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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

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H01L2924/1615Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with guard ring
- Patent number 12,154,895
- Issue date Nov 26, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor memory device and structure
- Patent number 12,154,817
- Issue date Nov 26, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 12,136,562
- Issue date Nov 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 12,131,974
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and memory...
- Patent number 12,125,737
- Issue date Oct 22, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,100,611
- Issue date Sep 24, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Package structure having lid with protrusion and manufacturing meth...
- Patent number 12,094,792
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturable devices formed on gallium and nitrogen material
- Patent number 12,088,065
- Issue date Sep 10, 2024
- KYOCERA SLD Laser, Inc.
- Melvin McLaurin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 12,080,630
- Issue date Sep 3, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding and DRAM memory...
- Patent number 12,068,187
- Issue date Aug 20, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 12,033,884
- Issue date Jul 9, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package
- Patent number 12,002,735
- Issue date Jun 4, 2024
- Tien-Chien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,984,381
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach process and dispenser head
- Patent number 11,972,956
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation sheet, manufacturing method of heat dissipation sh...
- Patent number 11,967,539
- Issue date Apr 23, 2024
- Fujitsu Limited
- Shinichi Hirose
- B32 - LAYERED PRODUCTS
Information Patent Grant
3DIC packaging with hot spot thermal management features
- Patent number 11,961,779
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,923,230
- Issue date Mar 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Proximity sensor including enclosed accommodation space with sealed...
- Patent number 11,914,072
- Issue date Feb 27, 2024
- Pixart Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with memory
- Patent number 11,901,210
- Issue date Feb 13, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,881,443
- Issue date Jan 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with single-crystal layers
- Patent number 11,876,011
- Issue date Jan 16, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for producing a 3D semiconductor device and structure with m...
- Patent number 11,862,503
- Issue date Jan 2, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 11,855,009
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,854,857
- Issue date Dec 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and light source driver integrated in a same semicondu...
- Patent number RE49748
- Issue date Dec 5, 2023
- Google LLC
- Cheng-Yi Andrew Lin
Information Patent Grant
3D semiconductor device and structure with bonding
- Patent number 11,830,757
- Issue date Nov 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Grant
Methods for producing a 3D semiconductor device and structure with...
- Patent number 11,804,396
- Issue date Oct 31, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...
- Publication number 20240404866
- Publication date Dec 5, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE WITH A REINFORCING LAYER
- Publication number 20240395731
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE
- Publication number 20240395592
- Publication date Nov 28, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...
- Publication number 20240379502
- Publication date Nov 14, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240379491
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371715
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...
- Publication number 20240363385
- Publication date Oct 31, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240258193
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20240222222
- Publication date Jul 4, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES
- Publication number 20240222218
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...
- Publication number 20240213073
- Publication date Jun 27, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE
- Publication number 20240203825
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Seogwoo HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...
- Publication number 20240178040
- Publication date May 30, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY
- Publication number 20240170319
- Publication date May 23, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMMODATION SPACE WITH SEALED...
- Publication number 20240159873
- Publication date May 16, 2024
- PixArt Imaging Incorporation
- Nientse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20240128165
- Publication date Apr 18, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method for Partial EMI Shielding
- Publication number 20240063137
- Publication date Feb 22, 2024
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20240038607
- Publication date Feb 1, 2024
- STMicroelectronics (Grenoble 2) SAS
- Fanny LAPORTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Sensing External Condition in H...
- Publication number 20240003768
- Publication date Jan 4, 2024
- UTAC Headquarters Pte. Ltd.
- Paweena Phatto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...
- Publication number 20230402438
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME
- Publication number 20230378007
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230343679
- Publication date Oct 26, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230317564
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES
- Publication number 20230307302
- Publication date Sep 28, 2023
- STMicroelectronics LTD
- David GANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230253296
- Publication date Aug 10, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230223365
- Publication date Jul 13, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230197573
- Publication date Jun 22, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with guard ring

Methods for producing a 3D semiconductor memory device and structure

Semiconductor device package and manufacturing method thereof

3D semiconductor device and structure with single-crystal layers

Semiconductor package and method of manufacturing semiconductor pac...

3D semiconductor device and structure with metal layers and memory...

Methods for producing a 3D semiconductor device and structure with...

Package structure having lid with protrusion and manufacturing meth...

Manufacturable devices formed on gallium and nitrogen material

3D semiconductor device and structure with metal layers and a conne...

3D semiconductor device and structure with bonding and DRAM memory...

Methods for producing a 3D semiconductor device and structure with...

Semiconductor package

Semiconductor package structure and method for forming the same

Lid attach process and dispenser head

Heat dissipation sheet, manufacturing method of heat dissipation sh...

3DIC packaging with hot spot thermal management features

3D semiconductor device and structure with bonding

Proximity sensor including enclosed accommodation space with sealed...

Thermal interface material having different thicknesses in packages

3D semiconductor device and structure with memory

Wearable device with combined sensing capabilities

3D semiconductor device and structure with metal layers and a conne...

3D semiconductor device and structure with single-crystal layers

Method for producing a 3D semiconductor device and structure with m...

Chip package with lid

Methods for producing a 3D semiconductor device and structure with...

Image sensor and light source driver integrated in a same semicondu...

3D semiconductor device and structure with bonding

Methods for producing a 3D semiconductor device and structure with...

Patents Applicationslast 30 patents

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY CELLS AND MULTIPL...

ELECTRONIC DEVICE WITH A REINFORCING LAYER

METHODS FOR PRODUCING A 3D SEMICONDUCTOR MEMORY DEVICE AND STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH THREE LEVELS AND ISOLATI...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND MEMORY...

METHOD FOR FORMING SEMICONDUCTOR PACKAGE STRUCTURE

EMBEDDED LIQUID COOLING

3DIC PACKAGING WITH HOT SPOT THERMAL MANAGEMENT FEATURES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH BONDING AND DRAM MEMORY...

SEMICONDUCTOR DEVICE WITH TWO-PHASE COOLING STRUCTURE

METHODS FOR PRODUCING A 3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH MEMORY

PROXIMITY SENSOR INCLUDING ENCLOSED ACCOMMODATION SPACE WITH SEALED...

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

Semiconductor Device and Method for Partial EMI Shielding

INTEGRATED CIRCUIT PACKAGE

Semiconductor Device and Method for Sensing External Condition in H...

DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING...

PACKAGE ASSEMBLY LID AND METHODS FOR FORMING THE SAME

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE WITH GAS RELEASE HOLES

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...