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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75318Shape of the auxiliary member

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Patents Grantslast 30 patents

Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic component mounting device
- Patent number 11,373,975
- Issue date Jun 28, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,024,595
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for simultaneously bonding multiple chips of different heigh...
- Patent number 10,147,702
- Issue date Dec 4, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacking apparatus having a transport device configured to tra...
- Patent number 9,842,823
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanism to attach a die to a substrate
- Patent number 9,630,269
- Issue date Apr 25, 2017
- GLOBALFOUNDRIES Inc.
- Vijayeshwar D. Khanna
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure transmitting device for bonding chips onto a substrate
- Patent number 9,305,813
- Issue date Apr 5, 2016
- EV GROUP E. THALLNER GMBH
- Markus Wimplinger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...
- Publication number 20240194633
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD
- Publication number 20230268312
- Publication date Aug 24, 2023
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Peter M. Wallace
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND BONDING METHOD USING THE SAME
- Publication number 20230057934
- Publication date Feb 23, 2023
- SAMSUNG DISPLAY CO., LTD.
- SANGDUK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20210233887
- Publication date Jul 29, 2021
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE
- Publication number 20200373275
- Publication date Nov 26, 2020
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS
- Publication number 20180366434
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...
- Publication number 20180114772
- Publication date Apr 26, 2018
- Palo Alto Research Center Incorporated
- Brent S. Krusor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
- Publication number 20110049702
- Publication date Mar 3, 2011
- Shinko Electric Industries Co., Ltd.
- Syuji NEGORO
- H01 - BASIC ELECTRIC ELEMENTS

Shape of the auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thermocompression bond tips and related apparatus and methods

Sintering tool and method for sintering an electronic subassembly

Electronic component mounting device

Thermocompression bond tips and related apparatus and methods

Sintering tool and method for sintering an electronic subassembly

Sintering device

Method for simultaneously bonding multiple chips of different heigh...

Chip-stacking apparatus having a transport device configured to tra...

Mechanism to attach a die to a substrate

Pressure transmitting device for bonding chips onto a substrate

Patents Applicationslast 30 patents

DIE BONDING TOOL WITH TILTABLE BOND HEAD FOR IMPROVED BONDING AND M...

SOFT TOUCH EUTECTIC SOLDER PRESSURE PAD

BONDING APPARATUS AND BONDING METHOD USING THE SAME

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

ELECTRONIC COMPONENT MOUNTING DEVICE

THERMOCOMPRESSION BOND TIPS AND RELATED APPARATUS AND METHODS

METHOD FOR SIMULTANEOUSLY BONDING MULTIPLE CHIPS OF DIFFERENT HEIGH...

SINTERING DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME