Shape or position of the other item

Industry

CPC
H01L2224/81129

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81129Shape or position of the other item

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Chip on glass package assembly
- Patent number 10,692,815
- Issue date Jun 23, 2020
- Novatek Microelectronics Corp.
- Wei-Kuo Mai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photodetector-arrays and methods of fabrication thereof
- Patent number 10,644,061
- Issue date May 5, 2020
- Semi-Conductor Devices-An Elbit Systems-Rafael Partnership
- Yoram Karni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including asymmetric electrode arrangement
- Patent number 9,585,197
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Chin-sung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chips with through electrodes
- Patent number 9,355,859
- Issue date May 31, 2016
- Rohm Co., Ltd.
- Azusa Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for controlling positions of stacked dies
- Patent number 9,209,165
- Issue date Dec 8, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ramp-stack chip package with variable chip spacing
- Patent number 9,082,632
- Issue date Jul 14, 2015
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING INTEGRATED MODULE
- Publication number 20190113696
- Publication date Apr 18, 2019
- Artilux Inc.
- Shu-Lu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON GLASS PACKAGE ASSEMBLY
- Publication number 20190057938
- Publication date Feb 21, 2019
- NOVATEK MICROELECTRONICS CORP.
- Wei-Kuo Mai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
- Publication number 20150137358
- Publication date May 21, 2015
- Rohm Co., Ltd.
- Azusa YANAGISAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RAMP-STACK CHIP PACKAGE WITH VARIABLE CHIP SPACING
- Publication number 20130299977
- Publication date Nov 14, 2013
- Oracle International Corporation
- Michael H. S. Dayringer
- H01 - BASIC ELECTRIC ELEMENTS

Shape or position of the other item

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device and method for positioning first object in relation to secon...

Chip on glass package assembly

Photodetector-arrays and methods of fabrication thereof

Semiconductor device including asymmetric electrode arrangement

Stacked chips with through electrodes

Technique for controlling positions of stacked dies

Ramp-stack chip package with variable chip spacing

Patents Applicationslast 30 patents

METHOD OF FORMING INTEGRATED MODULE

CHIP ON GLASS PACKAGE ASSEMBLY

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION METHOD

RAMP-STACK CHIP PACKAGE WITH VARIABLE CHIP SPACING