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Shape or distribution of the fillers

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  • CPC
  • H01L2224/37499
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/37499Shape or distribution of the fillers
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    CLIP
    • Publication number 20250105198
    • Publication date Mar 27, 2025
    • NEXPERIA B.V.
    • Heiming Shiu
    • H01 - BASIC ELECTRIC ELEMENTS