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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for positioning first object in relation to secon...
- Patent number 11,139,193
- Issue date Oct 5, 2021
- Shinkawa Ltd.
- Tetsuya Utano
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Electronic packages and methods of making and using the same
- Patent number 9,666,516
- Issue date May 30, 2017
- General Electric Company
- Scott Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a semiconductor element and a fixed...
- Patent number 9,437,520
- Issue date Sep 6, 2016
- Toyota Jidosha Kabushiki Kaisha
- Norimune Orimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 9,385,104
- Issue date Jul 5, 2016
- Shinkawa Ltd.
- Daisuke Tani
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 9,123,717
- Issue date Sep 1, 2015
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20220406747
- Publication date Dec 22, 2022
- SHINKAWA LTD.
- Hideharu NIHEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150087083
- Publication date Mar 26, 2015
- SHINKAWA LTD.
- Daisuke TANI
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20140242779
- Publication date Aug 28, 2014
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING...
- Publication number 20120315710
- Publication date Dec 13, 2012
- Kazuyuki Hozawa
- H01 - BASIC ELECTRIC ELEMENTS