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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 12,154,814
- Issue date Nov 26, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long-life extended temperature range embedded diode design for elec...
- Patent number 11,869,794
- Issue date Jan 9, 2024
- Lam Research Corporation
- Siyuan Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module with laser-welded leadframe
- Patent number 11,749,633
- Issue date Sep 5, 2023
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a lead frame including die paddles and...
- Patent number 11,688,671
- Issue date Jun 27, 2023
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL, LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of leads between MOSFET chips
- Patent number 11,594,476
- Issue date Feb 28, 2023
- Kabushiki Kaisha Toshiba
- Tatsuya Ohguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,557,564
- Issue date Jan 17, 2023
- Shindengen Electric Manufacturing Co., Ltd.
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, method of manufacturing connector, and method of...
- Patent number 11,437,340
- Issue date Sep 6, 2022
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 11,201,101
- Issue date Dec 14, 2021
- Shindengen Electric Manufacturing Co., Ltd.
- Norio Takatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including low side field-effect transistors a...
- Patent number 11,094,617
- Issue date Aug 17, 2021
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with temperature detecting element
- Patent number 10,580,754
- Issue date Mar 3, 2020
- Mitsubishi Electric Corporation
- Shinya Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and clip each having sinterable, solidified paste for conne...
- Patent number 10,347,566
- Issue date Jul 9, 2019
- Heraeus Deutschland GmbH & Co. KG
- Michael Benedikt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and preparation method thereof
- Patent number 9,837,386
- Issue date Dec 5, 2017
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electric power semiconductor device
- Patent number 9,433,075
- Issue date Aug 30, 2016
- Mitsubishi Electric Corporation
- Junji Fujino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molding material and method for packaging semiconductor chips
- Patent number 9,209,152
- Issue date Dec 8, 2015
- Infineon Technologies AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module including a discrete device mounted on a DCB substrate
- Patent number 9,147,637
- Issue date Sep 29, 2015
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally efficient integrated circuit package
- Patent number 8,716,830
- Issue date May 6, 2014
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250057
- Publication date Jul 25, 2024
- JMJ Korea Co., Ltd.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...
- Publication number 20240136214
- Publication date Apr 25, 2024
- LAM RESEARCH CORPORATION
- Siyuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240120309
- Publication date Apr 11, 2024
- INFINEON TECHNOLOGIES AG
- Oliver Kreiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE
- Publication number 20230352422
- Publication date Nov 2, 2023
- Infineon Technologies Austria AG
- Hwee Yin Low
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Module with Laser-Welded Leadframe
- Publication number 20220406745
- Publication date Dec 22, 2022
- Hitachi Energy Switzerland AG
- Niko Pavlicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP INTERCONNECT WITH MICRO CONTACT HEADS
- Publication number 20220181290
- Publication date Jun 9, 2022
- Semiconductor Components Industries, LLC
- Emmanuel Silvestre RAMOS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220084917
- Publication date Mar 17, 2022
- Kabushiki Kaisha Toshiba
- Tatsuya Ohguro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...
- Publication number 20220068691
- Publication date Mar 3, 2022
- LAM RESEARCH CORPORATION
- Siyuan TIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20210343630
- Publication date Nov 4, 2021
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210217721
- Publication date Jul 15, 2021
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGES
- Publication number 20210043549
- Publication date Feb 11, 2021
- INFINEON TECHNOLOGIES AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20200411422
- Publication date Dec 31, 2020
- Alpha and Omega Semiconductor (Cayman), Ltd
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20200381335
- Publication date Dec 3, 2020
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Norio TAKATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND PREPARATION METHOD THEREOF
- Publication number 20170200705
- Publication date Jul 13, 2017
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CARRIER AND CLIP EACH HAVING SINTERABLE, SOLIDIFIED PASTE FOR CONNE...
- Publication number 20170117209
- Publication date Apr 27, 2017
- Heraeus Deutschland GmbH & Co. KG
- Michael BENEDIKT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molding Material and Method for Packaging Semiconductor Chips
- Publication number 20140312497
- Publication date Oct 23, 2014
- INFINEON TECHNOLOGIES AG
- Kok Chai Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module Including a Discrete Device Mounted on a DCB Substrate
- Publication number 20130161801
- Publication date Jun 27, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE
- Publication number 20130127008
- Publication date May 23, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Long-life extended temperature range embedded diode design for elec...

Long-life extended temperature range embedded diode design for elec...

Power semiconductor module with laser-welded leadframe

Semiconductor package having a lead frame including die paddles and...

Plurality of leads between MOSFET chips

Semiconductor device

Electronic module, method of manufacturing connector, and method of...

Electronic component

Semiconductor package including low side field-effect transistors a...

Semiconductor module with temperature detecting element

Carrier and clip each having sinterable, solidified paste for conne...

Power device and preparation method thereof

Electric power semiconductor device

Molding material and method for packaging semiconductor chips

Module including a discrete device mounted on a DCB substrate

Thermally efficient integrated circuit package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...

POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE

Power Semiconductor Module with Laser-Welded Leadframe

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

SEMICONDUCTOR DEVICE

LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELEC...

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE

CLIPS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

ELECTRONIC COMPONENT

POWER DEVICE AND PREPARATION METHOD THEREOF

CARRIER AND CLIP EACH HAVING SINTERABLE, SOLIDIFIED PASTE FOR CONNE...

Molding Material and Method for Packaging Semiconductor Chips

Module Including a Discrete Device Mounted on a DCB Substrate

THERMALLY EFFICIENT INTEGRATED CIRCUIT PACKAGE