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H01L2224/75987

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75987Shape of the auxiliary member

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,978,717
- Issue date May 7, 2024
- Kioxia Corporation
- Yuuki Kuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and film supply apparatus
- Patent number 11,848,219
- Issue date Dec 19, 2023
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for semi-flexible eutectic bonder piece arraneg...
- Patent number 11,211,354
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hang Chang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-step direct bonding processes and tools for performing the same
- Patent number 9,521,795
- Issue date Dec 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for flip chip stacking
- Patent number 9,508,563
- Issue date Nov 29, 2016
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixing semiconductor die in dry and pressure supported assembly pro...
- Patent number 8,999,758
- Issue date Apr 7, 2015
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220293551
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Yuuki KURO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND FILM SUPPLY APPARATUS
- Publication number 20210242051
- Publication date Aug 5, 2021
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-Step Direct Bonding Processes and Tools for Performing the Same
- Publication number 20140263583
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Li Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FLIP CHIP STACKING
- Publication number 20140017852
- Publication date Jan 16, 2014
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIXTURE FOR SHAPING A LAMINATE SUBSTRATE
- Publication number 20130323345
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edmund D. Blackshear
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...
- Publication number 20130040424
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS