Shape and layout

Industry

CPC
H05K2201/09

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09Shape and layout

Industries

Patents Grantslast 30 patents

Information Patent Grant
Rotating compact light ranging system
- Patent number 12,320,926
- Issue date Jun 3, 2025
- Ouster, Inc.
- Angus Pacala
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board and a display device including the same
- Patent number 12,324,107
- Issue date Jun 3, 2025
- Samsung Display Co., Ltd.
- Hyo-Chul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single circuit board assembly with logic and power components
- Patent number 12,324,093
- Issue date Jun 3, 2025
- Steering Solutions IP Holding Corporation
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Apparatus for temperature measurement and method of processing subs...
- Patent number 12,317,419
- Issue date May 27, 2025
- Semes Co., Ltd.
- Yong Jun Seo
- G01 - MEASURING TESTING
Information Patent Grant
Laminated wiring board
- Patent number 12,317,426
- Issue date May 27, 2025
- Shinko Electric Industries Co., Ltd.
- Shota Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, semiconductor device, and method of manufacturing wir...
- Patent number 12,317,416
- Issue date May 27, 2025
- Kioxia Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device substrate
- Patent number 12,317,423
- Issue date May 27, 2025
- AUO Corporation
- Chun-Yueh Hou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus
- Patent number 12,309,930
- Issue date May 20, 2025
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Ren Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board-level pad pattern for multi-row QFN packages
- Patent number 12,309,921
- Issue date May 20, 2025
- Mediatek Inc.
- Hui-Chi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlocked circuit board elements and assemblies
- Patent number 12,309,928
- Issue date May 20, 2025
- Infineon Technologies Austria AG
- Darryl Galipeau
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electrical device, in particular inverter or converter
- Patent number 12,309,927
- Issue date May 20, 2025
- Sew-Eurodrive GmbH & Co. KG
- Werner Groß
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board with offset connection pads and inclined i...
- Patent number 12,306,210
- Issue date May 20, 2025
- Kyocera Corporation
- Hitoshi Tega
- G01 - MEASURING TESTING
Information Patent Grant
Circuit carrier and manufacturing method thereof and package structure
- Patent number 12,309,943
- Issue date May 20, 2025
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multistage capacitive crosstalk compensation arrangement
- Patent number 12,308,573
- Issue date May 20, 2025
- CommScope Technologies LLC
- David Patrick Murray
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic prototyping interoperability
- Patent number 12,308,586
- Issue date May 20, 2025
- Microsoft Technology Licensing, LLC
- Stephen Edward Hodges
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module assembly, optical module, package for optical module...
- Patent number 12,309,917
- Issue date May 20, 2025
- Sumitomo Electric Industries, Ltd.
- Taichi Misawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of making metal patterns on flexible substrate
- Patent number 12,309,939
- Issue date May 20, 2025
- 3M Innovative Properties Company
- Henrik B. van Lengerich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder stop feature for electronic devices
- Patent number 12,300,643
- Issue date May 13, 2025
- Infineon Technologies AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,298,633
- Issue date May 13, 2025
- Samsung Display Co., Ltd.
- Han Ho Park
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Wiring substrate
- Patent number 12,302,493
- Issue date May 13, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method to eliminate via striping
- Patent number 12,302,496
- Issue date May 13, 2025
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device mountable in an electrical motor and method for m...
- Patent number 12,301,069
- Issue date May 13, 2025
- Melexis Bulgaria Ltd
- Dirk Leman
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Conductive structure including copper-phosphorous alloy and a metho...
- Patent number 12,293,966
- Issue date May 6, 2025
- Chun-Ming Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board and storage device including the same
- Patent number 12,295,095
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sunhong Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with partially metallized hole using anti-plating...
- Patent number 12,295,108
- Issue date May 6, 2025
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Jiangfeng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal processing board and image forming apparatus
- Patent number 12,295,093
- Issue date May 6, 2025
- Kyocera Document Solutions Inc.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board
- Patent number 12,295,099
- Issue date May 6, 2025
- Shinko Electric Industries Co., Ltd.
- Yuta Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 12,289,828
- Issue date Apr 29, 2025
- Murata Manufacturing Co., Ltd.
- Kosuke Nishio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183186
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Sungoh Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING TRENCH IN IC CHIP THROUGH MULTIPLE TRENCH FORMATION AND DEP...
- Publication number 20250185171
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kao-Chih Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR
- Publication number 20250185179
- Publication date Jun 5, 2025
- BlackBerry Limited
- Jason Wayne JANTZI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device and Manufacturing Method thereof
- Publication number 20250183148
- Publication date Jun 5, 2025
- InnoLux Corporation
- Kuang-Ming FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20250185157
- Publication date Jun 5, 2025
- KYOCERA CORPORATION
- Suguru KADOWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE
- Publication number 20250185139
- Publication date Jun 5, 2025
- LIGHTING DEFENSE GROUP, LLC
- Daniel S. Spiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20250185165
- Publication date Jun 5, 2025
- AOI ELECTRONICS CO., LTD.
- Takashi SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS A...
- Publication number 20250185176
- Publication date Jun 5, 2025
- Raytheon Company
- Charles Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250185180
- Publication date Jun 5, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...
- Publication number 20250176113
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Luciano ZIZZA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...
- Publication number 20250176098
- Publication date May 29, 2025
- BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunhua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176099
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250176103
- Publication date May 29, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sanghyeok Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176109
- Publication date May 29, 2025
- VERTIV CORPORATION
- RAJAN SURESH BOROLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250176111
- Publication date May 29, 2025
- Samsung Electronics Co., LTD
- Kyoungok Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME
- Publication number 20250168965
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Gyumook Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20250168978
- Publication date May 22, 2025
- Murata Manufacturing Co., Ltd.
- Yosuke MATSUSHITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE
- Publication number 20250168972
- Publication date May 22, 2025
- IBIDEN CO., LTD.
- Haruhiko MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250168980
- Publication date May 22, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Min Gyu PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT...
- Publication number 20250168991
- Publication date May 22, 2025
- Aculon, Inc.
- ERIC LEE HANSON
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BASE MEMBER
- Publication number 20250168982
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- Yoshihiko Fujise
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250168981
- Publication date May 22, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20250159802
- Publication date May 15, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Yangje Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, MEMORY MODULE INCLUDING THE SAME, AND METHOD...
- Publication number 20250159808
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Youngbong HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS
- Publication number 20250159813
- Publication date May 15, 2025
- Micron Technology, Inc.
- Kristopher D. Hamrick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC APPARATUS
- Publication number 20250158323
- Publication date May 15, 2025
- LENOVO (SINGAPORE) PTE. LTD.
- Fumitake Mizoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, BACKLIGHT MODULE, DISPLAY MODULE, AND ELECTRONIC DEVICE
- Publication number 20250155748
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Ruhai Fu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBRANE CIRCUIT BOARD
- Publication number 20250159797
- Publication date May 15, 2025
- CHICONY ELECTRONICS CO., LTD.
- CHIH-HUNG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shape and layout

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Rotating compact light ranging system

Circuit board and a display device including the same

Single circuit board assembly with logic and power components

Apparatus for temperature measurement and method of processing subs...

Laminated wiring board

Wiring board, semiconductor device, and method of manufacturing wir...

Method of manufacturing a device substrate

Display apparatus

Electronic device

Mating backplane for high speed, high density electrical connector

Board-level pad pattern for multi-row QFN packages

Interlocked circuit board elements and assemblies

Electrical device, in particular inverter or converter

Multilayer circuit board with offset connection pads and inclined i...

Circuit carrier and manufacturing method thereof and package structure

Multistage capacitive crosstalk compensation arrangement

Electronic prototyping interoperability

Optical module assembly, optical module, package for optical module...

Methods of making metal patterns on flexible substrate

Solder stop feature for electronic devices

Display device

Wiring substrate

System and method to eliminate via striping

Electronic device mountable in an electrical motor and method for m...

Conductive structure including copper-phosphorous alloy and a metho...

Printed circuit board and storage device including the same

Component carrier with partially metallized hole using anti-plating...

Signal processing board and image forming apparatus

Wiring board

Circuit board

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

FORMING TRENCH IN IC CHIP THROUGH MULTIPLE TRENCH FORMATION AND DEP...

INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR

Electronic Device and Manufacturing Method thereof

WIRING BOARD

SYSTEMS AND METHODS FOR AN INTERMEDIATE DEVICE STRUCTURE

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

STRUCTURAL ENCLOSURE FOR PROTECTION AGAINST FOREIGN OBJECT DEBRIS A...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURI...

PRINTED CIRCUIT BOARD, DISPLAY DEVICE COMPRISING THE PRINTED CIRCUI...

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CIRCUIT BOARD, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME

ELECTRONIC COMPONENT

ELECTRONIC COMPONENT MOUNTING SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT...

BASE MEMBER

ELECTRONIC DEVICE AND METHOD FOR FORMING THE SAME

PRINTED CIRCUIT BOARD ASSEMBLY

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD, MEMORY MODULE INCLUDING THE SAME, AND METHOD...

PRINTED CIRCUIT BOARDS, AND RELATED ASSEMBLIES AND ELECTRONIC SYSTEMS

CIRCUIT BOARD AND ELECTRONIC APPARATUS

CIRCUIT BOARD, BACKLIGHT MODULE, DISPLAY MODULE, AND ELECTRONIC DEVICE

MEMBRANE CIRCUIT BOARD