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SEMICONDUCTOR PACKAGE
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Publication date Jan 23, 2025
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Samsung Electronics Co., Ltd.
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H01 - BASIC ELECTRIC ELEMENTS
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FILM STRUCTURE FOR BOND PAD
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Publication number 20240387424
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Publication date Nov 21, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Julie Yang
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H01 - BASIC ELECTRIC ELEMENTS
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CAP LAYER FOR PAD OXIDATION PREVENTION
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Publication number 20240243080
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Publication date Jul 18, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Harry-Haklay Chuang
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H01 - BASIC ELECTRIC ELEMENTS
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Publication number 20240088074
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chia-Feng Cheng
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20230369278
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Publication date Nov 16, 2023
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RENESAS ELECTRONICS CORPORATION
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Yasutaka NAKASHIBA
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY APPARATUS
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Publication number 20230350524
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Publication date Nov 2, 2023
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SAMSUNG DISPLAY CO., LTD.
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Kiwook KIM
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G06 - COMPUTING CALCULATING COUNTING
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SEMICONDUCTOR DEVICE
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Publication number 20230078259
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Publication date Mar 16, 2023
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Kabushiki Kaisha Toshiba
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Yuchen HSU
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY APPARATUS
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Publication number 20220308698
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Publication date Sep 29, 2022
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SAMSUNG DISPLAY CO., LTD.
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Kiwook KIM
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G06 - COMPUTING CALCULATING COUNTING
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FILM STRUCTURE FOR BOND PAD
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Publication number 20220254744
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Publication date Aug 11, 2022
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Julie Yang
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H01 - BASIC ELECTRIC ELEMENTS
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