TREA

Shape or distribution of the fillers

Follow

Industry

  • CPC
  • H01L2224/81799
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81799Shape or distribution of the fillers
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LOW-STRESS DUAL UNDERFILL PACKAGING
    • Publication number 20150255312
    • Publication date Sep 10, 2015
    • International Business Machines Corporation
    • Peter J. Brofman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC PARTICLE ATTACHMENT MATERIAL
    • Publication number 20110278351
    • Publication date Nov 17, 2011
    • Aleksandar Aleksov
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR