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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84345Shape

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a contact clip with a contact region ha...
- Patent number 11,869,865
- Issue date Jan 9, 2024
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a semiconductor wafer, semiconductor wafer, c...
- Patent number 11,756,917
- Issue date Sep 12, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,735,505
- Issue date Aug 22, 2023
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating circuit components in matrix batches
- Patent number 11,521,862
- Issue date Dec 6, 2022
- Chih-liang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,088,105
- Issue date Aug 10, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,037,863
- Issue date Jun 15, 2021
- Kabushiki Kaisha Toshiba
- Hidetoshi Kuraya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid top terminal for discrete power devices
- Patent number 10,872,846
- Issue date Dec 22, 2020
- RENESAS ELECTRONICS AMERICA INC.
- Jean Claude Harel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,658,274
- Issue date May 19, 2020
- Nexperia B.V.
- Tim Boettcher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package component with jumper structure
- Patent number 10,312,183
- Issue date Jun 4, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package component with jumper structure and manufacturing metho...
- Patent number 10,297,535
- Issue date May 21, 2019
- Taiwan Semiconductor Co., Ltd.
- Reyn Qin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE
- Publication number 20230411336
- Publication date Dec 21, 2023
- Infineon Technologies Austria AG
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
- Publication number 20230326901
- Publication date Oct 12, 2023
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...
- Publication number 20210358877
- Publication date Nov 18, 2021
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...
- Publication number 20210305198
- Publication date Sep 30, 2021
- Carsten von Koblinski
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having a contact clip with a contact region ha...

Method for processing a semiconductor wafer, semiconductor wafer, c...

Semiconductor device

Process for fabricating circuit components in matrix batches

Semiconductor device and method for fabricating a semiconductor device

Semiconductor device

Solid top terminal for discrete power devices

Electronic device

Die package component with jumper structure

Die package component with jumper structure and manufacturing metho...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER, CLIP AND SEMICONDUCTOR DEVICE

CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION

SEMICONDUCTOR DEVICE HAVING A CONTACT CLIP WITH A CONTACT REGION HA...

METHOD FOR PROCESSING A SEMICONDUCTOR WAFER, SEMICONDUCTOR WAFER, C...