apr 23, 2024
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Printed circuit board and display device including the same
- Patent number 11,968,775
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Yeon Sun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,963,301
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shunt resistor module
- Patent number 11,961,642
- Issue date Apr 16, 2024
- LG ENERGY SOLUTION, LTD.
- Dong-Wan Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB for heatsink based power delivery
- Patent number 11,963,289
- Issue date Apr 16, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component
- Patent number 11,963,302
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Masato Nomiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-assisted BGA joint formation
- Patent number 11,963,307
- Issue date Apr 16, 2024
- International Business Machines Corporation
- Matthew Doyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,963,311
- Issue date Apr 16, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jae Woong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit carrier arrangement and method for producing such a circuit...
- Patent number 11,961,785
- Issue date Apr 16, 2024
- Vitesco Technologies GmbH
- Jens Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged semiconductor device
- Patent number 11,955,479
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric wire connection structure, electric wire connection method...
- Patent number 11,955,740
- Issue date Apr 9, 2024
- PROTERIAL, LTD.
- Ryuta Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,957,018
- Issue date Apr 9, 2024
- Innolux Corporation
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure between printed circuit board and terminal blo...
- Patent number 11,955,739
- Issue date Apr 9, 2024
- Daikin Industries, Ltd.
- Kazunari Fukagawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164026
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Neurotrophic Electrode Array
- Publication number 20240156385
- Publication date May 16, 2024
- Neural Logistics LLC
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164019
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD
- Publication number 20240164017
- Publication date May 16, 2024
- Nitto Denko Corporation
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164028
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL BOARD, CONTROL APPARATUS AND METHOD FOR SECURITY ENHANCEMEN...
- Publication number 20240164011
- Publication date May 16, 2024
- HL KLEMOVE CORP.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING FUNCTIONAL LAYER, METHOD FOR MANUFACTURING ELECT...
- Publication number 20240155769
- Publication date May 9, 2024
- RICOH COMPANY, LTD.
- Yukihiro WAKABAYASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240155771
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jae Ho Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Printed Wiring Board and Method for Manufacturing Same
- Publication number 20240155763
- Publication date May 9, 2024
- Nippon Mektron, Ltd.
- Yoshihiko Narisawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING ARRANGEMENT
- Publication number 20240155766
- Publication date May 9, 2024
- ROBERT BOSCH GmbH
- Guenter Gera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240155764
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240155776
- Publication date May 9, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240155777
- Publication date May 9, 2024
- InnoLux Corporation
- Yuan-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240147634
- Publication date May 2, 2024
- Samsung Electro-Mechanics Co., Ltd.
- In Gun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE, METHOD FOR DESIGNING SEMICONDUCTOR SUBSTRA...
- Publication number 20240147603
- Publication date May 2, 2024
- NEC Corporation
- Naoki Oshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE DEVICE
- Publication number 20240147611
- Publication date May 2, 2024
- Japan Display Inc.
- Takumi SANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE
- Publication number 20240147621
- Publication date May 2, 2024
- Hitachi Astemo, Ltd.
- Narutoshi YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD-TO-BOARD CONNECTOR
- Publication number 20240145957
- Publication date May 2, 2024
- Japan Aviation Electronics Industry, Ltd.
- Osamu HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
- Publication number 20240147605
- Publication date May 2, 2024
- HIROSE ELECTRIC CO., LTD.
- Xingyu CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240147612
- Publication date May 2, 2024
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...
- Publication number 20240147617
- Publication date May 2, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takayoshi NIRENGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Single Layer Capacitor
- Publication number 20240136123
- Publication date Apr 25, 2024
- KYOCERA AVX Components Corporation
- Ronald S. Demcko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240136294
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE
- Publication number 20240136740
- Publication date Apr 25, 2024
- NIPPON MEKTRON, LTD.
- Shuzo YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE FILM AND TEST COMPONENT
- Publication number 20240130040
- Publication date Apr 18, 2024
- Innolux Corporation
- Ker-Yih Kao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...
- Publication number 20240130045
- Publication date Apr 18, 2024
- Medimaging Integrated Solution, Inc.
- SHANGYI WU
- G02 - OPTICS
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240130033
- Publication date Apr 18, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240130042
- Publication date Apr 18, 2024
- Murata Manufacturing Co., Ltd.
- Kumiko ISHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shape and layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated circuit board

Electronic device

Component-embedded substrate

Battery connection module and battery device

Printed circuit board

Electronic component, electric device including the same, and bondi...

Method of manufacturing a three-dimensional electronic module havin...

Silica-containing substrates with vias having an axially variable s...

Circuit board

Printed circuit boards and memory modules

Decoupled PCB structure to parallel power transistors

Stretchable substrate having improved stretch uniformity and method...

Capacitor assembly

Array substrate and method of mounting integrated circuit using the...

Printed circuit board and disk device

Printed circuit board structure including a closed cavity

Organic light emitting display device including dam structure and a...

Printed circuit board and display device including the same

Printed circuit board

Shunt resistor module

PCB for heatsink based power delivery

Electronic component

Vacuum-assisted BGA joint formation

Printed circuit board and method of manufacturing the same

Circuit carrier arrangement and method for producing such a circuit...

Three-dimensional (3D) copper in printed circuit boards

Packaged semiconductor device

Electric wire connection structure, electric wire connection method...

Display device

Connection structure between printed circuit board and terminal blo...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

Neurotrophic Electrode Array

PRINTED CIRCUIT BOARD

WIRING CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

CONTROL BOARD, CONTROL APPARATUS AND METHOD FOR SECURITY ENHANCEMEN...

METHOD FOR FORMING FUNCTIONAL LAYER, METHOD FOR MANUFACTURING ELECT...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...

Flexible Printed Wiring Board and Method for Manufacturing Same

CONNECTING ARRANGEMENT

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD

SEMICONDUCTOR SUBSTRATE, METHOD FOR DESIGNING SEMICONDUCTOR SUBSTRA...

STRETCHABLE DEVICE

METHOD FOR MANUFACTURING CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

BOARD-TO-BOARD CONNECTOR

INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR

PRINTED WIRING BOARD

WIRING BODY, MOUNTING SUBSTRATE, WIRING-EQUIPPED WIRING TRANSFER PL...

Single Layer Capacitor

WIRING SUBSTRATE

FLEXIBLE PRINTED CIRCUIT CONNECTION STRUCTURE

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

CONDUCTIVE FILM AND TEST COMPONENT

LIGHT-EMITTING IMAGE SENSING MODULE AND METHOD FOR FABRICATING THE...

HEATSINK BASED POWER DELIVERY FOR CPUS

CIRCUIT BOARD