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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Systems and processes for measuring thickness values of semiconduct...
- Patent number 10,269,758
- Issue date Apr 23, 2019
- Intel Corporation
- Zhihua Zou
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting method for flip chip bonding semico...
- Patent number 9,209,051
- Issue date Dec 8, 2015
- Samsung Electronics Co., Ltd.
- Yukimori Yoshiaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ramp-stack chip package with variable chip spacing
- Patent number 9,082,632
- Issue date Jul 14, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING
- Publication number 20240178182
- Publication date May 30, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND PROCESSES FOR MEASURING THICKNESS VALUES OF SEMICONDUCT...
- Publication number 20170186722
- Publication date Jun 29, 2017
- Intel Corporation
- Zhihua Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING APPARATUS AND MOUNTING METHOD
- Publication number 20140154838
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Yukimori YOSHIAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH VARIABLE CHIP SPACING
- Publication number 20130299977
- Publication date Nov 14, 2013
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS