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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3205Shape

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 12,165,986
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for integration of biological chips
- Patent number 12,128,377
- Issue date Oct 29, 2024
- MGI Tech Co., Ltd.
- Liang Wang
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,119,337
- Issue date Oct 15, 2024
- Kioxia Corporation
- Junichi Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with integrated decoupling and alignment features
- Patent number 12,113,028
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,100,635
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Sanghoon Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with multiple gap-filling layers and fabrica...
- Patent number 12,057,363
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,973
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Soohyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded body and method for manufacturing same
- Patent number 12,030,125
- Issue date Jul 9, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive member and display device including the same
- Patent number 12,015,007
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hong Am Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including non-conductive film and method for...
- Patent number 12,015,005
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 11,955,449
- Issue date Apr 9, 2024
- Samsung Electronics Co, Ltd.
- Jihwan Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a semiconductor arrangement
- Patent number 11,955,450
- Issue date Apr 9, 2024
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring designs supporting efficient die to die routing
- Patent number 11,862,481
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material flow control for reduced die-to-die spacing in s...
- Patent number 11,854,945
- Issue date Dec 26, 2023
- Tahoe Research, LTD.
- Omkar G. Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device
- Patent number 11,817,467
- Issue date Nov 14, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshihiro Makita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding structures and semiconductor devices including the same
- Patent number 11,804,462
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,791,447
- Issue date Oct 17, 2023
- Samsung Display Co., Ltd.
- Hyun Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,791,314
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seoeun Kyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Methods for establishing thermal joints between heat spreaders or l...
- Patent number 11,776,868
- Issue date Oct 3, 2023
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bond tips and related apparatus and methods
- Patent number 11,705,425
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Benjamin L. McClain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,705,423
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
- Patent number 11,688,659
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yoshiaki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having second connector that overlaps a part o...
- Patent number 11,688,711
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Yoshiharu Takada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20240421114
- Publication date Dec 19, 2024
- Mitsubishi Electric Corporation
- Norikazu SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240387469
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...
- Publication number 20240347407
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321808
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuki MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321815
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...
- Publication number 20240297141
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Yeongbeom KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297150
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240282713
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240250035
- Publication date Jul 25, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Se Hwan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING
- Publication number 20240222216
- Publication date Jul 4, 2024
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240203927
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Satoshi TSUKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240186277
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Jinwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLICING DISPLAY PANEL
- Publication number 20240170465
- Publication date May 23, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Hejing Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170440
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Hwanyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240162195
- Publication date May 16, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240162402
- Publication date May 16, 2024
- AUO Corporation
- Chia-Hui Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20240120306
- Publication date Apr 11, 2024
- UNITED MICROELECTRONICS CORP.
- Kai-Kuang Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105562
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Taira Tabakoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20240096648
- Publication date Mar 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240088086
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Masatoshi ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POLYMER LAYER
- Publication number 20240071976
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240071951
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...
- Publication number 20240071963
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yun Ting Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055413
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055338
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Byungho KIM
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package using cavity substrate and manufacturing methods

Semiconductor package structure having interposer substrate, and st...

System and method for integration of biological chips

Method of manufacturing a semiconductor device

Semiconductor device with integrated decoupling and alignment features

Semiconductor package and method of fabricating the same

Packages with multiple types of underfill and method forming the same

Non-conductive film sheet and semiconductor package including the same

Chip package structure with multiple gap-filling layers and fabrica...

Semiconductor package

Bonded body and method for manufacturing same

Electronic device and display device using the same

Adhesive member and display device including the same

Semiconductor package including non-conductive film and method for...

Package

Stacked semiconductor package

Electronic device

Method for producing a semiconductor arrangement

Seal ring designs supporting efficient die to die routing

Underfill material flow control for reduced die-to-die spacing in s...

Solid-state imaging device and electronic device

Hybrid bonding structures and semiconductor devices including the same

Display device

Semiconductor packages

Light emitting diode display with redundancy scheme

Methods for establishing thermal joints between heat spreaders or l...

Thermocompression bond tips and related apparatus and methods

Package structure

Method for manufacturing a semiconductor device having a semiconduc...

Semiconductor device having second connector that overlaps a part o...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES

METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR...

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

PATTERNED SHEET MUF FOR COMPLEX PACKAGES AND METHODS OF PRODUCING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SPLICING DISPLAY PANEL

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE

Seal Ring Designs Supporting Efficient Die to Die Routing

SEMICONDUCTOR DEVICE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR DEVICE WITH A POLYMER LAYER

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE