Shape of the insulating layers therebetween

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/0236Shape of the insulating layers therebetween

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method to minimize stress on stack via
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Information Patent Grant
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Information Patent Grant
Die and package structure
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Package structure with protective structure and method of fabricati...
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- Issue date Dec 20, 2022
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Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
Chip package structure and method for forming the same
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- Issue date Nov 24, 2020
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- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures and methods of forming an opening in...
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Information Patent Grant
Semiconductor device having metal bump and method of manufacturing...
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Information Patent Grant
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Information Patent Grant
Semiconductor device and manufacturing method thereof
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Information Patent Grant
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- Issue date Feb 4, 2020
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure and fabrication method therefor
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- Issue date Jan 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film formation apparatus for forming semiconductor structure having...
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- Issue date Jan 7, 2020
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- Chih-Hui Huang
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Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 10,510,704
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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SEMICONDUCTOR DEVICE AND METHOD
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SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS
- Publication number 20220415821
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- Kuan-Yu HUANG
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SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE
- Publication number 20220302060
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anhao CHENG
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CONTACT PAD STRUCTURES AND METHODS FOR FABRICATING CONTACT PAD STRU...
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- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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- Publication number 20220208711
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ELECTRICAL COMPONENT WITH COMPONENT INTERCONNECTION ELEMENT
- Publication number 20210375801
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3DIC STRUCTURE WITH PROTECTIVE STRUCTURE AND METHOD OF FABRICATING...
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
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Integrated Circuit Structures And Methods Of Forming An Opening In...
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- Publication date Nov 21, 2019
- Micron Technology, Inc.
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- HANA MICRON INC.
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Shape of the insulating layers therebetween

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method to minimize stress on stack via

Chip package structure

Die and package structure

Semiconductor device and method

Semiconductor package including plurality of semiconductor chips on...

Contact pad structures and methods for fabricating contact pad stru...

Package structure with protective structure and method of fabricati...

Electrical component with component interconnection element

Chip package structure

Semiconductor device having a redistribution line

Package structure and method of manufacturing the same

Method of manufacturing connection structure of semiconductor chip...

Integrated circuit structures and methods of forming an opening in...

Semiconductor package including plurality of semiconductor chips on...

Gas shower head with plural hole patterns and with corresponding di...

Semiconductor device having metal bump and method of manufacturing...

Semiconductor device

3DIC structure with protective structure and method of fabricating...

Chip package structure and method for forming the same

Integrated circuit structures and methods of forming an opening in...

Semiconductor device and method for manufacturing the same

Semiconductor device having metal bump and method of manufacturing...

Chip package and manufacturing method thereof

Semiconductor device manufacturing method

Semiconductor device

Semiconductor device and manufacturing method thereof

Chip packaging method

Redistribution layer structure and fabrication method therefor

Film formation apparatus for forming semiconductor structure having...

Package structure and method of manufacturing the same

Patents Applicationslast 30 patents

BONDING-TYPE INTERCONNECTION MEMBER

DIE AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

APPARATUS, SEMICONDUCTOR DEVICE, AND REDISTRIBUTION LAYER STRUCTURE...

SEMICONDUCTOR DEVICE AND METHOD

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICES INCLUDING RECOGNITION MARKS

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

CONTACT PAD STRUCTURES AND METHODS FOR FABRICATING CONTACT PAD STRU...

Semiconductor Device and Method

DIE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING PLURALITY OF SEMICONDUCTOR CHIPS ON...

ELECTRICAL COMPONENT WITH COMPONENT INTERCONNECTION ELEMENT

PACKAGE STRUCTURE WITH PROTECTIVE STRUCTURE AND METHOD OF FABRICATI...

CHIP PACKAGE STRUCTURE

Integrated Circuit Structures And Methods Of Forming An Opening In...

SEMICONDUCTOR DEVICE HAVING METAL BUMP AND METHOD OF MANUFACTURING...

SEMICONDUCTOR CHIPS INCLUDING REDISTRIBUTION LAYER

METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...

SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE HAVING A REDISTRIBUTION LINE

GAS SHOWER HEAD AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

3DIC STRUCTURE WITH PROTECTIVE STRUCTURE AND METHOD OF FABRICATING...

SEMICONDUCTOR DEVICE

PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR PREPARING THE SAME

3DIC STRUCTURE WITH PROTECTIVE STRUCTURE AND METHOD OF FABRICATING...

Integrated Circuit Structures And Methods Of Forming An Opening In...

SEMICONDUCTOR DEVICE AND WAFER-LEVEL PACKAGE EACH HAVING REDISTRIBU...