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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83123Shape or position of the body

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,854,783
- Issue date Dec 26, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 11,195,741
- Issue date Dec 7, 2021
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Micro device arrangement in donor substrate
- Patent number 10,535,546
- Issue date Jan 14, 2020
- VueReal Inc.
- Gholamreza Chaji
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,650,243
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mounting method
- Patent number 9,508,679
- Issue date Nov 29, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Mitsuhiko Ueda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to achieve ultra-high chip-to-chip alignment accuracy for wa...
- Patent number 9,466,538
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Spyridon Skordas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 9,385,104
- Issue date Jul 5, 2016
- Shinkawa Ltd.
- Daisuke Tani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method and apparatus for a seal ring structure
- Patent number 9,287,188
- Issue date Mar 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 9,123,717
- Issue date Sep 1, 2015
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transistor level heterogeneous integration and system
- Patent number 7,875,952
- Issue date Jan 25, 2011
- HRL Laboratories, LLC
- Kenneth R. Elliott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE
- Publication number 20240038719
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Ting LAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE
- Publication number 20220375895
- Publication date Nov 24, 2022
- Japan Display Inc.
- Keisuke Asada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150087083
- Publication date Mar 26, 2015
- SHINKAWA LTD.
- Daisuke TANI
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20140242779
- Publication date Aug 28, 2014
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for a Seal Ring Structure
- Publication number 20140217557
- Publication date Aug 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ying Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF DIE BONDING AND APPARATUS THEREOF
- Publication number 20140102616
- Publication date Apr 17, 2014
- Industrial Technology Research Institute
- Weng-Jung LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE PAD FABRICATION FOR MICROELECTRONIC COMPONENTS
- Publication number 20130277863
- Publication date Oct 24, 2013
- SEAGATE TECHNOLOGY LLC
- Lijuan Zhong
- G11 - INFORMATION STORAGE

Shape or position of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Micro device arrangement in donor substrate

Micro device arrangement in donor substrate

Device and method for positioning first object in relation to secon...

Micro device arrangement in donor substrate

Method and apparatus for a seal ring structure

Mounting method

Method to achieve ultra-high chip-to-chip alignment accuracy for wa...

Bonding apparatus

Method and apparatus for a seal ring structure

Semiconductor device manufacturing method and manufacturing apparatus

Method of transistor level heterogeneous integration and system

Patents Applicationslast 30 patents

NOVEL METHOD OF FORMING WAFER-TO-WAFER BONDING STRUCTURE

BONDING APPARATUS AND BONDING METHOD

MANUFACTURING METHOD OF DISPLAY DEVICE AND HOLDING SUBSTRATE

BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

Method and Apparatus for a Seal Ring Structure

METHOD OF DIE BONDING AND APPARATUS THEREOF

SOLDERABLE PAD FABRICATION FOR MICROELECTRONIC COMPONENTS