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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85345Shape

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Patents Grantslast 30 patents

Information Patent Grant
Circular bond finger pad
- Patent number 12,021,063
- Issue date Jun 25, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,872,877
- Issue date Dec 22, 2020
- Mitsubishi Electric Corporation
- Erubi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnections for semiconductor devices and methods f...
- Patent number 10,643,966
- Issue date May 5, 2020
- Samsung Electronics Co., Ltd.
- Hyosung Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink printed wire bonding
- Patent number 10,483,238
- Issue date Nov 19, 2019
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit assembly method
- Patent number 10,177,056
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a hermetic module to an electrode array
- Patent number 9,984,994
- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Off substrate kinking of bond wire
- Patent number 9,893,033
- Issue date Feb 13, 2018
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Repackaged integrated circuit and assembly method
- Patent number 9,870,968
- Issue date Jan 16, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ink printed wire bonding
- Patent number 9,859,256
- Issue date Jan 2, 2018
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming an electronic device including a ball bond
- Patent number 9,812,424
- Issue date Nov 7, 2017
- Semiconductor Components Industries, LLC
- Harold G. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 9,576,921
- Issue date Feb 21, 2017
- Renesas Electronics Corporation
- Akira Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device including applying u...
- Patent number 9,508,678
- Issue date Nov 29, 2016
- Renesas Electronics Corporation
- Naoki Kawanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding apparatus and method of manufacturing semiconductor de...
- Patent number 9,368,471
- Issue date Jun 14, 2016
- Shinkawa Ltd.
- Shinichi Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method employing two scrub settings
- Patent number 9,337,167
- Issue date May 10, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,263,418
- Issue date Feb 16, 2016
- Kabushiki Kaisha Toshiba
- Nobutaka Kasuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper ball bond interface structure and formation
- Patent number 9,257,403
- Issue date Feb 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the wafer-level integration of shape memory alloy wires
- Patent number 9,054,224
- Issue date Jun 9, 2015
- Senseair AB
- Stefan Braun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,040,358
- Issue date May 26, 2015
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,384,229
- Issue date Feb 26, 2013
- Renesas Electronics Corporation
- Kazuya Fukuhara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-locking wire bond structure and method of making the same
- Patent number 7,073,702
- Issue date Jul 11, 2006
- International Business Machines Corporation
- John A Fitzsimmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roughened bonding pad and bonding wire surfaces for low pressure wi...
- Patent number 7,015,580
- Issue date Mar 21, 2006
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230260952
- Publication date Aug 17, 2023
- Mitsubishi Electric Corporation
- Hideki YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING
- Publication number 20230110402
- Publication date Apr 13, 2023
- NXP USA, Inc.
- YOU GE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...
- Publication number 20220336402
- Publication date Oct 20, 2022
- Mitsubishi Electric Corporation
- Haruko HITOMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR BOND FINGER PAD
- Publication number 20220238488
- Publication date Jul 28, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20180331064
- Publication date Nov 15, 2018
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INK PRINTED WIRE BONDING
- Publication number 20180114778
- Publication date Apr 26, 2018
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repackaged integrated circuit assembly method
- Publication number 20180005910
- Publication date Jan 4, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME
- Publication number 20170179074
- Publication date Jun 22, 2017
- Semiconductor Components Industries, LLC
- Harold G. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...
- Publication number 20170179065
- Publication date Jun 22, 2017
- Samsung Electronics Co., Ltd.
- Hyosung KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
BONDING APPARATUS AND BONDING TOOL CLEANING METHOD
- Publication number 20160351536
- Publication date Dec 1, 2016
- SHINKAWA LTD.
- Toru Maeda
- B08 - CLEANING
Information Patent Application
OFF SUBSTRATE KINKING OF BOND WIRE
- Publication number 20160225739
- Publication date Aug 4, 2016
- Invensas Corporation
- Belgacem Haba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Repackaged integrated circuit and assembly method
- Publication number 20160225686
- Publication date Aug 4, 2016
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20160163666
- Publication date Jun 9, 2016
- Renesas Electronics Corporation
- Akira YAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISH FOR WIREBONDING
- Publication number 20150380376
- Publication date Dec 31, 2015
- VARUGHESE MATHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS
- Publication number 20150279810
- Publication date Oct 1, 2015
- Boh Kid Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20150262969
- Publication date Sep 17, 2015
- KABUSHIKI KAISHA TOSHIBA
- Nobutaka KASUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20150243627
- Publication date Aug 27, 2015
- SHINKAWA LTD.
- Shinichi AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Device
- Publication number 20150228618
- Publication date Aug 13, 2015
- RENESAS ELECTRONICS CORPORATION
- Naoki KAWANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Stitch Bond Having Strengthened Heel
- Publication number 20150187729
- Publication date Jul 2, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Jiun Wai Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH INSULATED WIRES FOR ROUTING POWER SI...
- Publication number 20150162269
- Publication date Jun 11, 2015
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Ball Bond Interface Structure and Formation
- Publication number 20150145148
- Publication date May 28, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Tu-Anh N. Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140363926
- Publication date Dec 11, 2014
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES
- Publication number 20130292856
- Publication date Nov 7, 2013
- SENSEAIR AB
- Stefan Braun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130171776
- Publication date Jul 4, 2013
- RENESAS ELECTRONICS CORPORATION
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110101544
- Publication date May 5, 2011
- Renesas Electronics Corporation
- Kazuya FUKUHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Roughened bonding pad and bonding wire surfaces for low pressure wi...
- Publication number 20050112861
- Publication date May 26, 2005
- International Business Machines Corporation
- John A. Fitzsimmons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-locking wire bond structure and method of making the same
- Publication number 20050082347
- Publication date Apr 21, 2005
- International Business Machines Corporation
- John A Fitzsimmons
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circular bond finger pad

Method of manufacturing semiconductor device

Electrical interconnections for semiconductor devices and methods f...

Ink printed wire bonding

Repackaged integrated circuit assembly method

Method for bonding a hermetic module to an electrode array

Off substrate kinking of bond wire

Repackaged integrated circuit and assembly method

Ink printed wire bonding

Process of forming an electronic device including a ball bond

Semiconductor device and manufacturing method for the same

Method of manufacturing a semiconductor device including applying u...

Wire-bonding apparatus and method of manufacturing semiconductor de...

Wire bonding method employing two scrub settings

Semiconductor device and manufacturing method thereof

Copper ball bond interface structure and formation

Method for the wafer-level integration of shape memory alloy wires

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Self-locking wire bond structure and method of making the same

Roughened bonding pad and bonding wire surfaces for low pressure wi...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PACKAGING

SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUF...

CIRCULAR BOND FINGER PAD

ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...

INK PRINTED WIRE BONDING

Repackaged integrated circuit assembly method

ELECTRONIC DEVICES AND PROCESS OF FORMING THE SAME

ELECTRICAL INTERCONNECTIONS FOR SEMICONDUCTOR DEVICES AND METHODS F...

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

BONDING APPARATUS AND BONDING TOOL CLEANING METHOD

OFF SUBSTRATE KINKING OF BOND WIRE

Repackaged integrated circuit and assembly method

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SURFACE FINISH FOR WIREBONDING

WIRE BONDING METHOD EMPLOYING TWO SCRUB SETTINGS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WIRE-BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DE...

Method of Manufacturing Semiconductor Device

Wire Stitch Bond Having Strengthened Heel

SEMICONDUCTOR DIE PACKAGE WITH INSULATED WIRES FOR ROUTING POWER SI...

Copper Ball Bond Interface Structure and Formation

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Roughened bonding pad and bonding wire surfaces for low pressure wi...

Self-locking wire bond structure and method of making the same